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プリンテッドエレクトロニクス・有機エレクトロニクス・フレキシブルエレクトロニクスの世界市場:成長予測・参入企業・市場機会の分析

Flexible, Printed and Organic Electronics 2019-2029: Forecasts, Players & Opportunities

発行 IDTechEx Ltd. 商品コード 233490
出版日 ページ情報 英文 404 Pages
納期: 即日から翌営業日
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本日の銀行送金レート: 1USD=114.65円で換算しております。
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プリンテッドエレクトロニクス・有機エレクトロニクス・フレキシブルエレクトロニクスの世界市場:成長予測・参入企業・市場機会の分析 Flexible, Printed and Organic Electronics 2019-2029: Forecasts, Players & Opportunities
出版日: 2018年10月18日 ページ情報: 英文 404 Pages
概要

プリンテッド・フレキシブル・有機エレクトロニクスの市場は2018年の317億ドルから、2029年には773億ドルの規模に成長すると予測されています。

当レポートでは、世界のプリンテッドエレクトロニクス・有機エレクトロニクス・フレキシブルエレクトロニクスの市場を調査し、市場の定義、主要技術の概要、バリューチェーンおよびアンメットニーズ、市場の潜在性・収益性の分析、主な技術区分別の概要、技術開発動向、主要製品、用途・利用事例、主要参入事業者、市場規模の推移と予測、将来の展望、主要企業のプロファイルなどをまとめています。

第1章 エグゼクティブサマリー・総論

  • サマリー
  • 定義
  • 主要技術の概要
  • 市場の潜在性・収益性
  • 現在の市場規模
  • 総市場の予測:コンポーネント別
  • バリューチェーン・アンメットニーズ
  • 市場参入戦略、など

第2章 プリンテッドエレクトロニクス:市場成長推進因子

第3章 導電性インク

  • 導電性インクオプション
  • 導電性インク・ペースト
  • Agナノインクの特徴
  • 導電性インク/ペースト・PTF:主要サプライヤー
  • ナノ粒子導電性インク/ペースト:主要サプライヤー
  • 市場予測
  • PV分野における導電性インク
  • タッチスクリーン市場
  • 自動車産業:利用事例の拡大
  • 単純回路のプリント
  • 構造エレクトロニクス
  • 3Dアンテナ
  • インモールドエレクトロニクス (IME)
  • 新しいインク要件
  • インモールドエレクトロニクス (IME):ケーススタディ
  • 3Dプリンテッドエレクトロニクス
  • Eテキスタイル用伸縮性インク
  • コンフォーマルEMIシールディング
  • その他の用途
  • 企業プロファイル、など

第4章 ディスプレイ

  • ディスプレイ
  • OLEDディスプレイ
    • 成長推進因子
    • 産業の発展の推移
    • 製品の例
    • 市場予測
    • ケーススタディ
    • フレキシブルAMOLEDディスプレイの主要コンポーネント
    • ロードマップ
    • 折り畳みディスプレイ
    • OLEDの印刷
    • 主要企業
  • 電気泳動・その他の双安定ディスプレイ
    • 市場動向・技術動向
    • 市場予測
  • エレクトロクロミックディスプレイ
    • 市場動向・技術動向
    • 市場予測
  • ACエレクトロルミネセンスディスプレイ
    • 市場動向・技術動向
    • 市場予測
  • サーモクロミックディスプレイ
  • フレキシブルLCDs
  • 企業プロファイル、など

第5章 LED・OLED照明

  • OLED照明
    • 提供価値
    • 課題
    • コスト
    • 技術の発展
    • バリューチェーン
    • 市場予測
  • プリンテッドLED照明、など

第6章 太陽光発電

  • 技術の比較
  • 効率:電池・モジュール
  • 結晶シリコンPVの印刷
  • 薄膜太陽光発電
  • 提供価値
  • アモルファスシリコン
  • CdTe・CIGS
  • DSSC
  • 有機PV (OPV)
  • OPV:一般的なデバイスアーキテクチャ
  • 有機PVの例
  • 商業化の課題
  • ケーススタディ
  • ペロブスカイト
  • 市場動向・予測
  • 企業プロファイル、など

第7章 プリント&フレキシブルバッテリー

  • 各種用途
  • ロードマップ
  • 参入企業
  • 技術の比較・ベンチマーキング
  • 市場予測
  • 企業プロファイル、など

第8章 センサー

  • 定義・メリット
  • バイオセンサー
  • 静電容量型センサー
  • 力センサー (ピエゾ抵抗)
  • 力センサー・ハプティクス (圧電・強誘電体)
  • 温度・湿度センサー
  • プリンテッドガスセンサー
  • プリンテッド・有機光検出器/イメージセンサー、など

第9章 ロジック・システム

  • フレキシブル/プリンテッドトランジスタ回路の各種タイプ
  • 半導体の選択肢
  • 金属酸化物半導体
  • 有機半導体
  • オールプリンテッドTFT
  • カーボンナノチューブ&グラフェントランジスタ
  • ディスプレイ・センサー用TFTアクティブマトリックス (AM) アレイ
  • フレキシブルディスプレイ向けTFT技術
  • 有機TFTの課題
  • フレキシブルLCD
  • 有機LCD
  • 次世代X線センサー
  • 有機TFTのメリット
  • フレキシブル指紋センサー
  • 市場予測
  • 企業プロファイル、など

第10章 プリンティング技術・硬化・焼結・システムアセンブリー

  • プリンティング技術
  • 硬化・焼結
  • システムアセンブリー、など

第11章 企業プロファイル

目次

This report provides the most comprehensive view of the printed, organic and flexible electronics industry, giving detailed ten year forecasts by device type along with assessment of the trends, capabilities and market successes (and failures). The market is analyzed by each key component type in addition to assessing the market value by printed vs non printed, rigid vs flexible and much more.

Impartial assessment

In the report IDTechEx Research appraises each enabling technology component by virtue of its market need - not technology push. We draw on over fifteen years of knowledge tracking this sector on a global scale which culminates in this report providing detailed, refined forecasts, strategic positioning and assessment of trends, "hot topics" and unmet opportunities. Coverage of the technology is without hype - critically assessing the technology capabilities and genuine opportunities with realistic outlook based on our leading market insight.

Report Structure

The report is based on extensive primary interviews with suppliers across the value chain (including materials supply, equipment providers, component makers and system integrators), through to end user / OEM interviews to understand the user requirements. Research has been conducted globally based on our extensive contact database of the industry.

Each of the key enabling components are covered in turn in this report, being:

  • Conductors (used in a wide range of applications with growth from In Mold Electronics, e-textiles, RF shielding and much more)
  • Logic and memory (growth areas include smart packaging)
  • OLED displays (growth areas being on-plastic and foldable OLEDs)
  • OLED lighting (addressing niche premium priced applications versus the incumbent LED lighting)
  • Electrophoretic and other bistable displays (growth in electronic shelf labels while color versions of information signs are improved)
  • Electrochromic displays (new products for smart packaging and smart labels)
  • Electroluminescent displays (in steady decline)
  • Other displays
  • Batteries (with companies focussing on electronic skin patches and other wearables)
  • Photovoltaics (with focus on building integrated PV and new technologies including perovskite PV)
  • Sensors (nine types are analyzed)

For each of the above sectors, the report covers:

  • Latest technical progress
  • Current and emerging applications
  • Market size - now and forecast through to 2029
  • Trends, challenges and opportunities
  • Key players and profiles of players

In addition, the report includes assessment of the application of printed, organic and flexible electronics to different industries specifically including automotive & transportation, consumer electronics, consumer goods, wearable electronics and others.

The value chain, go to market strategies and case studies of success and failure are given. This widely referenced IDTechEx report brings it all together, with particular focus on applications and quantative assessment of opportunities.

Market sizing

IDTechEx Research finds that the total market for printed, flexible and organic electronics will grow from $31.7 Billion in 2018 to $77.3 billion in 2029. The majority of that is OLEDs (organic but not mainly made by printing); printed biosensors; and printed conductive ink (used for a wide range of applications, but predominately PV). On the other hand, stretchable electronics, logic and memory, flexible batteries and capacitive sensors are much smaller segments but with strong growth potential.

A snapshot of the printed, organic and flexible electronics industry is shown below (labels and legend purposely removed)

image1

For each component ten year forecasts to 2029 are provided, with a breakdown of printed vs printed and rigid vs flexible.

image2

Company Profiles

IDTechEx Research continuously monitors hundreds of companies in this field, with the primary research used as a basis of the report. In addition, the report includes detailed profiles of over 50 companies.

If you are looking to understand the big picture, the opportunity, the problems you can address, or how you can start to use these technologies and the implications involved, this report is a must-buy. Researched by multilingual IDTechEx analysts and experts based eight countries in four continents, this report builds on 15 years of research of the industry.

Analyst access from IDTechEx

All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.

Table of Contents

1. EXECUTIVE SUMMARY AND CONCLUSIONS

  • 1.1. Summary
  • 1.2. Definitions
  • 1.3. Description and analysis of the main technology components of printed, flexible and organic electronics
  • 1.4. Market potential and profitability
  • 1.5. Current market size
  • 1.6. Total Market Size by Component 2018-2029
  • 1.7. Total Market Size by Component 2018-2029
  • 1.8. Printed versus non-printed electronics
  • 1.9. Market Size for Printed Electronics Components and Materials 2018-2029
  • 1.10. Market Size for Printed Electronics Components and Materials 2018-2029
  • 1.11. Total market value of printed versus non-printed electronics 2018-2029
  • 1.12. Findings on printed versus non-printed electronics
  • 1.13. Flexible/conformal versus rigid electronics
  • 1.14. Key components needed for flexible AMOLED displays
  • 1.15. Market size of Flexible/ Conformation Electronics 2018-2029
  • 1.16. Market size of Flexible/ Conformation Electronics 2018-2029
  • 1.17. Market value of flexible/conformal versus rigid electronics chart and table
  • 1.18. Market by territory
  • 1.19. The value chain and unmet needs
  • 1.20. The Value Chain: Printed, Flexible & Organic Electronics
  • 1.21. The value chain is unbalanced
  • 1.22. Go to Market Strategies
  • 1.23. Strategy 2: Replace or do something simple in existing electronics/ electrics
  • 1.24. Strategy 3: Creating New Markets
  • 1.25. What end users want - results from end user surveys
  • 1.26. More companies are moving downstream to offer complete products
  • 1.27. Hybrid Electronics

2. MARKET DRIVERS FOR PRINTED ELECTRONICS

  • 2.1. What is Printed, Flexible, Organic Electronics?
  • 2.2. Printed, organic and flexible electronics value
  • 2.3. Features that are associated with Printed Electronics
  • 2.4. Giant industries collaborate for the first time
  • 2.5. Recent Investments
  • 2.6. Printed electronics in the retail industry
  • 2.7. Printed electronics in healthcare
  • 2.8. Printed electronics in wearable technology
  • 2.9. Printed electronics in vehicles
  • 2.10. Printed electronics in consumer electronics, IoT, etc.

3. CONDUCTIVE INKS

  • 3.1. Conductive Ink Options
  • 3.2. Conductive inks and pastes
  • 3.3. Characteristics of Ag nano inks
  • 3.4. Flake versus nanoparticle inks
  • 3.5. Explanation of conductive ink forecasts
  • 3.6. Conductive Inks/Pastes, Polymer Thick Film (PTF): Key Suppliers
  • 3.7. Nano particle conductive Inks/Pastes: Key Suppliers
  • 3.8. Conductive Ink 2019 Market by Application $ millions
  • 3.9. Conductive inks forecasts 2018-2029 $ millions
  • 3.10. Conductive Ink in Photovoltaics
  • 3.11. Silver consumption per PV wafer greatly improves
  • 3.12. Touch screen market
  • 3.13. Touch screen edge electrodes: getting finer
  • 3.14. Automotive industry: Increasing use cases
  • 3.15. Simple Circuit Printing
  • 3.16. Structural Electronics
  • 3.17. 3D antennas
  • 3.18. In-Mold Electronics (IME)
  • 3.19. In-Mold Electronics (IME) Process and Examples
  • 3.20. In-Mold Electronic Process
  • 3.21. Comments on IME requirements
  • 3.22. New ink requirements: stretchability
  • 3.23. New ink requirements: portfolio approach
  • 3.24. General application areas for IME
  • 3.25. In-Mold Electronics (IME) Case Studies
  • 3.26. Automotive: direct heating of headlamp plastic covers
  • 3.27. 3D printed electronics
  • 3.28. Why 3D Printed Electronics?
  • 3.29. Stretchable inks for E-Textiles
  • 3.30. Conformal EMI shielding
  • 3.31. Other Conductive Ink Applications
  • 3.32. Conductive Ink Summary
  • 3.33. Company profiles related to this chapter

4. DISPLAYS

  • 4.1. Displays
    • 4.1.1. Market drivers
    • 4.1.2. New and established display technologies compared
  • 4.2. OLED Displays
    • 4.2.1. OLED displays
    • 4.2.2. Why choose OLED over LCD?
    • 4.2.3. Drivers for Display Innovation: OLED Displays
    • 4.2.4. Evolution of the OLED industry
    • 4.2.5. Examples of OLED products
    • 4.2.6. Global OLED Production Capacity
    • 4.2.7. OLED Display Market 2017-2018 by Value and SQ Meters
    • 4.2.8. OLED market forecasts 2019-2029 $ Millions
    • 4.2.9. OLED Display Forecasts 2019-2029 Area (sqm) by Form Factor (Rigid versus Flexible)
    • 4.2.10. OLED Display Forecasts 2019-2029, Panel Numbers by Form Factor (Rigid versus Flexible)
    • 4.2.11. First step towards flexible: OLED on plastic substrate
    • 4.2.12. The rise of plastic and flexible AMOLED
    • 4.2.13. Case study: the Apple Watch
    • 4.2.14. Case study: Motorola shatterproof screen
    • 4.2.15. Key components needed for flexible AMOLED displays
    • 4.2.16. Roadmap towards flexible AMOLED displays and flexible electronics devices
    • 4.2.17. When will foldable displays take off?
    • 4.2.18. Nubia to launch the first foldable display in 2018? Samsung and Huawei hot on their heels
    • 4.2.19. Printing OLEDs
    • 4.2.20. Inkjet Printing Organic Materials for Thin Film Encapsulation of OLEDs
    • 4.2.21. Printed OLEDs: Printing RGB materials
    • 4.2.22. Inkjet printing: is it worth it?
    • 4.2.23. R G B inkjet printing in displays
    • 4.2.24. Printed OLED Displays: Key Players
    • 4.2.25. Inkjet printed AMOLED finally commercial?
    • 4.2.26. Printed OLED TVs
    • 4.2.27. JOLED: First Commercial Printed OLED Display
    • 4.2.28. JOLED Printed OLED Strategy
    • 4.2.29. UDC: Organic vapour jet printing
    • 4.2.30. Fraunhofer IAP'S ESJET printing
  • 4.3. Electrophoretic and other bi-stable displays
    • 4.3.1. Electrophoretic and other bi-stable displays
    • 4.3.2. Electrophoretic e-readers decline - what's next?
    • 4.3.3. The Holy Grail: Color E-paper Displays
    • 4.3.4. New color display from E Ink without filters
    • 4.3.5. Signage
    • 4.3.6. E-Paper Revenues
    • 4.3.7. The early years of flexible E-ink displays
    • 4.3.8. Flexible EPD suppliers in 2018
    • 4.3.9. New players in Reflective BiStable Displays
    • 4.3.10. Electrowetting displays
    • 4.3.11. Electrowetting displays: Liquavista
    • 4.3.12. Electrowetting displays: Etulipa
    • 4.3.13. Electrophoretic and Bi-Stable displays Market Forecasts 2018-2029 $ millions
  • 4.4. Electrochromic displays
    • 4.4.1. Electrochromic displays
    • 4.4.2. Ynvisible Electrochromic Displays
    • 4.4.3. Electrochromic displays market forecasts 2018-2029
  • 4.5. AC Electroluminescent displays
    • 4.5.1. AC Electroluminescent displays
    • 4.5.2. AC electroluminescent displays
    • 4.5.3. EL technology
    • 4.5.4. AC Electroluminescent (EL) Displays
    • 4.5.5. Electroluminescent displays market forecasts 2018-2029 $ millions
  • 4.6. Thermochromic displays
    • 4.6.1. Thermochromic Displays
  • 4.7. Flexible LCDs
    • 4.7.1. Flexible LCDs from FlexEnable
    • 4.7.2. Flexible LCDs: Conclusions
    • 4.7.3. Company profiles related to this chapter

5. LED AND OLED LIGHTING

  • 5.1. OLED Lighting
    • 5.1.1. Value proposition of OLED vs LED lighting
    • 5.1.2. OLED lighting: solid-state, efficient, cold, surface emission, flexible......?
    • 5.1.3. OLED Lighting Status
    • 5.1.4. Cost challenge set by the incumbent (inorganic LED)
    • 5.1.5. Comparing OLED and LED lighting
    • 5.1.6. OLED Lighting is more challenging than OLED displays in terms of lifetime and light intensity requirements
    • 5.1.7. OLED lighting - cost projection
    • 5.1.8. Market announcements
    • 5.1.9. Technology progress
    • 5.1.10. OLED Lighting - market penetration
    • 5.1.11. OLED lighting value chain
    • 5.1.12. S2S Lines: OLEDWorks in Aachen (ex-Philips line)
    • 5.1.13. S2S lines: LG display: Gen-2 and Gen 5
    • 5.1.14. R2R line: Konica Minolta
    • 5.1.15. But why is it so difficult to reduce cost??
    • 5.1.16. OLED Lighting Market Forecast
    • 5.1.17. OLED Lighting Market Forecast 2018-2029 $ millions
  • 5.2. Printed LED lighting
    • 5.2.1. Printed LED lighting
    • 5.2.2. Nth Degree - Printed LEDs

6. PHOTOVOLTAICS

  • 6.1. Introduction to photovoltaic technologies
  • 6.2. Comparison of photovoltaic technologies
  • 6.3. Efficiencies of Different Solar Technologies: Cells and Modules
  • 6.4. Printing in crystalline silicon PV
  • 6.5. Thin film photovoltaics
  • 6.6. Value propositions-beyond conventional silicon
  • 6.7. Amorphous silicon
  • 6.8. CdTe and CIGS
  • 6.9. DSSCs
  • 6.10. Organic PV (OPV)
  • 6.11. OPV: Typical device architectures
  • 6.12. R2R solution vs R2R evaporation
  • 6.13. OPV Progress
  • 6.14. Solution Processed 17.5% tandem OPV (Aug 2018)
  • 6.15. Examples of Organic PV
  • 6.16. OPV installations
  • 6.17. Challenges Commercializing Organic PV
  • 6.18. Case Studies of Success and Failure in OPV
  • 6.19. Latest progress update
  • 6.20. Perovskites
  • 6.21. Research-cell efficiencies of different solar technologies
  • 6.22. Perovskite structure
  • 6.23. Working principle
  • 6.24. Evolution of Perovskite Development
  • 6.25. Structures/architectures of perovskite solar cells
  • 6.26. Perovskite solar cell evolution
  • 6.27. Perovskite PV Commercial Opportunity
  • 6.28. Perovskite PV Applications and Challenges
  • 6.29. The Achilles' Heel
  • 6.30. Efforts to overcome challenges
  • 6.31. Overview
  • 6.32. Pilot-scale capacity
  • 6.33. Large scale roll-to-roll printed perovskite solar cells
  • 6.34. Microquanta Semiconductor
  • 6.35. Unique features are required where silicon PVs cannot provide
  • 6.36. Application roadmap of perovskite photovoltaics
  • 6.37. Market trends and forecasts
  • 6.38. Company profiles related to this chapter
  • 6.39. Perovskite Photovoltaics 2018-2028

7. PRINTED, FLEXIBLE BATTERIES

  • 7.1. Introduction to batteries
  • 7.2. Comparison of Power Options
  • 7.3. Applications
  • 7.4. Applications of printed batteries
  • 7.5. Skin Patches
  • 7.6. Application market roadmap
  • 7.7. Printed battery technologies: Zn Based
  • 7.8. Zinc-based printed batteries
  • 7.9. Printed battery technologies: Li-ion Based
  • 7.10. Printed battery layout
  • 7.11. Component options of printed batteries
  • 7.12. Typical construction and reaction of printed disposable battery
  • 7.13. Players in printed battery industry
  • 7.14. Rechargeable ZincPolyTM from Imprint Energy
  • 7.15. Screen printed secondary zinc/nickel hydride batteries
  • 7.16. Technology comparison and benchmarking
  • 7.17. Technology benchmarking
  • 7.18. Status of flexible batteries
  • 7.19. Flexible and Printed Batteries 2019-2029 Market Value by Chemistry type $ millions
  • 7.20. Flexible and Printed Batteries Market by Application in 2019 and 2029 $ millions
  • 7.21. Company profiles related to this chapter

8. SENSORS

  • 8.1. Definitions and benefits
    • 8.1.1. Definitions
    • 8.1.2. Main benefits of printed sensors
    • 8.1.3. Types of sensors that can be printed
    • 8.1.4. Market Maturity by Sensor Type
    • 8.1.5. Printed and Flexible Sensor Market by Sensor type, 2019 $ millions
    • 8.1.6. Printed and Flexible Sensor Market Forecast 2018-2029 $ Millions
  • 8.2. BioSensors
    • 8.2.1. Biosensors: Printed glucose test strips
    • 8.2.2. Anatomy of a test strip: one example
    • 8.2.3. Manufacturing steps of Lifescan Ultra
    • 8.2.4. Profitability in the test strip industry is falling
    • 8.2.5. Big four test strip manufacturers are changing to counter decreasing profitability
    • 8.2.6. Diabetes management device roadmap: Glucose sensors
    • 8.2.7. Test strips: A Billion Dollar market but in decline
    • 8.2.8. Focus shifts from test strips to CGM
    • 8.2.9. Glucose sensors for diabetes management: players
    • 8.2.10. ECG (or similar) electrodes
    • 8.2.11. Printed, flexible sweat sensor
  • 8.3. Capacitive Sensors (including Transparent Conductive Films TCFs)
    • 8.3.1. Capacitive Sensors
    • 8.3.2. Printed Transparent Conductive Films (TCFs)
    • 8.3.3. Metal mesh: hybrid
    • 8.3.4. Metal mesh using screen printing
    • 8.3.5. Metal mesh using gravure offset printing
    • 8.3.6. Toray's photocurable screen printed paste for fine line metal mesh
    • 8.3.7. Metal mesh with inkjet printing
    • 8.3.8. Metal mesh: print seed layer and plate?
    • 8.3.9. Silver nanowires: roll to roll formation using printing
    • 8.3.10. Capacitive sensors on films
    • 8.3.11. In-Mold Electronics: expanding material toolkit
    • 8.3.12. IME PEDOT touch surfaces
    • 8.3.13. Capacitive pressure/force sensor
    • 8.3.14. Fluid level sensor
    • 8.3.15. Printed capacitive stretch sensors
    • 8.3.16. Applications: Strain sensor
    • 8.3.17. Applications: haptic actuator
    • 8.3.18. Printed capacitive stretch sensors: applications
  • 8.4. Force Sensors (Piezoresistive)
    • 8.4.1. Force sensing resistors (Piezoresistors)
    • 8.4.2. Printed piezoresistive sensor
    • 8.4.3. Materials
    • 8.4.4. Previous applications of FSR
    • 8.4.5. Sensors module: press buttons and large area sensors
    • 8.4.6. Emerging applications
  • 8.5. Force Sensors and Haptics (Piezoelectric and Ferroelectric)
    • 8.5.1. Ferroelectric & Piezoelectric Sensors and Actuators
    • 8.5.2. PVDF-based polymer options for sensing and haptic actuators
    • 8.5.3. Low temperature inks
    • 8.5.4. Applications: Touch sensing on metal
    • 8.5.5. Joanneum Research: Pyzoflex
    • 8.5.6. Applications: Skin conformable sensor
    • 8.5.7. Applications: Loudspeaker
    • 8.5.8. Applications: Haptic actuators
    • 8.5.9. Example application: Haptic gloves
  • 8.6. Temperature and humidity sensors
    • 8.6.1. Printed temperature sensors
    • 8.6.2. InFlect thermistor
    • 8.6.3. Printed thermistors enable new designs
    • 8.6.4. Humidity sensor with carbon nanotubes
    • 8.6.5. Application to biometric sensing
    • 8.6.6. Wireless humidity sensors
  • 8.7. Printed Gas Sensors
    • 8.7.1. Printed metal oxide gas sensors
    • 8.7.2. Electrochemical gas sensor
    • 8.7.3. Printed electrochemical gas sensors
  • 8.8. Printed, Organic Photodetectors / Image Sensors
    • 8.8.1. Printed organic photodetectors
    • 8.8.2. Printed organic photodetectors
    • 8.8.3. Which wavelength can be detected?
    • 8.8.4. First production line for OPD
    • 8.8.5. What can you do with organic photodetectors?
    • 8.8.6. Applications and prototypes
    • 8.8.7. Large area image sensors
    • 8.8.8. Applications of large area image sensors
    • 8.8.9. Company profiles related to this chapter

9. LOGIC AND SYSTEMS

  • 9.1. Types of Flexible or Printed Transistor Circuits
  • 9.2. Why Print TFTs?
  • 9.3. Semiconductor Choices Compared
  • 9.4. But challenges persist...
  • 9.5. Semiconductor choices
  • 9.6. Incumbent TFT technologies- silicon based
  • 9.7. Metal Oxide Semiconductors
  • 9.8. Metal Oxide production process
  • 9.9. IGZO enables large sized OLED TVs
  • 9.10. IGZO enables large sized OLED TVs
  • 9.11. But can Metal Oxide Semiconductors be printed?
  • 9.12. Evonik's solution processible metal oxide
  • 9.13. Latest progress with iXensic
  • 9.14. Temperatures well below 350C
  • 9.15. And even at room temperature with deep UV annealing
  • 9.16. Organic semiconductors
  • 9.17. OTFT Mobility hype: reality check
  • 9.18. All printed TFTs
  • 9.19. All printed TFTs
  • 9.20. JAPERA all printed TFT
  • 9.21. S2S automatic printed OTFT
  • 9.22. Roll-to-roll printed organic TFTs
  • 9.23. Merck's Organic TFT
  • 9.24. Carbon nanotubes and graphene transistors
  • 9.25. TFT Active Matrix (AM) arrays for displays and sensors
  • 9.26. Three TFT technologies for flexible displays
  • 9.27. TFT technologies for flexible displays
  • 9.28. Challenges with Organic TFTs
  • 9.29. AM electrophoretic display backplanes
  • 9.30. Flexible LCDs
  • 9.31. Organic LCD (FlexEnable)
  • 9.32. JDI
  • 9.33. Flexible LCDs: Conclusions
  • 9.34. Use of TFT arrays in X-ray detectors
  • 9.35. Next generation X-ray sensors: flexible
  • 9.36. Advantage of organic TFT
  • 9.37. Flexible fingerprint sensors
  • 9.38. Other sensors with flexible TFTs: electronic skin
  • 9.39. Flexible or printed transistors for logic, creating smart systems
  • 9.40. Mediocre TFTs can do many functions
  • 9.41. Current work in developing flexible transistor RFID and Smart Packaging
  • 9.42. IMEC / Holst Centre Roadmap
  • 9.43. Benefits of flexible logic
  • 9.44. Logic Based Systems
  • 9.45. Lessons from the Silicon Chip: need for modularity
  • 9.46. Thin, flexible 'NFC' ICs come to market for simple wireless barcodes
  • 9.47. Logic and Smart System Forecast 2018-2029 $ millions
  • 9.48. Company profiles related to this chapter

10. PRINTING TECHNOLOGIES, CURING, SINTERING AND SYSTEM ASSEMBLY

  • 10.1. Printing Technologies
    • 10.1.1. Value Chain for Printing in Electronics
    • 10.1.2. Screen Printing Dominates in Commercial Devices
    • 10.1.3. Screen Printing
    • 10.1.4. Inkjet Printing
    • 10.1.5. Aerosol Jet
    • 10.1.6. Flexo Printing
    • 10.1.7. Gravure Printing
    • 10.1.8. Slot Die Coating
    • 10.1.9. Main parameters to cosnider when printing functional ink
    • 10.1.10. Printing Technique Comparison
    • 10.1.11. Printed Performance Characteristics
  • 10.2. Curing / Sintering
    • 10.2.1. Integral part of the layer deposition process: Drying and curing of printed layers
    • 10.2.2. Principle of Vertical Ovens
    • 10.2.3. Curing profiles of traditional pastes
    • 10.2.4. Performance levels
    • 10.2.5. Pulse of light: Photo-sintering
    • 10.2.6. Photo-sintering
  • 10.3. System Assembly
    • 10.3.1. Design Options for Printed Electronics
    • 10.3.2. Component Attach Options
    • 10.3.3. Component Attach Example
    • 10.3.4. System Encapsulation
    • 10.3.5. Automation for Manufacture
    • 10.3.6. Roll to Roll Assembly

11. COMPANY PROFILES

  • 11.1. ACREO
  • 11.2. Agfa
  • 11.3. Alta devices
  • 11.4. Applied materials
  • 11.5. Armor
  • 11.6. BASF
  • 11.7. Bebop
  • 11.8. Blue Spark
  • 11.9. Botfactory
  • 11.10. CDT/Sumitomo Chemical
  • 11.11. Ceradrop
  • 11.12. Clariant
  • 11.13. Clearink
  • 11.14. Coatema
  • 11.15. CPI
  • 11.16. Dupont
  • 11.17. E Ink
  • 11.18. Enfucell
  • 11.19. Fujifilm
  • 11.20. Heliatek
  • 11.21. Henkel
  • 11.22. Hereaus
  • 11.23. Imprint
  • 11.24. Interlink
  • 11.25. Isorg
  • 11.26. Jenax
  • 11.27. Kateeva
  • 11.28. Molex
  • 11.29. Merck group
  • 11.30. Meyer Burger
  • 11.31. Nagase
  • 11.32. Notion Systems
  • 11.33. Novacentrix
  • 11.34. NRC
  • 11.35. Optomec
  • 11.36. Oxford PV
  • 11.37. PARC
  • 11.38. Plastic Logic GmbH
  • 11.39. PragmatIC
  • 11.40. PST sensors
  • 11.41. Royole
  • 11.42. Smartkem
  • 11.43. Sun Chemical
  • 11.44. Tactotek
  • 11.45. Tangio
  • 11.46. Thinfilm electronics
  • 11.47. Ubiquitous energy
  • 11.48. Voltera
  • 11.49. VTT
  • 11.50. XTPL
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