市場調査レポート

MEMSマイクロホン:世界の技術・産業・市場分析アップデート

MEMS Microphones - A Global Technology, Industry and Market Analysis Update

発行 Innovative Research and Products (iRAP) 商品コード 53922
出版日 ページ情報 英文 113 Pages
納期: 即日から翌営業日
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MEMSマイクロホン:世界の技術・産業・市場分析アップデート MEMS Microphones - A Global Technology, Industry and Market Analysis Update
出版日: 2013年01月01日 ページ情報: 英文 113 Pages
概要

世界のMEMSマイクロホン市場は2012年に4億4,200万米ドルに達し、今後は年平均成長率15.4%で成長し、2017年までに8億6,500万米ドルに増加すると予測されています。製品セグメント別では、携帯電話が2012年における最大の市場シェアを占め、ノートPC/タブレットおよびカムコーダー/デジカムが続いています。地域別では北米が25.3%で2012年における最大の市場シェアを獲得し、次いで欧州の19.7%、日本の15.7%、その他地域は39.5%となっています。MEMSマイクロホンは2017年までに携帯電話市場の92%、PDAの95%、デジカム・カムコーダー市場のそれぞれ55%から57%に浸透する見込みです。

当レポートでは、世界のMEMSマイク市場をアプリケーション・技術・地域別に予測し、技術概要、ファブリケーションプロセス、MEMSマイクの構成、産業構造、競合環境などもまとめ、概略下記の構成でお届けいたします。

第1章 イントロダクション

第2章 エグゼクティブサマリー

第3章 産業概要

  • 産業概要
  • MEMSマイクロホン
    • チップ
    • MEMSのメリット
    • MEMSマイクロホンアプリケーション・市場
    • ノートPC
    • 自動車用ハンズフリー通信システム
    • 通信システム
    • 補聴器
    • 産業構造
    • 産業力学・世界市場
    • 技術別の市場
    • マイクロホン用1チップCMOS-MEMS技術
    • マイクロホン用2チップ技術
    • アプリケーション別の市場

第4章 技術概要

  • 技術概要
  • マイクロホンの種類・特徴
    • 音声マイクロホン
    • コンデンサーマイクロホン
    • 単向性・全方向性マイクロホン
    • MEMSマイクロホン
  • マイクロホンの種類
    • 容量性マイクロホン
    • ピエゾ抵抗マイクロホン
    • 圧電マイクロホン
    • 光マイクロホン
    • FETマイクロホン
  • 典型的な製造プロセス
    • MEMSマイクロホンの製造
    • エッチング経由のウェハー製造
    • MEMSマイクロホンにおけるドライエッチング
    • MEMSマイクロホンにおけるウェットエッチング
    • MEMSおよび統合回路製造プロセスにおける比較
  • パッケージング
    • 製造:ICチッププロセスによるMEMSマイクロホンのメリット
    • ICチップ製造の原理に基づいた製造
    • MEMSマイクロホンにおける電子チップ統合
  • MEMSマイクロホンの構造
    • ダイヤフラム
    • エアギャップ
    • MEMSマイクロホンの特徴
    • 現在MEMSマイクロホンで用いられている材料
    • 製造技術
    • 表面活性

第5章 産業構造・市場

  • 産業構造・市場
    • 競合的な革新の動向
    • 提携・統合

第6章 特許・特許分析

  • 特許・特許分析
  • 特許分析

第7章 企業プロファイル

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目次
Product Code: ET-118

Silicon microphones are among a broad range of devices known as micro-electromechanical systems (MEMS), an emerging field in which various sensors and mechanical devices are constructed on a single wafer using processes developed for making integrated circuits (ICs). The chief advantage of micromachining silicon microphones is cost. Several sensors can be processed on a chip simultaneously and can be integrated with passive and active electronic devices.

One of the most notable differences between a MEMS microphone and an electret condenser microphone (ECM) is the difference in size. The back plate and diaphragm in a MEMS microphone are approximately 10x smaller than those in the smallest ECM. This inherent small size allows a packaged MEMS microphone to start at approximately the same size as the smallest ECM, with the potential to shrink much further as MEMS microphone technology matures. A smaller microphone consumes less printed circuit board (PCB) space and requires smaller height allowances, making it ideal for space-constrained designs

MEMS microphones are more compact than traditional microphone systems because they capture sound and convert it to a digital signal on the same chip. When sound waves hit the microphone's membrane - a thin metal mesh in the middle of the chip - it vibrates, producing a voltage that contains information about the analog sound signal. But since the analog signal is produced and converted to a digital signal on the same chip, it never has to experience the harsh electromagnetic environment outside the circuit. Further, because interference is less of an issue, insulation is not needed. This allows engineers to place the microphone anywhere that a chip can fit, for example, into a laptop in which multiple microphones can even fit in the bezel surrounding a laptop's monitor.

MEMS microphone solutions developed on the CMOS (complimentary metal oxide semiconductors) MEMS platform frees consumer electronic device designers and manufacturers from many of the problems associated with ECMs. CMOS MEMS microphones integrate an analogue-to-digital converter on the chip, creating a microphone with a robust digital output. Since the majority of portable applications will ultimately convert the analogue output of the microphone to a digital signal for processing, the system architecture can be made completely digital, removing noise-prone analogue signals from the circuit board and simplifying the overall design.

When electronic circuitry is fabricated within microns of the acoustic structure, the short trace lengths lead to an inherently improved ability to mitigate RF noise. The CMOS MEMS microphone has a very short diaphragm-to-preamp distance and better input-to output-isolation due to the on-chip amplification stage, as opposed to the FET in an ECM. Since there is better power supply and output signal isolation, as well as a shorter distance between the diaphragm and the preamplifier, there is less chance of coupling EM fields into the microphone.

Many of these new ‘miniature’ silicon microphones for consumer and computer communication devices are approximately one-half the size and operate on just one-third the power of conventional microphones.

STUDY GOALS AND OBJECTIVES

CMOS MEMS microphones also solve many of the mechanical design and manufacturing challenges associated with using an ECM. First, the monolithic nature of the CMOS MEMS microphone enables a footprint and height that can be less than half that of a traditional ECM. Second, the small size and mass of the CMOS MEMS microphone diaphragm, which has a diameter of less than 0.5mm, leads to improved vibration immunity as compared with an ECM, which has a diaphragm diameter of 4mm-6mm. Third, since CMOS MEMS microphones are fabricated using standard CMOS materials and processes, they are inherently able to withstand the high temperatures required for surface mounting. Therefore, no mechanical interconnect is required, which leads to another significant reduction in overall height of the microphone system. Finally, the surface-mount and pick-and-place compatibility of the CMOS silicon microphone reduces cost by eliminating manual assembly, thereby improving reliability, manufacturing throughput and yield.

Therefore, this study focuses on MEMS microphones that can be used in mobile phones, digital cameras, camcorders, laptops, automotive hands-free calling and hearing aids. Production will be low-cost and high-volume.

This study focuses on providing market data about the size and growth of the MEMS microphones application segments, new developments including a detailed patent analysis, company profiles and industry trends. This report also provides a detailed and comprehensive multi-client study of the market in North America, Europe, Japan, and the rest of the world (ROW) for MEMS microphones and potential business opportunities.

The objectives include thorough coverage of the underlying economic issues driving the MEMS microphones business, as well as assessments of new advanced MEMS microphones that are being developed. Another important objective is to provide realistic market data and forecasts for MEMS microphones.

REASONS FOR DOING THE STUDY

Most microphones in consumer electronics (CE) products today are based on technology that has remained fundamentally unchanged for 50 years. Problems with the ECMs include noise, size and manual assembly.

The main challenge for the audio system designer is to achieve the lowest overall noise in the system design. The noise of an ECM has several sources: electrical noise resulting from fluctuations in the bias voltage, noise of the field effect transistor (FET), board noise, acoustic self-noise of the diaphragm, and external electromagnetic (EM) and radio frequency (RF) fields that are coupled into the high impedance input of the FET.

The MEMS microphone exhibits many qualities that make it ideal for integrated microphone array applications in laptop and desktop computers. Most importantly, the robust digital output is immune to the EM or RF interference that can prohibit optimal acoustic placement of a standard analog-output microphone in a laptop computer. The small footprint and thinness also increase the flexibility of the microphone placement.

The widespread availability of well maintained CMOS models and simulation tools results in products that can go from design to prototype in a matter of weeks. Leveraging the economies of scale, high quality and maturity of the semiconductor industry, CMOS MEMS provides cost-effective solutions that can be incorporated into mobile phones, digital devices and automotive accessories. iRAP did a detailed market study in 2007. Since then, numerous changes have happened, with several new applications emerging for MEMS microphones. The market has grown from over hundred million ranges in 2007 to almost half a billion dollar range now.

Therefore, iRAP conducted a detailed market research and industry analysis in this area and has produced this detailed technology and market update as well as industry analysis in this report.

CONTRIBUTIONS OF THE STUDY

This study segmented markets into six applications for MEMS microphone products. The first application consists of mobile phones; the second is laptops tablets; the third is camcorders and digicams; the forth is hearing aids; the fifth is headphones and the last is automotive hands-free calling. Manufacturers of MEMS microphones expect competition to persist and intensify in the future from a number of different sources.

The study is intended to benefit the existing manufacturers of mobile phones, digital cameras, camcorders, laptops, automobile hands-free calling devices and hearing aids, who seek to expand revenues and market opportunities through adding new technology such as MEMS microphones, which are positioned to become a preferred solution over conventional ECM applications. This study also will benefit existing manufacturers of microphones as well as manufacturers of microphones who deal with new types of MEMS technology for mobile phones, digital cameras, camcorders, laptops, automobile hands-free calling and hearing aids.

This report provides the most thorough and up-to-date assessment that can be found anywhere on the subject. The study also provides extensive quantification of the many important facets of market developments in MEMS microphones all over the world. This, in turn, contributes to the determination of what kinds of strategic responses companies may adopt in order to compete in this dynamic market.

The iRAP study focuses on MEMS microphones' market size and growth, new developments, including a detailed patent analysis, company profiles and industry trends. Another contribution of this report is to provide a detailed and comprehensive study of the market in North America, Europe, Japan and the rest of the world (ROW) for MEMS microphones and potential future business opportunities. These markets have also been estimated according to types of integration, i.e. single chip vs two-chip; and according to the application segments.

SCOPE AND FORMAT

The market data contained in this report quantifies opportunities for MEMS microphones. In addition to product types, it also covers the many issues concerning the merits and future prospects of the MEMS microphone business, including corporate strategies, information technologies, and the means for providing these highly advanced products and service offerings. It also covers in detail the economic and technological issues regarded by many as critical to the industry's current state of change. The report provides a review of the MEMS microphones industry and its structure, and the many companies involved in providing these products. The competitive position of the main players in the MEMS microphones market and the strategic options they face are also discussed, as well as such competitive factors as marketing, distribution and operations.

REPORT SUMMARY

Six major applications are discussed in this report, which will create most of the market for MEMS microphones over the next five years. These are mobile phones, laptops and tablets, camcorders and digicams, hearing aids, head phones and automotive hands-free calling.

Manufacturers of MEMS microphones expect competition to persist and intensify in the future from a number of different sources. Microphones are facing competition in a new, rapidly evolving and highly competitive sector of the audio communication market. Increased competition could result in reduced prices and gross margins for microphone products and could require increased spending by research and development, sales and marketing and customer support.

Micro-machined microphone chips can match and extend the performance of existing devices, for instance, by using sensor arrays. Silicon microphones also offer advantages to the OEM in the form of improved manufacturing methods (reliability, yield, assembly cost) combined with robustness. They also offer additional functionality, such as the ability to incorporate multiple microphones into portable electronic devices for noise suppression and beam forming.

The potential for smaller footprint components and resistance to electromagnetic interference also supports new cell phone designs. Moreover, MEMS microphones meet price points set by electret microphones by leveraging established high-volume silicon manufacturing processes. This combination of size, performance and functionality, and low cost are highly desirable for OEMs and consumers alike.

The range of possible applications of these microphones derives from their important advantages as compared to conventional ECM technologies. Based on silicon MEMS technology, the new microphone achieves the same acoustic and electrical properties as conventional microphones, but is more rugged and exhibits higher heat resistance. These properties offer designers of a wide range of products greater flexibility and new opportunities to integrate microphones.

Major findings of this report are:

  • The MEMS microphones market is an attractive, and still growing, multimillion-dollar market characterized by very high production volumes of MEMS microphones that are extremely reliable and low in cost.
  • In 2012, the global market for MEMS microphones has reached $422 million and will increase to $865 million by 2017 with an annual average growth rate of 15.4%.
  • Mobile phones will have the largest share in 2012 followed by laptops/tablets and camcorders/digicams.
  • From 2012 to 2017, the largest growth rate will be for mobile phones - as much as 53% AAGR from 2012 to 2017.
  • Regionally, North America has about 25.3% of the market in 2012, followed by Europe at 19.7%, Japan at 15.7%, and the rest of world (ROW) at 39.5%.
  • By 2017, MEMS microphones will achieve penetrations of 92% in the mobile phone market segment and 95% in PDAs, digicams and camcorders markets, up from 55% and 57%, respectively, in 2012.
  • In terms of technology, the largest share will be for two-chip integration.
  • There are over a dozen players who are sharing the global market in 2012. They are fabless and depend upon a variety of fabrication processes to construct MEMS microphones. By 2017, the number of players is likely to double due to attractive growth potential for the products.

Table of Contents

1. INTRODUCTION

  • INTRODUCTION
  • STUDY GOALS AND OBJECTIVES
  • REASONS FOR DOING THE STUDY
  • CONTRIBUTIONS OF THE STUDY
  • SCOPE AND FORMAT
  • METHODOLOGY
  • INFORMATION SOURCES
  • AUDIENCES FOR THE STUDY
  • AUTHOR'S CREDENTIALS

2. EXECUTIVE SUMMARY

  • EXECUTIVE SUMMARY

3. INDUSTRY OVERVIEW

  • INDUSTRY OVERVIEW
  • BACKGROUND OF MEMS MICROPHONES
  • BACKGROUND OF MEMS MICROPHONES (CONTINUED)
  • MEMS MICROPHONE
  • CHIP
  • MEMS ADVANTAGES
  • MEMS MICROPHONE APPLICATIONS AND MARKETS
  • FIGURE 1: MEMS MICROPHONES MARKET SEGMENTS BY APPLICATION, 2012-2017
  • MOBILE PHONES, PDAS, DIGITAL CAMERAS, CAMCORDERS
  • MOBILE PHONES, PDAS, DIGICAMS, CAMCORDERS (CONTINUED)
  • MOBILE PHONES, PDAS, DIGICAMS, CAMCORDERS (CONTINUED)
  • TABLE 1: FORECAST FOR MEMS MICROPHONES IN MOBILE PHONES AND DIGITAL CAMERAS
  • LAPTOPS
  • LAPTOPS (CONTINUED)
  • TABLE 2: MARKET FOR MEMS MICROPHONES IN LAPTOPS, 2012 AND 2017
  • AUTOMOTIVE HANDS-FREE COMMUNICATION SYSTEMS
  • AUTOMOTIVE HANDS-FREE COMMUNICATION SYSTEMS (CONTINUED)
  • AUTOMOTIVE HANDS-FREE COMMUNICATION SYSTEMS (CONTINUED)
  • AUTOMOTIVE HANDS-FREE COMMUNICATION SYSTEMS (CONTINUED)
  • TABLE 3: FORECASTED USE OF MEMS MICROPHONES IN AUTOMOTIVE HANDS-FREE COMMUNICATION SYSTEMS, 2012 AND 2017
  • HEARING AIDS
  • HEARING AIDS (CONTINUED)
  • TABLE 4: FORECASTED USE OF MEMS MICROPHONES IN HEARING AIDS, INDUSTRY STRUCTURE
  • INDUSTRY STRUCTURE (CONTINUED)
  • TABLE 5: FOUNDRIES WITH MEMS MICROPHONE MANUFACTURING CAPABILITIES IN 2012
  • INDUSTRY DYNAMICS AND GLOBAL MARKET
  • MARKET ACCORDING TO TECHNOLOGY
  • ONE-CHIP CMOS-MEMS TECHNOLOGY FOR MICROPHONES
  • ONE-CHIP CMOS-MEMS TECHNOLOGY FOR MICROPHONES (CONTINUED)
  • ONE-CHIP CMOS-MEMS TECHNOLOGY FOR MICROPHONES (CONTINUED)
  • FIGURE 2: SINGLE-CHIP DESIGN OF MEMS MICROPHONES
  • TWO-CHIP TECHNOLOGY FOR MICROPHONES
  • FIGURE 3: TWO-CHIP DESIGN OF MEMS MICROPHONES
  • TABLE 6: SUMMARY OF GLOBAL MARKET FOR MEMS MICROPHONES BY TECHNOLOGY, 2012 AND 2017
  • FIGURE 4: PERCENTAGE SHARE OF GLOBAL MARKET FOR MEMS MICROPHONES BY TECHNOLOGY, 2012 AND 2017
  • MARKET ACCORDING TO APPLICATIONS
  • TABLE 7: SUMMARY OF GLOBAL MARKET FOR MEMS MICROPHONES BY APPLICATION, 2012 AND 2017
  • FIGURE 5: PERCENTAGE SHARE OF GLOBAL MARKET FOR MEMS MICROPHONES BY APPLICATION, 2012 AND 2017

4. TECHNOLOGY OVERVIEW

  • TECHNOLOGY OVERVIEW
  • MICROPHONE TYPES AND CHARACTERISTICS
  • AUDIO MICROPHONES
  • CONDENSER MICROPHONES
  • UNIDIRECTIONAL AND OMNIDIRECTIONAL MICROPHONES
  • UNIDIRECTIONAL AND OMNI-DIRECTIONAL MICROPHONES (CONTINUED)
  • MEMS MICROPHONES
  • TABLE 8: FORMULAS USED TO DEFINE AUDIO QUALITY/CHARACTERSTICS OF MICS
  • TABLE 8: (CONTINUED)
  • MICROMACHINING TECHNOLOGY
  • TYPES OF MICROPHONES
  • CAPACITIVE MICROPHONES
  • PIEZORESISTIVE MICROPHONES
  • PIEZOELECTRIC MICROPHONES
  • OPTICAL MICROPHONES
  • FET MICROPHONES
  • TYPICAL FABRICATION PROCESSES
  • MEMS MICROPHONE FABRICATION
  • FIGURE 6: PROCESSING STEPS FOR CMOS-MEMS MICROPHONES
  • FIGURE 7: LAYOUT OF SERPENTINE MESH DESIGN SHOWING TWO UNIT CELLS IN A MEMS MICROPHONE
  • TABLE 9: PROCESSES FOLLOWED BY MAJOR PRODUCERS IN FABRICATING MEMS MICROPHONES
  • TABLE 9: (CONTINUED)
  • TABLE 9: (CONTINUED)
  • TABLE 9: (CONTINUED)
  • TABLE 9: (CONTINUED)
  • WAFER FABRICATION VIA ETCHING
  • DRY ETCHING IN MEMS MANUFACTURING
  • DRY ETCHING IN MEMS MICROPHONES (CONTINUED)
  • WET ETCHING IN MEMS MICROPHONES
  • WET ETCHING IN MEMS MICROPHONES (CONTINUED)
  • TABLE 10: KEY TERMINOLOGIES USED IN MANUFACTURING OF MEMS MICROPHONES
  • TABLE 10: KEY TERMINOLOGIES IN MANUFACTURING OF MEMS MICROPHONES (CONTINUED)
  • TABLE 10: KEY TERMINOLOGIES IN MANUFACTURING OF MEMS MICROPHONES (CONTINUED)
  • COMPARING MEMS AND INTEGRATED CIRCUIT FABRICATION PROCESSES
  • COMPARING MEMS AND INTEGRATED CIRCUIT FABRICATION PROCESSES (CONT'D)
  • COMPARING MEMS AND INTEGRATED CIRCUIT FABRICATION PROCESSES (CONT'D)
  • PACKAGING
  • TABLE 11: KEY TERMINOLOGIES USED IN PACKAGING OF MEMS MICROPHONES
  • TABLE 11: KEY TERMINOLOGIES USED IN PACKAGING OF MEMS MICROPHONES (CONTINUED)
  • MANUFACTURING: MEMS MICROPHONE BENEFITS FROM IC CHIP PROCESS
  • MANUFACTURING ON THE PRINCIPLE OF IC CHIP MANUFACTURING (CONTINUED)
  • TABLE 12: TECHNOLOGY USED BY MANUFACTURERS OF SURFACE-MOUNTABLE, CHIP-SIZE PACKAGING FOR MEMS MICROPHONES
  • TABLE 13: CHARACTERISTICS OF COMMERCIALLY AVAILABLE MEMS MICROPHONES
  • ELECTRONIC CHIP INTEGRATION IN MEMS MICROPHONES
  • TABLE 14: KEY TERMINOLOGIES USED TO DEFINE TYPES OF ELECTRONIC CIRCUITS INTEGRATED IN MEMS MICROPHONES
  • MEMS MICROPHONE CONSTRUCTION
  • DIAPHRAGMS
  • AIR GAP
  • CHARACTERISTICS OF MEMS MICROPHONES
  • CURRENT MATERIALS USED IN MEMS MICROPHONES
  • FABRICATION TECHNIQUES
  • FABRICATION TECHNIQUES (CONTINUED)
  • SURFACE ACTIVITY

5. INDUSTRY STRUCTURE AND MARKETS

  • INDUSTRY STRUCTURE AND MARKETS
  • COMPETITIVE INNOVATION TRENDS
  • TABLE 15: COMPANY PRODUCT REFERENCE FOR MEMS MICROPHONES
  • TABLE 16: WORLD MARKET FOR MEMS MICROPHONE MANUFACTURERS
  • PARTNERSHIPS AND CONSOLIDATIONS
  • TABLE 17: ACQUISITIONS AND COLLABORATIONS AMONG MANUFACTURERS OF MEMS MICROPHONES FROM 2000 TO 2012
  • REGIONAL MARKET
  • TABLE 18: SUMMARY OF GLOBAL MARKET FOR MEMS MICROPHONES BY REGION
  • FIGURE 8: REGIONAL PERCENTAGES OF MARKET SHARE FOR MEMS MICROPHONES IN 2012 AND 2017

6. PATENTS AND PATENT ANALYSIS

  • PATENTS AND PATENT ANALYSIS
  • LIST OF PATENTS
  • MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) DEVICE
  • MEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME
  • MEMS MICROPHONE, PRODUCTION METHOD AND METHOD FOR INSTALLING
  • MEMS MICROPHONE WITH SINGLE POLYSILICON FILM
  • COMPONENT COMPRISING A MEMS MICROPHONE AND METHOD FOR THE PRODUCTION OF SAID COMPONENT
  • MICROPHONE WITH BACKSIDE CAVITY THAT IMPEDES BUBBLE FORMATION
  • MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) PACKAGE
  • PACKAGING STRUCTURE AND METHOD OF A MEMS MICROPHONE
  • ELECTRICAL MODULE COMPRISING A MEMS MICROPHONE
  • MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) MICROPHONE AND METHOD OF MANUFACTURING THE SAME
  • MEMS MICROPHONE WITH CAVITY AND METHOD THEREFOR
  • MEMS DEVICE WITH SURFACE HAVING A LOW ROUGHNESS EXPONENT
  • CONDENSER MICROPHONE AND PACKAGING METHOD FOR THE SAME
  • METHOD OF FABRICATING AN ULTRA-SMALL CONDENSER MICROPHONE
  • MICROPHONE WITH REDUCED PARASITIC CAPACITANCE
  • MEMS MICROPHONE PACKAGE WITH RF INSENSITIVE MEMS MICROPHONE CHIP
  • METHOD OF FABRICATING MICRO-ELECTROMECHANICAL SYSTEM MICROPHONE STRUCTURE
  • MEMS DEVICE AND METHOD FOR FABRICATING THE SAME
  • CARD TYPE MEMS MICROPHONE
  • CALIBRATED MICROELECTROMECHANICAL MICROPHONE
  • ALTERNATIVE SENSING CIRCUIT FOR MEMS MICROPHONE AND SENSING METHOD THEREOF
  • METHOD FOR PACKAGING MICRO ELECTROMECHANICAL SYSTEMS MICROPHONE
  • MICROPHONE APPARATUS
  • INTEGRATED AUDIO CODEC WITH SILICON AUDIO TRANSDUCER
  • PACKAGE AND PACKAGING ASSEMBLY OF MICROELECTROMECHANICAL SYSTEM MICROPHONE
  • SYSTEM AND METHOD TO PROVIDE RF SHIELDING FOR A MEMS MICROPHONE PACKAGE
  • SILICON BASED CONDENSER MICROPHONE AND PACKAGING METHOD FOR THE SAME
  • MEMS MICROPHONE PACKAGE AND METHOD THEREOF
  • OPTICAL SENSING IN A DIRECTIONAL MEMS MICROPHONE
  • CHIP-SCALED MEMS MICROPHONE PACKAGE
  • MEMS MICROPHONE MODULE AND METHOD THEREOF
  • LEADFRAME PACKAGE FOR MEMS MICROPHONE ASSEMBLY
  • PACKAGE STRUCTURE OF MEMS MICROPHONE
  • MEMS MICROPHONE WITH A STACKED PCB PACKAGE AND METHOD OF PRODUCING THE SAME
  • MICROELECTROMECHANICAL SYSTEM MICROPHONE FABRICATION INCLUDING SIGNAL PROCESSING CIRCUITRY ON COMMON SUBSTRATE
  • MEMS MICROPHONE
  • INDUCTOR-BASED MEMS MICROPHONE
  • MICROPHONE SYSTEM FOR A COMMUNICATION DEVICE
  • PATENT ANALYSIS
  • TABLE 19: NUMBER OF U.S. PATENTS GRANTED TO COMPANIES MANUFACTURING MEMS MICROPHONES FROM 2007 THROUGH 2012
  • PATENT ANALYSIS ACCORDING TO REGIONS
  • TABLE 20: NUMBER OF U.S. PATENTS GRANTED BY ASSIGNED COUNTRY/REGION FOR MEMS MICROPHONES FROM JAN. 2007 TO 2012
  • FIGURE 9: U.S. PATENTS GRANTED FOR MEMS MICROPHONES BY REGION FROM 2007 TO 2012

7. COMPANY PROFILES

  • COMPANY PROFILES
  • ADVANCED SEMICONDUCTOR ENGINEERING, INC. (ASE GROUP)
  • AKUSTICA, INC.
  • AAC TECHNOLOGIES
  • AMKOR TECHNOLOGY, INC.
  • ANALOG DEVICES, INC.
  • CARNEGIE MELLON UNIVERSITY (CMU)
  • DELPHI TECHNOLOGIES INC
  • EPCOS AG
  • FORTEMEDIA, INC.
  • INFINEON TECHNOLOGIES AG
  • INSTITUTE OF MICROELECTRONICS
  • INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (ITRI)
  • JL WORLD
  • KNOWLES ACOUSTICS
  • MEMES TECHNOLOGY BHD (MEMSTECH)
  • MEMES TECHNOLOGY BHD (CONTINUED)
  • MOTOROLA, INC.
  • NATIONAL SEMICONDUCTOR
  • SAMSUNG ELECTRONICS CO. LTD
  • SONION A/S
  • SYMPHONIX DEVICES, INC./MED-EL
  • THE RESEARCH FOUNDATION OF THE STATE UNIVERSITY OF NEW YORK
  • UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.
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