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市場調査レポート

電子熱管理:技術、材料、デバイス、新規開発、産業構造、世界市場

Electronic Thermal Management - Technologies, Materials, Devices, New Developments, Industry Structure and Global Markets

発行 Innovative Research and Products (iRAP) 商品コード 322275
出版日 ページ情報 英文 206 Pages
納期: 即日から翌営業日
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電子熱管理:技術、材料、デバイス、新規開発、産業構造、世界市場 Electronic Thermal Management - Technologies, Materials, Devices, New Developments, Industry Structure and Global Markets
出版日: 2014年12月31日 ページ情報: 英文 206 Pages
概要

熱管理産業は、電子機器を冷却する総合ソリューションに向かって進んでいます。世界の熱管理製品市場は、2013年の約88億米ドルから、2018年には155億6,000万米ドルまで、CAGRで12.1%の成長が予測されています。

当レポートでは、世界の電子熱管理市場について調査分析し、産業概要、産業構造、技術概要、世界市場、特許、主要企業などについて、体系的な情報を提供しています。

イントロダクション

エグゼクティブサマリー

産業概要

  • 熱管理の概要
  • 産業促進要因
  • 技術
  • 物理的問題
  • 市場概要
  • 産業促進要因と構造

産業構造

  • M&A

技術概要

  • 熱管理
  • 効果的な熱設計
  • 技術特性
  • 電子熱管理材料
  • 高性能熱管理材料
  • 先進的な熱ソリューション

世界の電子熱管理市場

  • 熱管理製品カテゴリーと市場
  • 製品サマリー予測
  • 世界/地域の動向
  • 熱管理の最終用途の動向
  • 産業構造の市場シェア
  • 熱管理ソフトウェア
  • 熱管理インターフェース材料
  • 熱管理サブストレート

特許と特許分析

  • 熱管理における米国の特許活動の概要
  • 特許:熱管理ハードウェア

付録

図表

目次
Product Code: ET-123

"Thermal management" denotes the array of problem-solving design tools and material technologies that systems manufacturers apply to regulate the unwanted heat caused by the normal functioning of an electronic system. Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high conductivity materials.

Dramatic changes are underway in the computer, telecommunications and consumer electronics industries. There is a trend toward systems "convergence," combining computer, telecommunications and consumer system functions all into one system. There is also a trend toward micro-miniaturization and microsystem technologies integrating digital, optical, radio frequency and microelectromechanical systems (MEMS) devices. Microsystem packaging is at the heart of all of these products, since it is this technology that provides the system integration in addition to controlling the size, performance, reliability and cost of the final microsystem.

High-density packaging has been the trend in electronic circuits during the last decade, and that will continue for at least the next five years. In 2013, a typical megaprocessor could pack a staggering 41 million transistors onto a single chip. Running flat out, that chip would dissipate 130 watts of heat - more than a bright household light bulb - from an area the size of a postage stamp.

The trend line of the thermal management industry aligns with the developments of technology in the semiconductor, microprocessor and computer industries. For every advance in performance of these systems, there is a corresponding increase in the operating heat generated by the system. To simply say, however, that demands for thermal management products have increased as the requirements of applications have increased, does not do justice to the unique character of this industry. It is probably more accurate to state that the development of thermal management as an industry is the result of a synergy of solutions constantly engineered to manage excess heat in today's electronic systems.

STUDY GOALS AND OBJECTIVES

The goal of this iRAP report is to provide an up-to-date analysis of recent developments and current trends in the global thermal management marketplace. The identification of significant drivers of revenue growth in specific product categories is an additional aim. The objective of this kind of systematic research is to quantify the projected impact of the forces - from within and from outside - at work on this industry today.

Products in this report have been grouped into four segments - hardware, software, interfaces and substrates. Product sub-segments within the hardware segment include heat sinks, fans and blowers, fan sinks, heat pipes, and cold plates - chosen because they are established technologies and represent revenue markets of significant size. The software segment focuses on modeling and analysis of the thermal characteristics of an electronic system. While the interface product line primarily attaches the heat sink to the system, several other product sub-segments in this technology are being applied to dissipate heat in applications where there is no room for a conventional heat sink. The categories of interfaces covered in this segment are thermal grease, thermal compounds, thermal pads, adhesive films and tapes, and epoxy. Finally, the report looks at substrates, focusing on two emerging package and component level products, thermally enhanced packages and heat spreaders.

Besides targeting the conventional market of thermal management products and solutions related to electronics usage in computers, telecomm, automotive, consumer, medical/office and industrial/military equipment, the report addresses electronics used in new applications such as high-power LEDs, power circuits used in renewal power (wind and solar) stations, high-performance embedded computing (HPEC) working at more than 5GHz frequency, and the growing industrial usage of electronics in laser machining and industrial robots.

The report also briefly discusses recent research work done on cooling solutions to address complex heat issues arising in commercialization of new three-dimensional integrated circuit (3DIC) chips intended for use in computers, tablets, cellular phones, set-top boxes, LCD monitors, digital cameras and video game consoles.

REASONS FOR DOING THE STUDY

Development within the thermal industry is one of the most interesting sub-plots of the rapid innovation in the high-tech area. As the drive to achieve higher levels of device integration while reducing cost, size and complexity continues, the issue of managing heat and power dissipation has become very significant. Economic and market forces also are important factors. Consequently, current trends (market and technology), as well as potential breakthroughs in the near- and long-term future, become very important.

CONTRIBUTIONS OF THE STUDY

The information presented here is for suppliers participating in the thermal management market with a vital interest in the market potential of a specific technology in one of the product segment markets. This study should also be of interest to companies in the electronic materials, software and other industries, that have an interest in the potential of their products in a thermal management application. In addition, because of this report's business focus, it should be of use to executives and business managers as an up-to-the-minute guide to current conditions that are expected to be significant in tomorrow's markets.

FORMAT AND SCOPE

The scope of this report is broad, and covers several product areas. The individual materials, hardware and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issue for a specific product segment, and are projected for five years from 2013 to 2018. The application section features forecasts for the most important applications by product. The technology discussion concentrates on trends that will develop more significantly during the forecast period. The report also includes a discussion on the competitive aspects of each product segment, along with several successful suppliers' strategies in the market. A current industry directory, a survey of U.S. thermal management patents from Jan. 2010 to Jan. 2014, and profiles of a selection of the leading thermal management suppliers are also included.

TO WHOM THE STUDY CATERS

The study will benefit existing and new manufacturers of electronic thermal management products, service providers and solution providers. This study also provides a technical overview of electronic thermal management products, service providers and solution providers, especially recent technology developments and existing barriers. Therefore, audiences for this study include marketing executives, business unit managers and other decision makers working in the area of electronic thermal management, as well as those in companies peripheral to these businesses.

REPORT SUMMARY

The thermal management industry is moving toward comprehensive solutions to cool electronics. As a result, the dynamic in this market has not been one where there is a move toward a single technology or product that replaces others. The tendency is for systems designers to look at the entire problem and evaluate multiple options and combinations for a solution.

There are four main segments in thermal management technologies - hardware, software, interfaces, and substrates.

Components of thermal management pave the way for the electronics industry to develop high-performance applications. This report examines the range of thermal management products and solutions in the market today.

The worldwide market for thermal management products is predicted to grow from about $8.8 billion in 2013 to $15.56 billion by 2018, at an average annual growth rate (CAGR) of 12.1%.

Table of Contents

INTRODUCTION

  • STUDY GOALS AND OBJECTIVES
  • REASONS FOR DOING THE STUDY
  • CONTRIBUTIONS OF THE STUDY
  • SCOPE AND FORMAT
  • METHODOLOGY
  • INFORMATION SOURCES
  • WHOM THE STUDY CATERS TO
  • AUTHOR'S CREDENTIALS

EXECUTIVE SUMMARY

  • SUMMARY TABLE WORLDWIDE REVENUE FOR THE THERMAL MANAGEMENT MARKET, 2013 AND 2018
  • SUMMARY FIGURE WORLDWIDE REVENUES FOR THE THERMAL MANAGEMENT MARKET, 2013 AND 2018

INDUSTRY OVERVIEW

  • AN OVERVIEW OF THERMAL MANAGEMENT
  • INDUSTRY DRIVERS
    • TABLE 1 NEW ELECTRONICS DEVELOPMENTS IMPACTING
    • THERMAL MANAGEMENT PRODUCTS, 2013-2018
    • TABLE 1 NEW ELECTRONICS DEVELOPMENTS IMPACTING
    • THERMAL MANAGEMENT PRODUCTS, 2013-2018 (CONT.)
    • TABLE 1 NEW ELECTRONICS DEVELOPMENTS IMPACTING
    • THERMAL MANAGEMENT PRODUCTS, 2013-2018 (CONT.)
    • TABLE 1 NEW ELECTRONICS DEVELOPMENTS IMPACTING
    • THERMAL MANAGEMENT PRODUCTS, 2013-2018 (CONT.)
  • TECHNOLOGY
  • PHYSICAL ISSUES
    • FIGURE 1 MAJOR CAUSES OF ELECTRONIC FAILURE
  • MARKET OVERVIEW
    • TABLE 2 WORLD THERMAL MANAGEMENT REVENUE ACCORDING
    • TO PRODUCT CATEGORIES, 2013 AND 2018
  • INDUSTRY DRIVERS AND STRUCTURE
  • INDUSTRY DRIVERS AND STRUCTURE (CONT.)
    • FIGURE 2 TECHNOLOGY NEEDS AS A DRIVER FOR THERMAL MANAGEMENT

INDUSTRY STRUCTURE

  • MERGERS AND ACQUISITIONS
  • TABLE 3 MERGERS, ACQUISITIONS AND NEW FUNDINGS IN ELECTRONICS THERMAL MANAGEMENT FROM 2008 THROUGH 2013
  • TABLE 4 RESEARCH ORGANIZATIONS AND COMPANIES ACTIVELY ENGAGED IN ELECTRONIC THERMAL MANAGEMENT IN 2013
  • TABLE 5 LEADING THERMAL CONSULTANTS AND INTEGRATORS

TECHNOLOGY OVERVIEW

  • THERMAL MANAGEMENT
  • EFFECTIVE THERMAL DESIGN FOR ELECTRONIC SYSTEMS
    • CONCEPT DEVELOPMENT PHASE PROCESS AND THERMAL TOOLS
    • DETAILED DESIGN PHASE PROCESS AND THERMAL TOOLS
    • HARDWARE TEST PHASE PROCESS AND THERMAL TOOLS
  • TECHNICAL PROPERTIES
    • TABLE 6 THERMAL PROPERTIES OF MATERIALS
  • ELECTRONIC THERMAL MANAGEMENT MATERIALS
    • COMPOSITES
    • TABLE 7 METAL MATRIX COMPOSITES
    • CERAMICS
    • ALUMINA (Al2O3)
    • ALUMINUM NITRIDE (AlN)
    • SILICON CARBIDE (SiC)
    • ALUMINUM SILICON CARBIDE (AlSiC)
    • BERYLLIUM OXIDE (BeO)
    • OTHER THERMAL MANAGEMENT MATERIALS
    • CONDUCTORS
  • HIGH PERFORMANCE THERMAL MANAGEMENT MATERIALS
  • HIGH PERFORMANCE THERMAL MANAGEMENT MATERIALS (CONT.)
  • ADVANCED THERMAL SOLUTIONS IN PRACTICE IN 2013
    • FIGURE 3 LIQUID COOLING LOOP FOR HIGH PERFORMANCE ELECTRONICS
    • CASE STUDY 1: THERMOELECTRIC COOLERS IN MODULE COOLING ENHANCEMENT
    • CASE STUDY 2: SIGNIFICANCE IN CONTEMPORARY DATA CENTERS
    • CASE STUDY 3: COOLING METHODS FOR INDUSTRIAL ELECTRONICS
    • CASE STUDY 4: HIGH-POWER LEDS
    • CASE STUDY 4: HIGH-POWER LEDS (CONT.)
    • FIGURE 4 TYPICAL USAGE OF FAN-COOLED HEAT SINK IN HIGH-POWER LED ASSEMBLY
    • CASE STUDY 5: WIND POWER GENERATION
    • CASE STUDY 6: SOLAR GRID-CONNECTED PHOTOVOLTAIC (PV) GENERATION

GLOBAL ELECTRONIC THERMAL MANAGEMENT MARKETS

  • THERMAL MANAGEMENT PRODUCT CATEGORIES AND MARKETS
  • PRODUCT SUMMARY FORECASTS
    • TABLE 8 GLOBAL REVENUE BY PRODUCT CATEGORY, 2013
    • AND 2018
    • FIGURE 5 GLOBAL REVENUE BY PRODUCT CATEGORY, 2013
    • AND 2018.
  • GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT
    • TABLE 9 GLOBAL REVENUE BY REGION, 2013 AND 2018
    • FIGURE 6 WORLD THERMAL MANAGEMENT REVENUE BY REGION, 2013 AND 2018
    • NORTH AMERICA
    • EUROPE
    • ASIA/PACIFIC
    • JAPAN
  • THERMAL MANAGEMENT END USE APPLICATION TRENDS AND
    • MARKETS
    • TABLE 10 GLOBAL HARDWARE REVENUE BY APPLICATION, 2013
    • AND 2018
    • FIGURE 7 GLOBAL REVENUE BY APPLICATION, 2013 AND 2018
    • COMPUTERS
    • TABLE 11 GLOBAL REVENUE - COMPUTER APPLICATIONS, 2013
    • AND 2018
    • TELECOM
    • TABLE 12 GLOBAL REVENUE - TELECOM APPLICATIONS, 2013
    • AND 2018
    • Telecom and network industry challenges
    • AUTOMOTIVE INDUSTRY
    • TABLE 13 GLOBAL REVENUE - AUTOMOTIVE APPLICATIONS, 2013
    • AND 2018
    • CONSUMER PRODUCTS
    • CONSUMER PRODUCTS (CONT.)
    • TABLE 14 GLOBAL REVENUE - CONSUMER PRODUCTS, 2013
    • AND 2018
    • MEDICAL/OFFICE EQUIPMENT
    • TABLE 15 GLOBAL REVENUE - MEDICAL/OFFICE APPLICATIONS,
    • 2013 AND 2018
    • INDUSTRIAL/MILITARY EQUIPMENT
    • TABLE 16 GLOBAL REVENUE - INDUSTRIAL/MILITARY
    • APPLICATIONS, 2013 AND 2018
  • INDUSTRY STUCTURE MARKET SHARES
    • THERMAL MANAGEMENT HARDWARE MARKET
    • TABLE 17 GLOBAL HARDWARE REVENUES, 2013 AND 2018
    • Global and regional trends for thermal management hardware
    • TABLE 18 GLOBAL HARDWARE REVENUE BY REGION, 2013
    • AND 2018
    • Thermal management hardware end use application trends
    • TABLE 19 GLOBAL HARDWARE REVENUE BY APPLICATION, 2013
    • AND 2018
    • Thermal management hardware sub-product categories
    • TABLE 20 GLOBAL HARDWARE REVENUE BY SUB-PRODUCTS, 2013
    • AND 2018
    • FIGURE 8 GLOBAL HARDWARE REVENUE BY SUB-PRODUCTS, 2013
    • AND 2018
    • Fans and blowers: overview
    • TABLE 21 FANS AND BLOWERS END USE APPLICATIONS, 2013
    • AND 2018
    • Heat sinks: overview
    • TABLE 22 HEAT SINKS END USE APPLICATIONS, 2013 AND 2018
    • Heat pipes: overview
    • TABLE 23 HEAT PIPES END USE APPLICATIONS, 2013 AND 2018
    • Fan sinks: overview
    • TABLE 24 FAN SINKS END USE APPLICATIONS, 2013 AND 2018
    • Cold plates: overview
    • TABLE 25 COLD PLATES END USE APPLICATIONS, 2013 AND 2018
    • Cold plates: overview (CONT.)
    • Thermoelectric coolers: overview
    • TABLE 26 THERMOELECTRIC COOLERS END USE APPLICATIONS,
    • 2013 AND 2018
    • New developments in hardware
    • FIGURE 9 LIQUID COOLING OF ELECTRONICS SYSTEMS
    • TABLE 27 MAJOR DEVELOPMENTS IN HARDWARE IN
    • ELECTRONICS THERMAL MANAGEMENT PRACTICES
    • TABLE 27 MAJOR DEVELOPMENTS IN HARDWARE IN
    • ELECTRONICS THERMAL MANAGEMENT PRACTICES (CONT.)
    • TABLE 27 MAJOR DEVELOPMENTS IN HARDWARE IN
    • ELECTRONICS THERMAL MANAGEMENT PRACTICES (CONT.)
    • TABLE 27 MAJOR DEVELOPMENTS IN HARDWARE IN
    • ELECTRONICS THERMAL MANAGEMENT PRACTICES (CONT.)
  • THERMAL MANAGEMENT SOFTWARE
    • WORLDWIDE MARKET FORECAST
    • TABLE 28 GLOBAL SOFTWARE REVENUES, 2013 AND 2018
    • THERMAL SOFTWARE MODELING OPTIONS
    • GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT SOFTWARE
    • TABLE 29 SOFTWARE REVENUE BY REGION, 2013 AND 2018
    • THERMAL MANAGEMENT SOFTWARE END USE APPLICATION
    • TRENDS
    • TABLE 30 SOFTWARE REVENUE BY APPLICATION, 2013 AND 2018
    • FIGURE 10 SOFTWARE REVENUE BY APPLICATION, 2013 AND 2018
    • TABLE 31 COMPUTER APPLICATIONS SOFTWARE SHARES,
    • 2013 AND 2018
    • THERMAL MANAGEMENT SOFTWARE SUB-PRODUCT CATEGORIES
    • TABLE 32 SOFTWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018
    • CFD: overview
    • TABLE 33 CFD END USE APPLICATIONS, 2013 AND 2018
    • CHT: overview
    • TABLE 34 CHT END USE APPLICATIONS, 2013 AND 2018.....................
    • Circuit design: overview
    • TABLE 35 CIRCUIT DESIGN END USE APPLICATIONS, 2013 AND 2018
    • Power management: overview
    • TABLE 36 POWER MANAGEMENT END USE APPLICATIONS, 2013
    • AND 2018
    • Other software: overview
    • TABLE 37 OTHER SOFTWARE END USE APPLICATIONS, 2013
    • AND 2018
    • TECHNOLOGY TRENDS IN THERMAL MANAGEMENT SOFTWARE
    • TABLE 38 NEW DEVELOPMENTS IN SOFTWARE RELATED TO ELECTRONIC THERMAL MANAGEMENT
    • SOFTWARE INDUSTRY STRUCTURE AND MARKET SHARES
    • TABLE 39 MARKET SHARES OF MAJOR VENDORS - GLOBAL
    • SOFTWARE MARKET FOR THERMAL MANAGEMENT, 2013
    • FIGURE11 MAJOR VENDORS IN THE GLOBAL THERMAL
    • MANAGEMENT SOFTWARE MARKET, 2013
  • THERMAL MANAGEMENT INTERFACE MATERIALS
    • WORLDWIDE MARKET FORECAST
    • TABLE 40 GLOBAL INTERFACE REVENUES, 2013 AND 2018
    • GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT INTERFACE
    • TABLE 41 INTERFACE REVENUE BY REGION, 2013 AND 2018
    • THERMAL MANAGEMENT INTERFACE END USE APPLICATION
    • TRENDS
    • THERMAL MANAGEMENT INTERFACE END USE APPLICATION
    • TRENDS (CONT.)
    • TABLE 42 GLOBAL INTERFACE REVENUE BY APPLICATION, 2013
    • AND 2018
    • FIGURE 12 GLOBAL INTERFACE REVENUE BY APPLICATION, 2013
    • AND 2018
    • THERMAL MANAGEMENT INTERFACE SUB-PRODUCT
    • CATEGORIES
    • TABLE 43 GLOBAL THERMAL MANAGEMENT INTERFACE
    • REVENUE BY SUB-PRODUCTS, 2013 AND 2018
    • Thermal grease: overview
    • TABLE 44 GLOBAL GREASE END USE APPLICATIONS, 2013
    • AND 2018
    • Thermal compounds: overview
    • TABLE 45 GLOBAL THERMAL COMPOUND END USE
    • APPLICATIONS,2013 AND 2018
    • Thermal pads: overview
    • TABLE 46 GLOBAL THERMAL PADS END USE APPLICATIONS,
    • THROUGH 2018
    • Adhesive film and tape: overview
    • TABLE 47 GLOBAL ADHESIVE FILM AND TAPE END USE
    • APPLICATIONS,2013 AND 2018
    • Epoxy: overview
    • TABLE 48 GLOBAL EPOXY END USE APPLICATIONS, 2013 TO 2018
    • TECHNOLOGY TRENDS IN THERMAL MANAGEMENT INTERFACE
    • TABLE 49 EXAMPLES OF THERMAL INTERFACE PROPERTIES
    • TRENDS IN THERMAL MANAGEMENT INTERFACE
    • TABLE 50 NEW DEVELOPMENTS IN THERMAL INTERFACE
    • MATERIALS RELATED TO ELECTRONIC THERMAL MANAGEMENT
    • IN 2013
    • TIM INDUSTRY STUCTURE AND MARKET SHARES
    • TABLE 51 MARKET SHARES OF MAJOR VENDORS - GLOBAL
    • INTERFACE MARKET, 2013
    • FIGURE 13 TOP VENDORS - GLOBAL INTERFACE MARKET, 2002
  • THERMAL MANAGEMENT SUBSTRATES
    • WORLDWIDE MARKET FORECAST
    • TABLE 52 GLOBAL THERMAL MANAGEMENT SUBSTRATE
    • REVENUES, THROUGH 2018
    • GLOBAL AND REGIONAL TRENDS FOR SUBSTRATE
    • TABLE 53 SUBSTRATE REVENUE BY REGION, 2013 AND 2018
    • SUBSTRATE END USE APPLICATION TRENDS
    • TABLE 54 GLOBAL SUBSTRATE REVENUE BY APPLICATION,
    • THROUGH 2018 ($ MILLIONS)
    • FIGURE 14 GLOBAL SUBSTRATE REVENUE BY APPLICATION,
    • 2013 AND 2018
    • THERMAL MANAGEMENT SUBSTRATE SUB-PRODUCT CATEGORIES
    • TABLE 55 SUBSTRATE REVENUE BY SUB-PRODUCTS,
    • THROUGH 2018
    • Thermally-enhanced packages: overview
    • TABLE 56 GLOBAL THERMALLY-ENHANCED PACKAGES END
    • USE APPLICATIONS, 2013 AND 2018
    • Heat spreader: overview
    • Heat spreader: overview (CONT.)
    • TABLE 57 GLOBAL THERMAL MANAGEMENT HEAT SPREADERS
    • END-USE APPLICATIONS, THROUGH 2008
    • Technology trends in substrates
    • TABLE 58 NEW DEVELOPMENTS IN THERMAL SUBSTRATES
    • MATERIALS RELATED TO ELECTRONIC THERMAL MANAGEMENT
    • IN 2013
    • INDUSTRY STUCTURE MARKET SHARES
    • TABLE 59 MARKET SHARES OF MAJOR VENDORS - GLOBAL
    • SUBSTRATE MARKET, 2013
    • FIGURE 15 MARKET SHARES OF MAJOR VENDORS - GLOBAL SUBSTRATE MARKET, 2013

PATENTS AND PATENT ANALYSIS

  • TABLE 60 NUMBER OF U.S. THERMAL MANAGEMENT PATENTS,
  • 2010-2014
  • OVERVIEW OF U.S. PATENT ACTIVITY IN THERMAL MANAGEMENT
    • TABLE 61 NUMBER OF U.S. ELECTRONIC THERMAL
    • MANAGEMENT PATENTS ASSIGNED BY REGION, FROM
    • JANUARY 2010 THROUGH FEBRUARY 2014
  • PATENTS: THERMAL MANAGEMENT HARDWARE
    • TABLE 62 TOP U.S. ELECTRONIC THERMAL MANAGEMENT
    • HARDWARE PATENT ASSIGNEES, JANUARY 2010 TO
    • FEBRUARY 2014
    • FIGURE 16 TOP U.S. ELECTRONIC THERMAL MANAGEMENT HARDWARE PATENT ASSIGNEES, JANUARY 2010
    • TO FEBRUARY 2014
    • PUMP AND FAN CONTROL CONCEPTS IN A COOLING SYSTEM
    • SEMICONDUCTOR PACKAGE THERMAL TAPE WINDOW
    • FRAME FOR HEAT SINK ATTACHMENT
    • THERMOELECTRIC DEVICES INCLUDING THERMOELECTRIC ELEMENTS HAVING OFF-SET METAL PADS AND RELATED STRUCTURES, METHODS, AND SYSTEMS
    • ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM
    • HANDHELD ELECTRONIC DEVICES
    • COOLING SYSTEMS INCORPORATING HEAT EXCHANGERS AND THERMOELECTRIC LAYERS
    • ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM
    • HANDHELD ELECTRONIC DEVICES
    • HEAT SINK FOR LED LIGHT BULB
    • BONDED METAL AND CERAMIC PLATES FOR THERMAL
    • MANAGEMENT OF OPTICAL AND ELECTRONIC DEVICES
    • HEAT SINK BASE PLATE WITH HEAT PIPE
    • MICROHEAT EXCHANGER FOR LASER DIODE COOLING
    • DEVICE AND METHODOLOGY FOR THE REMOVAL OF HEAT
    • FROM AN EQUIPMENT RACK BY MEANS OF HEAT EXCHANGERS
    • MOUNTED TO A DOOR
    • SYSTEMS AND ASSOCIATED METHODS FOR CONTROLLABLY
    • COOLING COMPUTER COMPONENTS
    • CLAMP-TYPE HEAT SINK FOR MEMORY
    • METHODS OF FORMING EMBEDDED THERMOELECTRIC
    • COOLERS WITH ADJACENT THERMALLY CONDUCTIVE FIELDS
    • HOLISTIC THERMAL MANAGEMENT SYSTEM FOR A
    • SEMICONDUCTOR CHIP
    • HEAT SINK FOR MEMORY AND MEMORY DEVICE HAVING
    • HEAT SINK
    • SOLAR POWER SYSTEM WITH TOWER TYPE HEAT DISSIPATING STRUCTURE
    • THERMALLY CONDUCTIVE STRUCTURE OF LED AND
    • MANUFACTURING METHOD THEREOF
    • AIRFLOW INTAKE SYSTEMS AND ASSOCIATED METHODS
    • FOR USE WITH COMPUTER CABINETS
    • METHOD OF FABRICATING HIGH SURFACE TO VOLUME
    • RATIO STRUCTURES AND THEIR INTEGRATION IN
    • MICROHEAT EXCHANGERS FOR LIQUID COOLING SYSTEM
    • OPTIMAL SPREADER SYSTEM, DEVICE AND METHOD FOR FLUID COOLED MICRO-SCALED HEAT EXCHANGE
    • METHODOLOGY OF COOLING MULTIPLE HEAT SOURCES IN A PERSONAL COMPUTER THROUGH THE USE OF MULTIPLE FLUID-BASED HEAT EXCHANGING LOOPS COUPLED VIA MODULAR
    • BUS-TYPE HEAT EXCHANGERS
    • HEAT DISSIPATION DEVICE
    • METHODS OF FORMING THERMOELECTRIC DEVICES USING
    • ISLANDS OF THERMOELECTRIC MATERIAL AND RELATED
    • STRUCTURES
    • THERMAL MANAGEMENT SOFTWARE PATENTS
    • TABLE 63 TOP U.S. ELECTRONIC THERMAL MANAGEMENT
    • SOFTWARE PATENT ASSIGNEES, JANUARY 2010 THROUGH
    • FEBRUARY 2014
    • FIGURE 17 TOP U.S. ELECTRONIC THERMAL MANAGEMENT
    • SOFTWARE PATENT ASSIGNEES, JANUARY 2010 THROUGH
    • FEBRUARY 2014
    • THERMAL ANALYSIS
    • SYSTEM AND METHOD FOR ACCESSING A MULTIPHYSICS
    • MODELING SYSTEM VIA A DESIGN SYSTEM USER INTERFACE
    • MODEL-BASED FILL
    • MODEL-BASED DESIGN VERIFICATION
    • MODELING AND SIMULATION METHOD
    • METHOD AND APPARATUS FOR MULTI-DIE THERMAL ANALYSIS
    • REDUCING THE SIZE OF A MODEL USING VISIBILITY FACTORS
    • SIMULATION AND CORRECTION OF MASK SHADOWING EFFECT
    • METHOD FOR ASSEMBLING THE FINITE ELEMENT
    • DISCRETIZATION OF ARBITRARY WEAK EQUATIONS
    • SELECTIVELY REDUCING THE NUMBER OF CELL EVALUATIONS
    • IN A HARDWARE SIMULATION
    • LOCALLY UPDATING A THREE-DIMENSIONAL MODEL
    • SYSTEMS, METHODS, AND TOOLS FOR PROOFING A
    • COMPUTER-AIDED DESIGN OBJECT
    • PROCESS FOR DISPLAYING OBJECTS OF A PLM DATABASE
    • AND APPARATUS IMPLEMENTING THIS PROCESS
    • PATENTS: THERMAL MANAGEMENT INTERFACE
    • TABLE 64 TOP U.S. ELECTRONIC THERMAL MANAGEMENT
    • INTERFACE MATERIALS PATENT ASSIGNEES, JANUARY 2010
    • TO FEBRUARY 2014
    • FIGURE 18 TOP U.S. ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS PATENT ASSIGNEES, JANUARY 2010
    • TO FEBRUARY 2014
    • THERMAL INTERFACE MATERIAL WITH THIN TRANSFER
    • FILM OR METALLIZATION
    • THERMALLY CONDUCTIVE DEVICE WITH A THERMAL
    • INTERFACE MATERIAL
    • METHOD AND SYSTEM FOR ALIGNMENT OF GRAPHITE
    • NANOFIBERS FOR ENHANCED THERMAL INTERFACE
    • MATERIAL PERFORMANCE
    • SYSTEM INCLUDING THERMAL CONTROL UNIT HAVING
    • CONDUIT FOR DISPENSE AND REMOVAL OF LIQUID THERMAL INTERFACE MATERIAL
    • THERMAL INTERFACE MATERIALS AND METHODS FOR
    • MAKING THEREOF
    • REINFORCED RESIN-DERIVED CARBON FOAM
    • FLEXIBLE GRAPHITE FLOORING HEAT SPREADER
    • THERMAL INTERFACE MATERIAL AND SEMICONDUCTOR
    • COMPONENT INCLUDING THE THERMAL INTERFACE MATERIAL
    • UNIFORM GRAPHITE PLATE
    • HIGH STRENGTH MONOLITHIC CARBON FOAM
    • THERMAL MANAGEMENT OF ELECTRONIC DEVICES.
    • HIGHLY THERMALLY-CONDUCTIVE MOLDABLE THERMOPLASTIC COMPOSITES AND COMPOSITIONS
    • HEAT SPREADER FOR PLASMA DISPLAY PANEL
    • METHOD FOR PACKAGING THERMAL INTERFACE MATERIALS
    • THERMAL INTERFACE WITH NON-TACKY SURFACE
    • CARBON FOAM EVAPORATOR
    • DIMENSIONALLY STABLE, LEAK-FREE GRAPHITE SUBSTRATE
    • CARBON FOAM CORE PANELS
    • METHOD AND ARRANGEMENT FOR COOLING A SUBSTRATE, PARTICULARLY A SEMICONDUCTOR
    • CARBON FOAM WITH SUPPLEMENTAL MATERIAL
    • HEAT SPREADING CIRCUIT ASSEMBLY
    • LAYOUT OF POWER SEMICONDUCTOR CONTACTS ON A
    • COOLING SURFACE
    • ENHANCED DIRECTIONAL CONDUCTIVITY OF GRAPHITIZABLE
    • FOAM
    • SANDWICHED THERMAL SOLUTION
    • AREA WEIGHT UNIFORMITY FLEXIBLE GRAPHITE SHEET
    • MATERIAL
    • CARBON FOAM STRUCTURAL INSULATED PANEL
    • THERMALLY AND ELECTRICALLY CONDUCTIVE INTERCONNECT STRUCTURES
    • REINFORCED RESIN-DERIVED CARBON FOAM
    • THERMOFORMED PLATFORM
    • HEAT SPREADER FOR DISPLAY PANEL
    • HIGH PURITY NUCLEAR GRAPHITE
    • LOW CTE HIGHLY ISOTROPIC GRAPHITE
    • PATENTS: THERMAL MANAGEMENT SUBSTRATES
    • TABLE 65 TOP U.S. ELECTRONIC THERMAL MANAGEMENT
    • SUBSTRATES PATENT ASSIGNEES, JANUARY 2010 TO
    • FEBRUARY 2014
    • FIGURE 19 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SUBSTRATES PATENT ASSIGNEES, JANUARY 2010 TO
    • FEBRUARY 2014
    • HEAT SPREADER FOR CENTER GATE MOLDING
    • HEAT SPREADER AS MECHANICAL REINFORCEMENT FOR
    • ULTRA-THIN DIE
    • USER-SERVICEABLE LIQUID DIMM COOLING SYSTEM
    • COOLING MEMORY MODULES USING COLD PLATE BLADES
    • COUPLED TO THE MEMORY MODULES VIA CLIPS
    • THREE-DIMENSIONAL SEMICONDUCTOR ASSEMBLY BOARD
    • WITH BUMP/FLANGE SUPPORTING BOARD, CORELESS
    • SEMICONDUCTOR DEVICE WITH HEAT SPREADER
    • BUILD-UP CIRCUITRY AND BUILT-IN ELECTRONIC DEVICE
    • BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS
    • ON-CHIP HEAT SPREADER
    • SEMICONDUCTOR PACKAGE WITH THERMAL HEAT
    • SPREADER
    • ON-CHIP HEAT SPREADER
    • METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY
    • WITH A POST/BASE HEAT SPREADER WITH AN ESD PROTECTION
    • LAYER
    • SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE HEAT
    • SPREADER AND DUAL-ANGLE CAVITY IN BUMP
    • ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE
    • PACKAGING
    • HEAT DISSIPATION DEVICE
    • METHOD OF FORMING ELECTRONIC PACKAGE HAVING
    • FLUID-CONDUCTING CHANNEL
    • SEMICONDUCTOR DEVICE THERMAL CONNECTION
    • BALL GRID ARRAY PACKAGE STACKING SYSTEM
    • BALL GRID ARRAY PACKAGE SYSTEM
    • DIE-UP BALL GRID ARRAY PACKAGE WITH DIE-ATTACHED
    • HEAT SPREADER
    • PACKAGING OF INTEGRATED CIRCUITS WITH CARBON
    • NANOTUBE ARRAYS TO ENHANCE HEAT DISSIPATION
    • THROUGH A THERMAL INTERFACE
    • SILICON CARBIDE SEMICONDUCTOR DEVICE HAVING
    • JUNCTION FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME
    • METHOD OF MANUFACTURING SILICON CARBIDE
    • SEMICONDUCTOR DEVICE
    • METHOD OF MANUFACTURING SILICON CARBIDE
    • SEMICONDUCTOR DEVICE

APPENDIX I - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT HARDWARE

  • AAVID THERMAL TECHNOLOGIES
  • ADDA-TAIWAN
  • WAKEFIELD-VETTE
  • XCELAERO CORPORATION

APPENDIX II - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT SOFTWARES

  • AAVID DESIGN
  • ADVANCED THERMAL SOLUTIONS, INC.
  • SYNOPSYS, INC.
  • THERMACORE, INC.

APPENDIX III - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS

  • 3M
  • AOS THERMAL COMPOUNDS
  • T-GLOBAL THERMAL TECHNOLOGY CO., LTD.
  • WAKEFIELD-VETTE, INC.

APPENDIX IV - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT SUBSTRATES

  • AMKOR ELECTRONICS, INC.
  • ASAT
  • SUMITOMO ELECTRIC U.S.A., INC.
  • VISHAY SILICONIX INC

LIST OF TABLES

  • SUMMARY TABLE WORLDWIDE REVENUE FOR THE THERMAL MANAGEMENT MARKET, 2013 AND 2018
  • TABLE 1 NEW ELECTRONICS DEVELOPMENTS IMPACTING THERMAL MANAGEMENT PRODUCTS, 2013-2018
  • TABLE 2 WORLD THERMAL MANAGEMENT REVENUE ACCORDING TO PRODUCT CATEGORIES, 2013 AND 2018
  • TABLE 3 MERGERS, ACQUISITIONS AND NEW FUNDINGS IN ELECTRONICS THERMAL MANAGEMENT FROM 2008 THROUGH 2013
  • TABLE 4 RESEARCH ORGANIZATIONS AND COMPANIES ACTIVELY ENGAGED IN ELECTRONIC THERMAL MANAGEMENT IN 2013
  • TABLE 5 LEADING THERMAL CONSULTANTS AND INTEGRATORS
  • TABLE 6 THERMAL PROPERTIES OF MATERIALS
  • TABLE 7 METAL MATRIX COMPOSITES
  • TABLE 8 GLOBAL REVENUE BY PRODUCT CATEGORY, 2013 AND 2018
  • TABLE 9 GLOBAL REVENUE BY REGION, 2013 AND 2018
  • TABLE 10 GLOBAL HARDWARE REVENUE BY APPLICATION, 2013 AND 2018
  • TABLE 11 GLOBAL REVENUE - COMPUTER APPLICATIONS, 2013 AND 2018
  • TABLE 12 GLOBAL REVENUE - TELECOM APPLICATIONS, 2013 AND 2018
  • TABLE 13 GLOBAL REVENUE - AUTOMOTIVE APPLICATIONS, 2013 AND 2018
  • TABLE 14 GLOBAL REVENUE - CONSUMER PRODUCTS, 2013 AND 2018
  • TABLE 15 GLOBAL REVENUE - MEDICAL/OFFICE APPLICATIONS, 2013 AND 2018
  • TABLE 16 GLOBAL REVENUE - INDUSTRIAL/MILITARY APPLICATIONS, 2013 AND 2018
  • TABLE 17 GLOBAL HARDWARE REVENUES, 2013 AND 2018
  • TABLE 18 GLOBAL HARDWARE REVENUE BY REGION, 2013 AND 2018
  • TABLE 19 GLOBAL HARDWARE REVENUE BY APPLICATION, 2013 AND 2018
  • TABLE 20 GLOBAL HARDWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018
  • TABLE 21 FANS AND BLOWERS END USE APPLICATIONS, 2013 AND 2018
  • TABLE 22 HEAT SINKS END USE APPLICATIONS, 2013 AND 2018
  • TABLE 23 HEAT PIPES END USE APPLICATIONS, 2013 AND 2018
  • TABLE 24 FAN SINKS END USE APPLICATIONS, 2013 AND 2018 ..................
  • TABLE 25 COLD PLATES END USE APPLICATIONS, 2013 AND 2018
  • TABLE 26 THERMOELECTRIC COOLERS END USE APPLICATIONS, 2013 AND 2018
  • TABLE 27 MAJOR DEVELOPMENTS IN HARDWARE IN ELECTRONICS THERMAL MANAGEMENT PRACTICES
  • TABLE 28 GLOBAL SOFTWARE REVENUES, 2013 AND 2018
  • TABLE 29 SOFTWARE REVENUE BY REGION, 2013 AND 2018
  • TABLE 30 SOFTWARE REVENUE BY APPLICATION, 2013 AND 2018
  • TABLE 31 COMPUTER APPLICATIONS SOFTWARE SHARES, 2013 AND 2018
  • TABLE 32 SOFTWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018
  • TABLE 33 CFD END USE APPLICATIONS, 2013 AND 2018
  • TABLE 34 CHT END USE APPLICATIONS, 2013 AND 2018
  • TABLE 35 CIRCUIT DESIGN END USE APPLICATIONS, 2013 AND 2018
  • TABLE 36 POWER MANAGEMENT END USE APPLICATIONS, 2013 AND 2018
  • TABLE 37 OTHER SOFTWARE END USE APPLICATIONS, 2013 AND 2018
  • TABLE 38 NEW DEVELOPMENTS IN SOFTWARE RELATED TO ELECTRONIC THERMAL MANAGEMENT
  • TABLE 39 MARKET SHARES OF MAJOR VENDORS - GLOBAL SOFTWARE MARKET FOR THERMAL MANAGEMENT, 2013
  • TABLE 40 GLOBAL INTERFACE REVENUES, 2013 AND 2018
  • TABLE 41 INTERFACE REVENUE BY REGION, 2013 AND 2018
  • TABLE 42 GLOBAL INTERFACE REVENUE BY APPLICATION, 2013 AND 2018
  • TABLE 43 GLOBAL THERMAL MANAGEMENT INTERFACE REVENUE BY SUB-PRODUCTS, 2013 AND 2018
  • TABLE 44 GLOBAL GREASE END USE APPLICATIONS, 2013 AND 2018
  • TABLE 45 GLOBAL THERMAL COMPOUND END USE APPLICATIONS, 2013 AND 2018
  • TABLE 46 GLOBAL THERMAL PADS END USE APPLICATIONS, THROUGH 2018
  • TABLE 47 GLOBAL ADHESIVE FILM AND TAPE END USE APPLICATIONS, 2013 AND 2018
  • TABLE 48 GLOBAL EPOXY END USE APPLICATIONS, 2013 TO 2018
  • TABLE 49 EXAMPLES OF THERMAL INTERFACE PROPERTIES
  • TABLE 50 NEW DEVELOPMENTS IN THERMAL INTERFACE MATERIALS RELATED TO ELECTRONIC THERMAL MANAGEMENT IN 2013
  • TABLE 51 MARKET SHARES OF MAJOR VENDORS - GLOBAL INTERFACE MARKET, 2013
  • TABLE 52 GLOBAL THERMAL MANAGEMENT SUBSTRATE REVENUES, THROUGH 2018
  • TABLE 53 SUBSTRATE REVENUE BY REGION, 2013 AND 2018
  • TABLE 54 GLOBAL SUBSTRATE REVENUE BY APPLICATION, THROUGH 2018
  • TABLE 55 SUBSTRATE REVENUE BY SUB-PRODUCTS, THROUGH 2018
  • TABLE 56 GLOBAL THERMALLY-ENHANCED PACKAGES END USE APPLICATIONS, 2013 AND 2018
  • TABLE 57 GLOBAL THERMAL MANAGEMENT HEAT SPREADERS END-USE APPLICATIONS, THROUGH 2008
  • TABLE 58 NEW DEVELOPMENTS IN THERMAL SUBSTRATES MATERIALS RELATED TO ELECTRONIC THERMAL MANAGEMENT IN 2013
  • TABLE 59 MARKET SHARES OF MAJOR VENDORS - GLOBAL SUBSTRATE MARKET, 2013
  • TABLE 60 NUMBER OF U.S. THERMAL MANAGEMENT PATENTS, 2010-2014
  • TABLE 61 NUMBER OF U.S. ELECTRONIC THERMAL MANAGEMENT PATENTS ASSIGNED BY REGION, FROM JANUARY 2010 THROUGH FEBRUARY 2014
  • TABLE 62 TOP U.S. ELECTRONIC THERMAL MANAGEMENT HARDWARE PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
  • TABLE 63 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SOFTWARE PATENT ASSIGNEES, JANUARY 2010 THROUGH FEBRUARY 2014
  • TABLE 64 TOP U.S. ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
  • TABLE 65 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SUBSTRATES PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014

LIST OF FIGURES

  • SUMMARY FIGURE WORLDWIDE REVENUES FOR THE THERMAL MANAGEMENT MARKET, 2013 AND 2018
  • FIGURE 1 MAJOR CAUSES OF ELECTRONIC FAILURE
  • FIGURE 2 TECHNOLOGY NEEDS AS A DRIVER FOR THERMAL MANAGEMENT
  • FIGURE 3 LIQUID COOLING LOOP FOR HIGH PERFORMANCE ELECTRONICS
  • FIGURE 4 TYPICAL USAGE OF FAN-COOLED HEAT SINK IN HIGH-POWER LED ASSEMBLY
  • FIGURE 5 GLOBAL REVENUE BY PRODUCT CATEGORY, 2013 AND 2018
  • FIGURE 6 WORLD THERMAL MANAGEMENT REVENUE BY REGION, 2013 AND 2018
  • FIGURE 7 GLOBAL REVENUE BY APPLICATION, 2013 AND 2018
  • FIGURE 8 GLOBAL HARDWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018
  • FIGURE 9 LIQUID COOLING OF ELECTRONICS SYSTEMS
  • FIGURE 10 SOFTWARE REVENUE BY APPLICATION, 2013 AND 2018
  • FIGURE11 MAJOR VENDORS IN THE GLOBAL THERMAL MANAGEMENT SOFTWARE MARKET, 2013
  • FIGURE 12 GLOBAL INTERFACE REVENUE BY APPLICATION, 2013 AND 2018
  • FIGURE 13 TOP VENDORS - GLOBAL INTERFACE MARKET, 2002
  • FIGURE 14 GLOBAL SUBSTRATE REVENUE BY APPLICATION, 2013 AND 2018
  • FIGURE 15 MARKET SHARES OF MAJOR VENDORS - GLOBAL SUBSTRATE MARKET, 2013
  • FIGURE 16 TOP U.S. ELECTRONIC THERMAL MANAGEMENT HARDWARE PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
  • FIGURE 17 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SOFTWARE PATENT ASSIGNEES, JANUARY 2010 THROUGH FEBRUARY 2014
  • FIGURE 18 TOP U.S. ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
  • FIGURE 19 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SUBSTRATES PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014
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