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市場調査レポート

半導体ウエハー検査装置の世界市場:2019年~2023年

Global Semiconductor Wafer Inspection Equipment Market 2019-2023

発行 TechNavio (Infiniti Research Ltd.) 商品コード 762867
出版日 ページ情報 英文 128 Pages
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半導体ウエハー検査装置の世界市場:2019年~2023年 Global Semiconductor Wafer Inspection Equipment Market 2019-2023
出版日: 2018年12月14日 ページ情報: 英文 128 Pages
概要

世界の半導体ウエハー検査装置市場は、新しいテクノロジーノードへの投資が増加することなどから、2023年までCAGRが6%以上成長する見込みとなっております。

当レポートでは、世界の半導体ウエハー検査装置市場について調査分析を行い、市場概要、市場動向、市場規模などについて考察するとともに、技術別、エンドユーザー別、地域別に市場を分析、ベンダーの状況などについて包括的に分析し、まとめています。

第1章 エグゼクティブサマリー

第2章 調査の範囲

第3章 市場の状況

第4章 市場規模

第5章 ファイブフォース分析

第6章 市場セグメンテーション:技術別

  • 市場セグメンテーション:技術別
  • 比較:技術別
  • 光学式ウエハー検査
  • 電子ビームウエハー検査
  • 市場機会

第7章 顧客の状況

第8章 市場セグメンテーション:エンドユーザー別

  • 市場セグメンテーション:エンドユーザー別
  • 比較:エンドユーザー別
  • 半導体製造工場
  • IDM
  • 市場機会

第9章 地域の状況

  • 地域のセグメンテーション
  • 地域比較
  • アジア太平洋地域
  • 南北アメリカ
  • 欧州/中東/アフリカ
  • 主要国
  • 市場機会

第10章 促進因子と課題

第11章 ベンダーの状況

第12章 ベンダーの分析

  • 分析対象のベンダー
  • ベンダーの分類
  • ベンダーの市場ポジショニング
  • Applied Materials
  • ASML
  • Hitachi High-Technologies
  • KLA-Tencor
  • Rudolph Technologies

第13章 付録

図表
  • Exhibit 01: Preface
  • Exhibit 02: Preface
  • Exhibit 03: Global semiconductor capital equipment market
  • Exhibit 04: Segments of global semiconductor capital equipment market
  • Exhibit 05: Market segments
  • Exhibit 06: Market characteristics
  • Exhibit 07: Market definition - Inclusions and exclusions checklist
  • Exhibit 08: Market size 2018
  • Exhibit 09: Global market: Size and forecast 2018-2023 ($ millions)
  • Exhibit 10: Global market: Year-over-year growth 2019-2023 (%)
  • Exhibit 11: Five forces analysis 2018
  • Exhibit 12: Five forces analysis 2023
  • Exhibit 13: Bargaining power of buyers
  • Exhibit 14: Bargaining power of suppliers
  • Exhibit 15: Threat of new entrants
  • Exhibit 16: Threat of substitutes
  • Exhibit 17: Threat of rivalry
  • Exhibit 18: Market condition - Five forces 2018
  • Exhibit 19: Technology - Market share 2018-2023 (%)
  • Exhibit 20: Comparison by technology
  • Exhibit 21: Optical wafer inspection - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 22: Optical wafer inspection - Year-over-year growth 2019-2023 (%)
  • Exhibit 23: E-beam wafer inspection - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 24: E-beam wafer inspection - Year-over-year growth 2019-2023 (%)
  • Exhibit 25: Market opportunity by technology
  • Exhibit 26: Customer landscape
  • Exhibit 27: End-user - Market share 2018-2023 (%)
  • Exhibit 28: Comparison by end-user
  • Exhibit 29: Foundries - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 30: Foundries - Year-over-year growth 2019-2023 (%)
  • Exhibit 31: IDMs - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 32: IDMs - Year-over-year growth 2019-2023 (%)
  • Exhibit 33: Market opportunity by end-user
  • Exhibit 34: Market share by geography 2018-2023 (%)
  • Exhibit 35: Geographic comparison
  • Exhibit 36: Major semiconductor foundries in APAC
  • Exhibit 37: APAC - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 38: APAC - Year-over-year growth 2019-2023 (%)
  • Exhibit 39: Americas - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 40: Americas - Year-over-year growth 2019-2023 (%)
  • Exhibit 41: Major foundries in EMEA
  • Exhibit 42: EMEA - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 43: EMEA - Year-over-year growth 2019-2023 (%)
  • Exhibit 44: Key leading countries
  • Exhibit 45: Market opportunity
  • Exhibit 46: Decision framework
  • Exhibit 47: Impact of drivers and challenges
  • Exhibit 48: Vendor landscape
  • Exhibit 49: Landscape disruption
  • Exhibit 50: Vendors covered
  • Exhibit 51: Vendor classification
  • Exhibit 52: Market positioning of vendors
  • Exhibit 53: Applied Materials - Vendor overview
  • Exhibit 54: Applied Materials - Business segments
  • Exhibit 55: Applied Materials - Organizational developments
  • Exhibit 56: Applied Materials - Geographic focus
  • Exhibit 57: Applied Materials - Segment focus
  • Exhibit 58: Applied Materials - Key offerings
  • Exhibit 59: ASML - Vendor overview
  • Exhibit 60: ASML - Organizational developments
  • Exhibit 61: ASML - Geographic focus
  • Exhibit 62: ASML - Key offerings
  • Exhibit 63: Hitachi High-Technologies - Vendor overview
  • Exhibit 64: Hitachi High-Technologies - Business segments
  • Exhibit 65: Hitachi High-Technologies - Organizational developments
  • Exhibit 66: Hitachi High-Technologies - Segment focus
  • Exhibit 67: Hitachi High-Technologies - Key offerings
  • Exhibit 68: KLA-Tencor - Vendor overview
  • Exhibit 69: KLA-Tencor - Organizational developments
  • Exhibit 70: KLA-Tencor - Geographic focus
  • Exhibit 71: KLA-Tencor - Key offerings
  • Exhibit 72: Rudolph Technologies - Vendor overview
  • Exhibit 73: Rudolph Technologies - Organizational developments
  • Exhibit 74: Rudolph Technologies - Geographic focus
  • Exhibit 75: Rudolph Technologies - Key offerings
  • Exhibit 76: Validation techniques employed for market sizing
  • Exhibit 77: List of abbreviations
目次
Product Code: IRTNTR30510

About this market

The growing investments in lower technology node to drive growth in the market. Semiconductor industries and IDMs are investing heavily on R&D to identify new technologies that can support the production of smaller process nodes. Technavio's analysts have predicted that the semiconductor wafer inspection equipment market will register a CAGR of more than 6% by 2023.

Market Overview

Increasing number of data centers

With an increasing number of data centers, there has been a rising demand for semiconductor components. Semiconductors are an integral part of data centers, which have thousands of servers and each server runs with the help of semiconductor ICs.

Complexity of technological transitions

A major challenge hindering growth of the global semiconductor wafer inspection equipment market is the complexity of technological transitions that are occurring across the semiconductor industry.

For the detailed list of factors that will drive and challenge the growth of the semiconductor wafer inspection equipment market during the 2019-2023, view our report.

Competitive Landscape

The market appears to be fragmented and with the presence of several companies including Applied Materials and ASML the competitive environment is quite intense. Factors such as the growing investments in lower technology node and the increasing number of data centers, will provide considerable growth opportunities to semiconductor wafer inspection equipment manufactures. Applied Materials, ASML, Hitachi High-Technologies, KLA-Tencor, and Rudolph Technologies are some of the major companies covered in this report.

TABLE OF CONTENTS

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: MARKET LANDSCAPE

  • Market ecosystem
  • Market segmentation analysis
  • Market characteristics

PART 04: MARKET SIZING

  • Market definition
  • Market sizing 2018
  • Market size and forecast 2018-2023

PART 05: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 06: MARKET SEGMENTATION BY TECHNOLOGY

  • Market segmentation by technology
  • Comparison by technology
  • Optical wafer inspection - Market size and forecast 2018-2023
  • E-beam wafer inspection - Market size and forecast 2018-2023
  • Market opportunity by technology

PART 07: CUSTOMER LANDSCAPE

PART 08: MARKET SEGMENTATION BY END-USER

  • Market segmentation by end-user
  • Comparison by end-user
  • Foundries - Market size and forecast 2018-2023
  • IDMs - Market size and forecast 2018-2023
  • Market opportunity by end-user

PART 09: GEOGRAPHIC LANDSCAPE

  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2018-2023
  • Americas - Market size and forecast 2018-2023
  • EMEA - Market size and forecast 2018-2023
  • Key leading countries
  • Market opportunity

PART 10: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges
  • Increasing focus on large diameter wafer size
  • Growing investments in lower technology node
  • Growing investment in 3D NAND and FinFET technologies

PART 11: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption
  • Competitive scenario

PART 12: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Applied Materials
  • ASML
  • Hitachi High-Technologies
  • KLA-Tencor
  • Rudolph Technologies

PART 13: APPENDIX

  • Research methodology
  • List of abbreviations
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