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市場調査レポート

フリップチップパッケージの世界市場:2018年〜2022年

Global Flip Chip Packages Market 2018-2022

発行 TechNavio (Infiniti Research Ltd.) 商品コード 694222
出版日 ページ情報 英文 123 Pages
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本日の銀行送金レート: 1USD=113.61円で換算しております。
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フリップチップパッケージの世界市場:2018年〜2022年 Global Flip Chip Packages Market 2018-2022
出版日: 2018年09月04日 ページ情報: 英文 123 Pages
概要

フリップチップパッケージについて

フリップチップは、チップおよびパッケージキャリアまたは基板と導電性バンプとを相互接続するパッケージ技術です。この技術を半導体チップパッケージに使用することにより、チップボンドパッド上の導電性バンプを用いて、フェイスダウン電子ダイと有機またはセラミック回路基板との直接電気的接続が確保されます。

Technavioのアナリストは、2018年から2022年の間に、世界のフリップチップパッケージ市場が6.35%のCAGRで成長すると予測しています。

当レポートでは、世界のフリップチップパッケージ市場について調査分析し、市場規模と成長率、市場動向、市場促進要因・課題、市場機会について検証するほか、主要ベンダーなどについて、体系的な情報を提供しています。

目次

第1章 エグゼクティブサマリー

第2章 調査範囲

第3章 調査方法

第4章 市場状況

  • 市場のエコシステム
  • 市場特性
  • 市場セグメンテーション分析

第5章 市場規模

  • 市場の定義
  • 市場規模(2017年)
  • 市場規模および予測(2017-2022年)

第6章 ファイブフォース分析

  • バイヤーの交渉力
  • サプライヤーの交渉力
  • 新規参入の脅威
  • 代替品の脅威
  • 競争の脅威
  • 市場状況

第7章 市場セグメンテーション:バンプ加工技術別

  • 概要
  • 銅ピラーバンプ加工
  • はんだバンプ加工
  • 金バンプ加工

第8章 顧客情勢

第9章 市場セグメンテーション:エンドユーザー別(2017-2022年)

  • 概要
  • 比較:エンドユーザー別
  • 通信部門
  • コンピューティングとネットワーク部門
  • 産業部門
  • 自動車部門
  • その他
  • 市場機会:エンドユーザー別

第10章 地域情勢

  • 地域別セグメンテーション(2017-2022年)
  • 地域比較
  • アジア太平洋地域
  • 南北アメリカ
  • 欧州・中東・アフリカ地域
  • 主要国
  • 市場機会

第11章 意思決定の枠組み

第12章 成長要因と課題

  • 市場の成長要因
  • 市場の課題

第13章 市場動向

  • 自動車用半導体部品の統合
  • モバイルデバイスの短いライフサイクル
  • アジア太平洋地域のOSAT(半導体後工程受託製造)企業の増加
  • 半導体パッケージ産業におけるM&A

第14章 ベンダー情勢

  • 概要
  • 創造的破壊の状況
  • 競合シナリオ

第15章 ベンダー分析

  • 対象ベンダー
  • ベンダー分類
  • ベンダーの市場ポジショニング
  • Advanced Semiconductor Engineering
  • Chipbond Technology
  • Intel
  • Siliconware Precision Industries
  • Taiwan Semiconductor Manufacturing Company

第16章 付録

  • 略語のリスト
図表
  • Exhibit 01: Parent market
  • Exhibit 02: Global semiconductor advanced packaging market: Segments
  • Exhibit 03: Market characteristics
  • Exhibit 04: Global flip chip packages market: Segments
  • Exhibit 05: Market definition: Inclusions and exclusions checklist
  • Exhibit 06: Market size 2017
  • Exhibit 07: Validation techniques employed for market sizing 2017
  • Exhibit 08: Global flip chip packages market: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 09: Global flip chip packages market: Year-over-year growth 2018-2022 (%)
  • Exhibit 10: Five forces analysis 2017
  • Exhibit 11: Five forces analysis 2022
  • Exhibit 12: Bargaining power of buyers
  • Exhibit 13: Bargaining power of suppliers
  • Exhibit 14: Threat of new entrants
  • Exhibit 15: Threat of substitutes
  • Exhibit 16: Threat of rivalry
  • Exhibit 17: Market condition: Five forces 2017
  • Exhibit 18: Segmentation by bumping technology: Market share 2017-2022 (%)
  • Exhibit 19: Customer landscape
  • Exhibit 20: Segmentation by end-user: Market share 2017-2022 (%)
  • Exhibit 21: Comparison by end-user
  • Exhibit 22: Communication sector: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 23: Communication sector: Year-over-year growth 2018-2022 (%)
  • Exhibit 24: Computing and networking sector: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 25: Computing and networking sector: Year-over-year growth 2018-2022 (%)
  • Exhibit 26: Industrial sector: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 27: Industrial sector: Year-over-year growth 2018-2022 (%)
  • Exhibit 28: Automotive sector: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 29: Automotive sector: Year-over-year growth 2018-2022 (%)
  • Exhibit 30: Others: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 31: Others: Year-over-year growth 2018-2022 (%)
  • Exhibit 32: Market opportunity by end-user
  • Exhibit 33: Segmentation by geography: Market share 2017-2022 (%)
  • Exhibit 34: Regional comparison
  • Exhibit 35: APAC: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 36: APAC: Year-over-year growth 2018-2022 (%)
  • Exhibit 37: Americas: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 38: Americas: Year-over-year growth 2018-2022 (%)
  • Exhibit 39: EMEA: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 40: EMEA: Year-over-year growth 2018-2022 (%)
  • Exhibit 41: Key leading countries
  • Exhibit 42: Market opportunity
  • Exhibit 43: Timeline for semiconductor wafer size advances
  • Exhibit 44: Global semiconductor market trend 1992-2017 ($ billions)
  • Exhibit 45: Forecasted car shipments 2017-2022 (million units)
  • Exhibit 46: Vendor landscape
  • Exhibit 47: Landscape disruption
  • Exhibit 48: Vendors covered
  • Exhibit 49: Vendor classification
  • Exhibit 50: Market positioning of vendors
  • Exhibit 51: Advanced Semiconductor Engineering: Overview
  • Exhibit 52: Advanced Semiconductor Engineering: Business segments
  • Exhibit 53: Advanced Semiconductor Engineering: Organizational developments
  • Exhibit 54: Advanced Semiconductor Engineering: Geographic focus
  • Exhibit 55: Advanced Semiconductor Engineering: Segment focus
  • Exhibit 56: Advanced Semiconductor Engineering: Key offerings
  • Exhibit 57: Chipbond Technology: Overview
  • Exhibit 58: Chipbond Technology: Business segments
  • Exhibit 59: Chipbond Technology: Geographic focus
  • Exhibit 60: Chipbond Technology: Key offerings
  • Exhibit 61: Intel: Overview
  • Exhibit 62: Intel: Business segments
  • Exhibit 63: Intel: Organizational developments
  • Exhibit 64: Intel: Geographic focus
  • Exhibit 65: Intel: Segment focus
  • Exhibit 66: Intel: Key offerings
  • Exhibit 67: Siliconware Precision Industries: Overview
  • Exhibit 68: Siliconware Precision Industries: Business segments
  • Exhibit 69: Siliconware Precision Industries: Organizational developments
  • Exhibit 70: Siliconware Precision Industries: Geographic focus
  • Exhibit 71: Siliconware Precision Industries: Key offerings
  • Exhibit 72: Taiwan Semiconductor Manufacturing Company: Overview
  • Exhibit 73: Taiwan Semiconductor Manufacturing Company: Business segments
  • Exhibit 74: Taiwan Semiconductor Manufacturing Company: Organizational developments
  • Exhibit 75: Taiwan Semiconductor Manufacturing Company: Geographic focus
  • Exhibit 76: Taiwan Semiconductor Manufacturing Company: Key offerings
目次
Product Code: IRTNTR22970

About Flip Chip Packaging

Flip chip is a packaging technology that interconnects chips and package carriers or substrates with conductive bumps. The use of the technology in semiconductor chip packaging ensures a direct electrical connection of face-down electronic dies with organic or ceramic circuit boards using conductive bumps on the chip bond pads.

Technavio's analysts forecast the global flip chip packages market to grow at a CAGR of 6.35% during the period 2018-2022.

Covered in this report

The report covers the present scenario and the growth prospects of the global flip chip packages market for 2018-2022. To calculate the market size, the report considers the sales of semiconductor devices based on flip chip packaging technology to end-user sectors including communication, computing and networking, industrial, and automotive.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Flip Chip Packages Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Advanced Semiconductor Engineering
  • Chipbond Technology
  • Intel
  • Siliconware Precision Industries
  • Taiwan Semiconductor Manufacturing Company

Market driver

  • Rise in use of 3D chip packaging
  • For a full, detailed list, view our report

Market challenge

  • Need for high initial capital investments
  • For a full, detailed list, view our report

Market trend

  • Growing number of OSAT companies in APAC
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2022 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 05: MARKET SIZING

  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 07: MARKET SEGMENTATION BY BUMPING TECHNOLOGY

  • Overview
  • Copper pillar bumping
  • Solder bumping
  • Gold bumping

PART 08: CUSTOMER LANDSCAPE

PART 09: MARKET SEGMENTATION BY END-USER

  • Overview
  • Comparison by end-user
  • Communication sector - Market size and forecast 2017-2022
  • Computing and networking sector - Market size and forecast 2017-2022
  • Industrial sector- Market size and forecast 2017-2022
  • Automotive sector - Market size and forecast 2017-2022
  • Others - Market size and forecast 2017-2022
  • Market opportunity by end-user

PART 10: REGIONAL LANDSCAPE

  • Geographical segmentation
  • Regional comparison
  • APAC - Market size and forecast 2017-2022
  • Americas - Market size and forecast 2017-2022
  • EMEA - Market size and forecast 2017-2022
  • Key leading countries
  • Market opportunity

PART 11: DECISION FRAMEWORK

PART 12: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 13: MARKET TRENDS

  • Integration of semiconductor components in automobiles
  • Short lifecycle of mobile devices
  • Growing number of OSAT companies in APAC
  • M&A in semiconductor packaging industry

PART 14: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption
  • Competitive scenario

PART 15: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Advanced Semiconductor Engineering
  • Chipbond Technology
  • Intel
  • Siliconware Precision Industries
  • Taiwan Semiconductor Manufacturing Company

PART 16: APPENDIX

  • List of abbreviations
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