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市場調査レポート

世界の広帯域メモリ(HBM)市場 2018年〜2022年

Global High-bandwidth Memory Market 2018-2022

発行 TechNavio (Infiniti Research Ltd.) 商品コード 665951
出版日 ページ情報 英文 126 Pages
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本日の銀行送金レート: 1USD=112.40円で換算しております。
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世界の広帯域メモリ(HBM)市場 2018年〜2022年 Global High-bandwidth Memory Market 2018-2022
出版日: 2018年07月03日 ページ情報: 英文 126 Pages
概要

広帯域メモリ(HBM)について

広帯域メモリ(HBM)は、JEDECによって規格化される広帯域DRAM技術で、TSV(Through Silicon Via)またはSlip(Silicon Interposer)技術を用いて積層DRAMダイを相互接続します。

Technavioのアナリストは、2018年から2022年にかけて世界の広帯域メモリ(HBM)市場が32.09%のCAGRで成長すると予測しています。

当レポートでは、世界の広帯域メモリ(HBM)市場を調査し、市場の概要、用途・製品・地域別の市場規模の推移と予測、市場動向、成長要因および課題の分析、競合情勢、主要企業のプロファイルなど、包括的な情報を提供しています。

目次

第1章 エグゼクティブサマリー

第2章 調査範囲

第3章 調査方法

第4章 市場状況

  • 市場のエコシステム
  • 市場特性
  • 市場セグメンテーション分析

第5章 市場規模

  • 市場の定義
  • 市場規模
  • 市場規模の予測

第6章 ファイブフォース分析

  • 買い手の交渉力
  • 供給企業の交渉力
  • 新規参入業者の脅威
  • 代替品の脅威
  • 競争企業間の敵対関係
  • 市場状況

第7章 市場セグメンテーション:用途別

  • 市場区分:用途別
  • 市場比較:用途別
  • 高性能計算(HPC)
  • グラフィックス
  • その他
  • 市場機会:用途別

第8章 市場セグメンテーション:製品別

  • 市場区分:製品別
  • GPU
  • CPU
  • APU
  • ASIC
  • FPGA

第9章 顧客情勢

第10章 地域情勢

  • 市場区分:地域別
  • 市場比較:地域別
  • 南北アメリカ
  • アジア太平洋
  • 欧州・中東・アフリカ
  • 市場牽引国
  • 市場機会

第11章 意思決定の枠組み

第12章 成長要因と課題

  • 市場の成長要因
  • 市場の課題

第13章 市場動向

  • 人工知能(AI)の成長
  • HMCへの関心の高まり
  • 量子コンピューティングへの関心の高まり

第14章 ベンダー情勢

  • 概要
  • 創造的破壊の状況
  • 競合シナリオ

第15章 ベンダー分析

  • 対象ベンダー
  • ベンダー分類
  • ベンダーの市場ポジショニング
  • Advanced Micro Devices
  • Intel
  • SAMSUNG
  • SK HYNIX
  • XILINX

第16章 付録

  • 略語のリスト
図表
  • Exhibit 01: Parent market
  • Exhibit 02: Global memory market
  • Exhibit 03: Market characteristics
  • Exhibit 04: Market segments
  • Exhibit 05: Market definition - Inclusions and exclusions checklist
  • Exhibit 06: Market size 2017
  • Exhibit 07: Validation techniques employed for market sizing 2017
  • Exhibit 08: Global - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 09: Global - Year-over-year growth 2018-2022 (%)
  • Exhibit 10: Five forces analysis 2017
  • Exhibit 11: Five forces analysis 2022
  • Exhibit 12: Bargaining power of buyers
  • Exhibit 13: Bargaining power of suppliers
  • Exhibit 14: Threat of new entrants
  • Exhibit 15: Threat of substitutes
  • Exhibit 16: Threat of rivalry
  • Exhibit 17: Market condition - Five forces 2017
  • Exhibit 18: Application - Market share 2017-2022 (%)
  • Exhibit 19: Comparison by application
  • Exhibit 20: HPC - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 21: HPC - Year-over-year growth 2018-2022 (%)
  • Exhibit 22: Graphics - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 23: Graphics - Year-over-year growth 2018-2022 (%)
  • Exhibit 24: Others - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 25: Others - Year-over-year growth 2018-2022 (%)
  • Exhibit 26: Market opportunity by application
  • Exhibit 27: Customer landscape
  • Exhibit 28: Global - Market share by geography 2017-2022 (%)
  • Exhibit 29: Comparison by region
  • Exhibit 30: Americas - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 31: Americas - Year-over-year growth 2018-2022 (%)
  • Exhibit 32: APAC - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 33: APAC - Year-over-year growth 2018-2022 (%)
  • Exhibit 34: EMEA - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 35: EMEA - Year-over-year growth 2018-2022 (%)
  • Exhibit 36: Key leading countries
  • Exhibit 37: Market opportunity
  • Exhibit 38: Vendor landscape
  • Exhibit 39: Landscape disruption
  • Exhibit 40: Vendors covered
  • Exhibit 41: Vendor classification
  • Exhibit 42: Market positioning of vendors
  • Exhibit 43: Vendor overview
  • Exhibit 44: Advanced Micro Devices - Business segments
  • Exhibit 45: Advanced Micro Devices - Organizational developments
  • Exhibit 46: Advanced Micro Devices - Geographic focus
  • Exhibit 47: Advanced Micro Devices - Segment focus
  • Exhibit 48: Advanced Micro Devices - Key offerings
  • Exhibit 49: Intel: Overview
  • Exhibit 50: Intel - Business segments
  • Exhibit 51: Intel - Organizational developments
  • Exhibit 52: Intel - Geographic focus
  • Exhibit 53: Intel- Segment focus
  • Exhibit 54: Intel- Key offerings
  • Exhibit 55: SAMSUNG: Overview
  • Exhibit 56: SAMSUNG- Business segments
  • Exhibit 57: SAMSUNG - Organizational developments
  • Exhibit 58: SAMSUNG - Geographic focus
  • Exhibit 59: SAMSUNG - Segment focus
  • Exhibit 60: SAMSUNG - Key offerings
  • Exhibit 61: SK HYNIX: Overview
  • Exhibit 62: SK HYNIX - Business segments
  • Exhibit 63: SK HYNIX - Organizational developments
  • Exhibit 64: SK HYNIX - Geographic focus
  • Exhibit 65: SK HYNIX - Segment focus
  • Exhibit 66: SK HYNIX - Key offerings
  • Exhibit 67: XILINX: Overview
  • Exhibit 68: XILINX - Business segments
  • Exhibit 69: XILINX - Organizational developments
  • Exhibit 70: XILINX - Geographic focus
  • Exhibit 71: XILINX- Key offerings
目次
Product Code: IRTNTR22962

About High-bandwidth Memory

High-bandwidth memory (HBM) is a dynamic random-access memory (DRAM) technology approved by the Joint Electron Device Engineering Council (JEDEC) as an industry standard. The technology uses through-silicon vias (TSVs) and a silicon interposer technology to interconnect stacked DRAM dies.

Technavio's analysts forecast the global high-bandwidth memory market to grow at a CAGR of 32.09% during the period 2018-2022.

Covered in this report

The report covers the present scenario and the growth prospects of the global high-bandwidth memory market for 2018-2022. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global High-bandwidth Memory Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Advanced Micro Devices
  • Intel
  • SAMSUNG
  • SK HYNIX
  • XILINX

Market driver

  • Increasing demand for HPC
  • For a full, detailed list, view our report

Market challenge

  • Exorbitant costs
  • For a full, detailed list, view our report

Market trend

  • Growth of AI
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2022 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 05: MARKET SIZING

  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 07: MARKET SEGMENTATION BY APPLICATION

  • Segmentation by application
  • Comparison by application
  • HPC - Market size and forecast 2017-2022
  • Graphics - Market size and forecast 2017-2022
  • Others - Market size and forecast 2017-2022
  • Market opportunity by application

PART 08: MARKET SEGMENTATION BY PRODUCT

  • Segmentation by product
  • GPU - Market analysis
  • CPU - Market analysis
  • APU - Market analysis
  • ASIC - Market analysis
  • FPGA - Market analysis

PART 09: CUSTOMER LANDSCAPE

PART 10: REGIONAL LANDSCAPE

  • Geographical segmentation
  • Regional comparison
  • Americas - Market size and forecast 2017-2022
  • APAC - Market size and forecast 2017-2022
  • EMEA - Market size and forecast 2017-2022
  • Key leading countries
  • Market opportunity

PART 11: DECISION FRAMEWORK

PART 12: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 13: MARKET TRENDS

  • Growth of AI
  • Increasing interest in HMC
  • Increasing interest toward quantum computing

PART 14: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption
  • Competitive scenario

PART 15: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Advanced Micro Devices
  • Intel
  • SAMSUNG
  • SK HYNIX
  • XILINX

PART 16: APPENDIX

  • List of abbreviations
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