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フリップチップの世界市場:2018年〜2022年

Global Flip Chip Market 2018-2022

発行 TechNavio (Infiniti Research Ltd.) 商品コード 642816
出版日 ページ情報 英文 114 Pages
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本日の銀行送金レート: 1USD=113.03円で換算しております。
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フリップチップの世界市場:2018年〜2022年 Global Flip Chip Market 2018-2022
出版日: 2018年05月11日 ページ情報: 英文 114 Pages
概要

フリップチップについて

フリップチップは、導電性バンプを用いてチップおよびパッケージキャリアまたは基板を相互接続するパッケージングタイプの一種です。ダイ表面に導電性バンプを置き、基板を直接接続するために反転させます。

Technavioのアナリストは、2018年から2022年の期間に、世界のフリップチップ市場市場が、6.22%のCAGRで成長すると予測しています。

当レポートでは、世界のフリップチップ市場について調査分析し、市場規模と成長率、市場動向、市場促進要因・課題、市場機会について検証するほか、主要ベンダーなどについて、体系的な情報を提供しています。

目次

第1章 エグゼクティブサマリー

第2章 調査範囲

第3章 調査方法

第4章 市場状況

  • 市場のエコシステム
  • 市場特性
  • 市場セグメンテーション分析

第5章 市場規模

  • 市場の定義
  • 市場規模(2017年)
  • 市場規模および予測(2017-2022年)

第6章 ファイブフォース分析

  • バイヤーの交渉力
  • サプライヤーの交渉力
  • 新規参入の脅威
  • 代替品の脅威
  • 競争相手の脅威
  • 市場状況

第7章 市場セグメンテーション:技術別

  • 概要
  • 比較:技術別
  • FCBGA
  • FCCSP

第8章 顧客情勢

第9章 市場セグメンテーション:エンドユーザー別

  • 概要
  • 比較:エンドユーザー別(2017-2022年)
  • エレクトロニクス - 市場規模と予測
  • 重機・設備 - 市場規模と予測
  • IT・電気通信 - 市場規模と予測
  • 自動車 - 市場規模と予測
  • その他 - 市場規模と予測
  • 市場機会:エンドユーザー別

第10章 地域情勢

  • 地域別セグメンテーション(2017-2022年)
  • 地域比較
  • アジア太平洋地域 - 市場規模と予測
  • 南北アメリカ - 市場規模と予測
  • 欧州・中東・アフリカ地域 - 市場規模と予測
  • 主要国
  • 市場機会

第11章 意思決定の枠組み

第12章 成長要因と課題

  • 市場の成長要因
  • 市場の課題

第13章 市場動向

  • 銅柱とマイクロバンプの採用が多い
  • スマートフォンや携帯機器の小型化
  • 自動車用半導体の増加
  • 半導体ベンダー間のM&Aの拡大

第14章 ベンダー情勢

  • 概要
  • 創造的破壊の状況
  • ベンダー情勢

第15章 ベンダー分析

  • 対象ベンダー
  • ベンダー分類
  • ベンダーの市場ポジショニング
  • Advanced Semiconductor Engineering
  • Amkor Technology
  • Intel
  • Samsung Electronics
  • Taiwan Semiconductor Manufacturing Company

第16章 付録

  • 略語のリスト
図表
  • Exhibit 01: Parent market
  • Exhibit 02: Global semiconductor advanced packaging market: Segments
  • Exhibit 03: Market characteristics
  • Exhibit 05: Market definition: Inclusions and exclusions checklist
  • Exhibit 06: Market size 2017
  • Exhibit 07: Validation techniques employed for market sizing 2017
  • Exhibit 08: Global flip chip market 2017-2022 ($ billions)
  • Exhibit 09: Global flip chip market: Year-over-year growth 2018-2022 (%)
  • Exhibit 10: Five forces analysis 2017
  • Exhibit 11: Five forces analysis 2022
  • Exhibit 12: Bargaining power of buyers
  • Exhibit 13: Bargaining power of suppliers
  • Exhibit 14: Threat of new entrants
  • Exhibit 15: Threat of substitutes
  • Exhibit 16: Threat of rivalry
  • Exhibit 17: Market condition: Five forces 2017
  • Customer landscape
  • Exhibit 18: Global flip chip market: Segmentation by end-user 2017-2022 (% share)
  • Exhibit 19: Comparison by end-user
  • Exhibit 20: Global flip chip market by electronics industry 2017-2022 ($ billions)
  • Exhibit 21: Global flip chip market by electronics industry: Year-over-year growth 2018-2022 (%)
  • Exhibit 22: Global flip chip market by heavy machinery and equipment industry 2017-2022 ($ billions)
  • Exhibit 23: Global flip chip market by heavy machinery and equipment industry: Year-over-year growth 2018-2022 (%)
  • Exhibit 24: Global flip chip market by IT and telecommunication industry 2017-2022 ($ billions)
  • Exhibit 25: Global flip chip market by IT and telecommunication industry: Year-over-year growth 2018-2022 (%)
  • Exhibit 26: Global flip chip market by automotive industry 2017-2022 ($ billions)
  • Exhibit 27: Global flip chip market by automotive industry: Year-over-year growth 2018-2022 (%)
  • Exhibit 28: Global flip chip market by other industries 2017-2022 ($ billions)
  • Exhibit 29: Global flip chip market by other industries: Year-over-year growth 2018-2022 (%)
  • Exhibit 30: Market opportunity by end-user
  • Exhibit 31: Global flip chip market: Segmentation by geography 2017-2022 (% share)
  • Exhibit 32: Regional comparison
  • Exhibit 33: Flip chip market in APAC 2017-2022 ($ billions)
  • Exhibit 34: Flip chip market in APAC: Year-over-year growth 2018-2022 (%)
  • Exhibit 35: Flip chip market in Americas 2017-2022 ($ billions)
  • Exhibit 36: Flip chip market in Americas: Year-over-year growth 2018-2022 (%)
  • Exhibit 37: Flip chip market in EMEA 2017-2022 ($ billions)
  • Exhibit 38: Flip chip market in EMEA: Year-over-year growth 2018-2022 (%)
  • Exhibit 39: Key leading countries
  • Exhibit 40: Market opportunity
  • Exhibit 41: Vendor landscape
  • Exhibit 42: Landscape disruption
  • Exhibit 43: Vendors covered
  • Exhibit 44: Vendor classification
  • Exhibit 45: Market positioning of vendors
  • Exhibit 46: Advanced Semiconductor Engineering: Overview
  • Exhibit 47: Advanced Semiconductor Engineering: Business segments
  • Exhibit 48: Advanced Semiconductor Engineering: Organizational developments
  • Exhibit 49: Advanced Semiconductor Engineering: Geographic focus
  • Exhibit 50: Advanced Semiconductor Engineering: Segment focus
  • Exhibit 51: Advanced Semiconductor Engineering: Key offerings
  • Exhibit 52: Amkor Technology: Overview
  • Exhibit 53: Amkor Technology: Business segments
  • Exhibit 54: Amkor Technology: Organizational developments
  • Exhibit 55: Amkor Technology: Geographic focus
  • Exhibit 56: Amkor Technology: Segment focus
  • Exhibit 57: Amkor Technology: Key offerings
  • Exhibit 58: Intel: Overview
  • Exhibit 59: Intel: Business segments
  • Exhibit 60: Intel: Organizational developments
  • Exhibit 61: Intel: Geographic focus
  • Exhibit 62: Intel: Segment focus
  • Exhibit 63: Intel: Key offerings
  • Exhibit 64: Samsung Electronics: Overview
  • Exhibit 65: Samsung Electronics: Business segments
  • Exhibit 66: Samsung Electronics: Organizational developments
  • Exhibit 67: Samsung Electronics: Geographic focus
  • Exhibit 68: Samsung Electronics: Segment focus
  • Exhibit 69: Samsung Electronics: Key offerings
  • Exhibit 70: Taiwan Semiconductor Manufacturing Company: Overview
  • Exhibit 71: Taiwan Semiconductor Manufacturing Company: Business segments
  • Exhibit 72: Taiwan Semiconductor Manufacturing Company: Organizational developments
  • Exhibit 73: Taiwan Semiconductor Manufacturing Company: Geographic focus
  • Exhibit 74: Samsung Electronics: Segment focus
  • Exhibit 75: Taiwan Semiconductor Manufacturing: Key offerings
目次
Product Code: IRTNTR22831

About Flip Chip

Flip chip is a type of packaging type, which interconnects chip and package carriers or substrates using a conductive bump. Conductive bumps are placed on the die surface, which is flipped to connect the substrate directly.

Technavio's analysts forecast the Global Flip Chip Market Market to grow at a CAGR of 6.22% during the period 2018-2022.

Covered in this report

The report covers the present scenario and the growth prospects of the flip chip market. To calculate the market size, the report considers the revenue generated from the sales of flip chip.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Flip Chip Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Advanced Semiconductor Engineering
  • Amkor Technology
  • Intel
  • Samsung Electronics
  • Taiwan Semiconductor Manufacturing Company

Market driver

  • Rise in demand for high functionality devices

Market challenge

  • Rapid developments in other packaging technologies

Market trend

  • Decreasing size of smartphones and portable devices

Key questions answered in this report

  • What will the market size be in 2022 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 05: MARKET SIZING

  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 07: MARKET SEGMENTATION BY TECHNOLOGY

  • Overview
  • Comparison by technology
  • FCBGA
  • FCCSP

PART 08: CUSTOMER LANDSCAPE

PART 09: MARKET SEGMENTATION BY END-USER

  • Overview
  • Comparison by end-user
  • Electronics - Market size and forecast 2017-2022
  • Heavy machinery and equipment - Market size and forecast 2017-2022
  • IT and telecommunication - Market size and forecast 2017-2022
  • Automotive - Market size and forecast 2017-2022
  • Others - Market size and forecast 2017-2022
  • Market opportunity by end-user

PART 10: REGIONAL LANDSCAPE

  • Geographical segmentation
  • Regional comparison
  • APAC - Market size and forecast 2017-2022
  • Americas - Market size and forecast 2017-2022
  • EMEA - Market size and forecast 2017-2022
  • Key leading countries
  • Market opportunity

PART 11: DECISION FRAMEWORK

PART 12: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 13: MARKET TRENDS

  • High adoption of copper pillars and micro bumps
  • Decreasing size of smartphones and portable devices
  • Increasing use of semiconductors in automobiles
  • Increasing M&A among semiconductor vendors

PART 14: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption
  • Vendor Landscape

PART 15: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Advanced Semiconductor Engineering
  • Amkor Technology
  • Intel
  • Samsung Electronics
  • Taiwan Semiconductor Manufacturing Company

PART 16: APPENDIX

  • List of abbreviations
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