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市場調査レポート

半導体ベアダイの世界市場:2018年〜2022年

Global Semiconductor Bare Die Market 2018-2022

発行 TechNavio (Infiniti Research Ltd.) 商品コード 633242
出版日 ページ情報 英文 132 Pages
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本日の銀行送金レート: 1USD=112.09円で換算しております。
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半導体ベアダイの世界市場:2018年〜2022年 Global Semiconductor Bare Die Market 2018-2022
出版日: 2018年04月19日 ページ情報: 英文 132 Pages
概要

半導体ベアダイについて

半導体製造業者は、ダイが得られるウェーハを製造します。半導体ウェハ製造プロセス中に、ウェーハ検査段階の後、ウェーハは個々のダイにダイシングされます。これらの個々のダイには部品番号が与えられ、ベアダイディストリビューターに配送されます。パッケージされていないこれらの半導体ダイは、半導体ベアダイと呼ばれます。

Technavioのアナリストは、世界の半導体ベアダイ市場が2022年までに230億米ドル近くの売上高を記録すると予測しています。

当レポートでは、世界の半導体ベアダイ市場について調査分析し、市場規模と成長率、市場動向、市場促進要因・課題、市場機会について検証するほか、主要ベンダーなどについて、体系的な情報を提供しています。

目次

第1章 エグゼクティブサマリー

第2章 調査範囲

第3章 調査方法

第4章 市場状況

  • 市場のエコシステム
  • 市場特性
  • 市場セグメンテーション分析

第5章 市場規模

  • 市場の定義
  • 市場規模
  • 市場規模および予測

第6章 ファイブフォース分析

  • バイヤーの交渉力
  • サプライヤーの交渉力
  • 新規参入の脅威
  • 代替品の脅威
  • 競争相手の脅威
  • 市場状況

第7章 市場セグメンテーション:アプリケーション別

  • セグメンテーション:アプリケーション別
  • 比較:アプリケーション別
  • 家電 - 市場規模と予測
  • コンピュータ - 市場規模と予測
  • 産業 - 市場規模と予測
  • 電気通信 - 市場規模と予測
  • その他 - 市場規模と予測
  • 市場機会:アプリケーション別

第8章 顧客情勢

第9章 地域情勢

  • 地域別セグメンテーション
  • 地域比較
  • アジア太平洋地域 - 市場規模と予測
  • 南北アメリカ - 市場規模と予測
  • 欧州・中東・アフリカ地域 - 市場規模と予測
  • 市場機会

第10章 意思決定の枠組み

第11章 成長要因と課題

  • 市場の成長要因
  • 市場の課題

第12章 市場動向

  • リソグラフィー波長の連続的な減少
  • IoTおよび接続デバイスの普及拡大
  • 広く受け入れられつつあるウェアラブル機器
  • ウェーハサイズの増加
  • スマートシティの成長
  • 自動車のオートメーション

第13章 ベンダー情勢

  • 概要
  • 創造的破壊の状況
  • 競合シナリオ

第14章 ベンダー分析

  • 対象ベンダー
  • ベンダー分類
  • ベンダーの市場ポジショニング
  • Analog Devices
  • Infineon Technologies
  • ON Semiconductor
  • ローム
  • Texas Instruments

第15章 付録

  • 略語のリスト
図表
  • Exhibit 01: Parent market
  • Exhibit 02: Semiconductor value chain
  • Exhibit 03: Front-end processes
  • Exhibit 04: Back-end processes
  • Exhibit 05: Global semiconductor market
  • Exhibit 06: Market characteristics
  • Exhibit 07: Market segments
  • Exhibit 08: Market definition - Inclusions and exclusions checklist
  • Exhibit 09: Market size 2017
  • Exhibit 10: Validation techniques employed for market sizing 2017
  • Exhibit 11: Global semiconductor bare die market - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 12: Global semiconductor bare die market - Year-over-year growth 2018-2022 (%)
  • Exhibit 13: Global semiconductor bare die market 2017-2022
  • Exhibit 14: Five forces analysis 2017
  • Exhibit 15: Five forces analysis 2022
  • Exhibit 16: Bargaining power of buyers
  • Exhibit 17: Bargaining power of suppliers
  • Exhibit 18: Threat of new entrants
  • Exhibit 19: Threat of substitutes
  • Exhibit 20: Threat of rivalry
  • Exhibit 21: Market condition - Five forces 2017
  • Exhibit 22: Global semiconductor bare die market by application - Market share 2017-2022 (%)
  • Exhibit 23: Comparison by application
  • Exhibit 24: Consumer electronics - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 25: Consumer electronics - Year-over-year growth 2018-2022 (%)
  • Exhibit 26: Computers - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 27: Computers - Year-over-year growth 2018-2022 (%)
  • Exhibit 28: Industrial - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 29: Industrial - Year-over-year growth 2018-2022 (%)
  • Exhibit 30: Telecommunications - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 31: Telecommunications - Year-over-year growth 2018-2022 (%)
  • Exhibit 32: Others - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 33: Others - Year-over-year growth 2018-2022 (%)
  • Exhibit 34: Market opportunity by application
  • Exhibit 35: Customer landscape
  • Exhibit 36: Global semiconductor bare die market by geography - Market share 2017-2022 (%)
  • Exhibit 37: Regional comparison
  • Exhibit 38: APAC - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 39: APAC - Year-over-year growth 2018-2022 (%)
  • Exhibit 40: Top 3 countries in APAC
  • Exhibit 41: Americas - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 42: Americas - Year-over-year growth 2018-2022 (%)
  • Exhibit 43: Top 3 countries in the Americas
  • Exhibit 44: EMEA - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 45: EMEA - Year-over-year growth 2018-2022 (%)
  • Exhibit 46: Top 3 countries in EMEA
  • Exhibit 47: Market opportunity
  • Exhibit 48: Global semiconductor market growth trend 2000-2017
  • Exhibit 49: Node transition in the semiconductor industry
  • Exhibit 50: Requirements for the IoT
  • Exhibit 51: Timeline for semiconductor wafer size advances
  • Exhibit 52: Partner cities selected under the EU-China PDSF initiative
  • Exhibit 53: Vendor landscape
  • Exhibit 54: Landscape disruption
  • Exhibit 55: Vendors covered
  • Exhibit 56: Vendor classification
  • Exhibit 57: Market positioning of vendors
  • Exhibit 58: Analog Devices - Overview
  • Exhibit 59: Analog Devices - Product segments
  • Exhibit 60: Analog Devices - Organizational developments
  • Exhibit 61: Analog Devices - Geographic focus
  • Exhibit 62: Analog Devices - Segment focus
  • Exhibit 63: Analog Devices - Key offerings
  • Exhibit 64: Infineon Technologies overview
  • Exhibit 65: Infineon Technologies - Business segments
  • Exhibit 66: Infineon Technologies - Organizational developments
  • Exhibit 67: Infineon Technologies - Geographic focus
  • Exhibit 68: Infineon Technologies - Segment focus
  • Exhibit 69: Infineon Technologies - Key offerings
  • Exhibit 70: ON Semiconductor - Overview
  • Exhibit 71: ON Semiconductor - Business segments
  • Exhibit 72: ON Semiconductor - Organizational developments
  • Exhibit 73: ON Semiconductor - Geographic focus
  • Exhibit 74: ON Semiconductor - Segment focus
  • Exhibit 75: ON Semiconductor - Key offering
  • Exhibit 77: ROHM Semiconductor overview
  • Exhibit 78: ROHM Semiconductor - Business segments
  • Exhibit 79: ROHM Semiconductor - Organizational developments
  • Exhibit 80: ROHM Semiconductor - Geographic focus
  • Exhibit 81: ROHM Semiconductor - Segment focus
  • Exhibit 82: ROHM Semiconductor - Key offerings
  • Exhibit 83: Texas Instruments overview
  • Exhibit 84: Texas Instruments - Business segments
  • Exhibit 85: Texas Instruments - Organizational developments
  • Exhibit 86: Texas Instruments - Geographic focus
  • Exhibit 87: Texas Instruments - Segment focus
  • Exhibit 88: Texas Instruments - Key offerings
目次
Product Code: IRTNTR21390

About Semiconductor Bare Die

Semiconductor manufacturers produce wafers, from which a die is yielded. During the semiconductor wafer fabrication process, after the wafer testing phase, the wafer is diced into individual dies. These individual dies are given a part number and are delivered to bare die distributors. These semiconductor dies, which are not packaged, are referred to as semiconductor bare dies.

Technavio's analysts forecast the global semiconductor bare die market will register a revenue of close to USD 23 billion by 2022.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor bare die market for 2018-2022. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Semiconductor Bare Die Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Analog Devices
  • Infineon Technologies
  • ON Semiconductor
  • ROHM Semiconductor
  • Texas Instruments

Market driver

  • Emergence of advanced and compact consumer electronic devices
  • For a full, detailed list, view our report

Market challenge

  • High inventory levels in the supply chain
  • For a full, detailed list, view our report

Market trend

  • Continuous decrease in lithography wavelength
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2022 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 05: MARKET SIZING

  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 07: MARKET SEGMENTATION BY APPLICATION

  • Segmentation by application
  • Comparison by application
  • Consumer electronics - Market size and forecast 2017-2022
  • Computers - Market size and forecast 2017-2022
  • Industrial - Market size and forecast 2017-2022
  • Telecommunications - Market size and forecast 2017-2022
  • Others - Market size and forecast 2017-2022
  • Market opportunity by application

PART 08: CUSTOMER LANDSCAPE

PART 09: REGIONAL LANDSCAPE

  • Geographical segmentation
  • Regional comparison
  • APAC - Market size and forecast 2017-2022
  • Americas - Market size and forecast 2017-2022
  • EMEA - Market size and forecast 2017-2022
  • Market opportunity

PART 10: DECISION FRAMEWORK

PART 11: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 12: MARKET TRENDS

  • Continuous decrease in the lithography wavelength
  • Growing proliferation of the IoT and connected devices
  • Growing acceptance of wearable devices
  • Increase in the wafer size
  • Growth of smart cities
  • Automation in automobiles

PART 13: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption
  • Competitive scenario

PART 14: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Analog Devices
  • Infineon Technologies
  • ON Semiconductor
  • ROHM Semiconductor
  • Texas Instruments

PART 15: APPENDIX

  • List of abbreviations
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