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半導体組立およびパッケージングサービスの世界市場:2018年〜2022年

Global Semiconductor Assembly and Packaging Services Market 2018-2022

発行 TechNavio (Infiniti Research Ltd.) 商品コード 631704
出版日 ページ情報 英文 147 Pages
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本日の銀行送金レート: 1USD=113.03円で換算しております。
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半導体組立およびパッケージングサービスの世界市場:2018年〜2022年 Global Semiconductor Assembly and Packaging Services Market 2018-2022
出版日: 2018年04月09日 ページ情報: 英文 147 Pages
概要

半導体アセンブリ・パッケージングサービスについて

半導体アセンブリ・パッケージングサービスは、半導体製造プロセスにおいて重要です。半導体デバイスのパッケージは、通常、プラスチック、金属、およびセラミック/ガラスのような材料で作られます。衝撃や腐食から保護するためにパッケージングが行われます。

Technavioのアナリストは、2018年から2022年の間に、世界の半導体アセンブリ・パッケージングサービス市場が、4.87%のCAGRで成長すると予測しています。

当レポートでは、世界の半導体アセンブリ・パッケージングサービス市場について調査分析し、市場規模と成長率、市場動向、市場促進要因・課題、市場機会について検証するほか、主要ベンダーなどについて、体系的な情報を提供しています。

第1章 エグゼクティブサマリー

第2章 調査範囲

第3章 調査方法

第4章 市場状況

  • 市場のエコシステム
  • 市場特性
  • 市場セグメンテーション分析

第5章 市場規模

  • 市場の定義
  • 市場規模
  • 市場規模および予測

第6章 ファイブフォース分析

  • バイヤーの交渉力
  • サプライヤーの交渉力
  • 新規参入の脅威
  • 代替品の脅威
  • 競争相手の脅威
  • 市場状況

第7章 市場セグメンテーション:アプリケーション別

  • セグメンテーション:アプリケーション別
  • 比較:アプリケーション別
  • 通信分野 - 市場規模と予測
  • コンピューティングおよびネットワーク分野 - 市場規模と予測
  • 産業および自動車分野 - 市場規模と予測
  • 家電分野 - 市場規模と予測
  • 市場機会:アプリケーション別

第8章 市場セグメンテーション:パッケージタイプ別

  • セグメンテーション:パッケージタイプ別
  • 比較:パッケージタイプ別
  • WLP - 市場規模と予測
  • ダイレベルパッケージング - 市場規模と予測
  • 市場機会:技術別

第9章 市場セグメンテーション:サービスプロバイダ別

  • セグメンテーション:サービスプロバイダ別
  • 比較:サービスプロバイダ別
  • OSATs - 市場規模と予測
  • IDM - 市場規模と予測
  • ファウンドリ - 市場規模と予測
  • 市場機会:サービスプロバイダ別

第10章 顧客情勢

第11章 地域情勢

  • 地域別セグメンテーション
  • 地域比較
  • アジア太平洋地域 - 市場規模と予測
  • 南北アメリカ - 市場規模と予測
  • 欧州・中東・アフリカ地域 - 市場規模と予測
  • 主要国
    • 韓国
    • 台湾
    • 中国
    • 日本
    • 米国
  • 市場機会

第12章 意思決定の枠組み

第13章 成長要因と課題

  • 市場の成長要因
  • 市場の課題

第14章 市場動向

  • ウェーハサイズの進歩
  • 自動車用半導体部品の統合
  • モバイルデバイスの短い製品ライフサイクル
  • アジア太平洋地域のOSATベンダー数の増加
  • 半導体パッケージ産業におけるM&Aのトレンド
  • 半導体メモリデバイスの高まる要求
  • ウェアラブル機器の普及

第15章 ベンダー情勢

  • 概要
  • 創造的破壊の状況
  • 競合シナリオ

第16章 ベンダー分析

  • 対象ベンダー
  • ベンダー分類
  • ベンダーの市場ポジショニング
  • ASE
  • Amkor Technology
  • Intel
  • SAMSUNG ELECTRONICS
  • SPIL
  • TSMC

第17章 付録

  • 略語のリスト
図表
  • Exhibit 01: Parent market
  • Exhibit 02: Global semiconductor market
  • Exhibit 03: Market characteristics
  • Exhibit 04: Market segments
  • Exhibit 05: Market definition - Inclusions and exclusions checklist
  • Exhibit 06: Market size 2017
  • Exhibit 07: Validation techniques employed for market sizing 2017
  • Exhibit 08: Global - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 09: Global - Year-over-year growth 2018-2022 (%)
  • Exhibit 10: Five forces analysis 2017
  • Exhibit 11: Five forces analysis 2022
  • Exhibit 12: Bargaining power of buyers
  • Exhibit 13: Bargaining power of suppliers
  • Exhibit 14: Threat of new entrants
  • Exhibit 15: Threat of substitutes
  • Exhibit 16: Threat of rivalry
  • Exhibit 17: Market condition - Five forces 2017
  • Exhibit 18: Application - Market share 2017-2022 (%)
  • Exhibit 19: Comparison by application
  • Exhibit 20: Communication sector - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 21: Communication sector - Year-over-year growth 2018-2022 (%)
  • Exhibit 22: Computing and networking sector - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 23: Computing and networking sector - Year-over-year growth 2018-2022 (%)
  • Exhibit 24: Industrial and automotive sector - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 25: Industrial and automotive sector - Year-over-year growth 2018-2022 (%)
  • Exhibit 26: Consumer electronics sector - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 27: Consumer electronics sector - Year-over-year growth 2018-2022 (%)
  • Exhibit 28: Market opportunity by application
  • Exhibit 29: Packaging type - Market share 2017-2022 (%)
  • Exhibit 30: Comparison by packaging type
  • Exhibit 31: WLP - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 32: WLP - Year-over-year growth 2018-2022 (%)
  • Exhibit 33: Die level packaging - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 34: Die level packaging - Year-over-year growth 2018-2022 (%)
  • Exhibit 35: Market opportunity by packaging type
  • Exhibit 36: Service provider - Market share 2017-2022 (%)
  • Exhibit 37: Comparison by service provider
  • Exhibit 38: OSATs - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 39: OSATs - Year-over-year growth 2018-2022 (%)
  • Exhibit 40: IDMs - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 41: IDMs - Year-over-year growth 2018-2022 (%)
  • Exhibit 42: Foundries - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 43: Foundries - Year-over-year growth 2018-2022 (%)
  • Exhibit 44: Market opportunity by service provider
  • Exhibit 45: Customer landscape
  • Exhibit 46: Global - Market share by geography 2017-2022 (%)
  • Exhibit 47: Regional comparison
  • Exhibit 48: APAC - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 49: APAC - Year-over-year growth 2018-2022 (%)
  • Exhibit 50: Americas - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 51: Americas - Year-over-year growth 2018-2022 (%)
  • Exhibit 52: EMEA - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 53: EMEA - Year-over-year growth 2018-2022 (%)
  • Exhibit 54: Key leading countries
  • Exhibit 55: Market opportunity
  • Exhibit 56: Global semiconductor market trend 1992-2017 ($ billions)
  • Exhibit 57: Timeline for semiconductor wafer size advances
  • Exhibit 58: Forecasted car shipments 2017-2022 (millions of units)
  • Exhibit 59: CAGR of 3D NAND and DRAM over the forecast period
  • Exhibit 60: Vendor landscape
  • Exhibit 61: Landscape disruption
  • Exhibit 62: Vendors covered
  • Exhibit 63: Vendor classification
  • Exhibit 64: Market positioning of vendors
  • Exhibit 65: ASE: Overview
  • Exhibit 66: ASE - Business segments
  • Exhibit 67: ASE - Organizational developments
  • Exhibit 68: ASE - Geographic focus
  • Exhibit 69: ASE - Segment focus
  • Exhibit 70: ASE - Key offerings
  • Exhibit 71: Amkor Technology: Overview
  • Exhibit 72: Amkor Technology - Business segments
  • Exhibit 73: Amkor Technology - Organizational developments
  • Exhibit 74: Amkor Technology- Geographic focus
  • Exhibit 75: Amkor Technology - Segment focus
  • Exhibit 76: Amkor Technology - Key offerings
  • Exhibit 77: Intel: Overview
  • Exhibit 78: Intel- Business segments
  • Exhibit 79: Intel - Organizational developments
  • Exhibit 80: Intel - Geographic focus
  • Exhibit 81: Intel - Segment focus
  • Exhibit 82: Intel - Key offerings
  • Exhibit 83: SAMSUNG ELECTRONICS: Overview
  • Exhibit 84: SAMSUNG ELECTRONICS - Business segments
  • Exhibit 85: SAMSUNG ELECTRONICS - Organizational developments
  • Exhibit 86: SAMSUNG ELECTRONICS - Geographic focus
  • Exhibit 87: Samsung Electronics - Segment focus
  • Exhibit 88: SAMSUNG ELECTRONICS - Key offerings
  • Exhibit 89: SPIL - Vendor overview
  • Exhibit 90: SPIL - Business segments
  • Exhibit 91: SPIL - Organizational developments
  • Exhibit 92: SPIL - Geographic focus
  • Exhibit 93: SPIL - Segment focus
  • Exhibit 94: SPIL - Key offerings
  • Exhibit 95: TSMC: Overview
  • Exhibit 96: Taiwan Semiconductor Manufacturing Company (TSMC)- Business segments
  • Exhibit 97: TSMC - Organizational developments
  • Exhibit 98: TSMC - Geographic focus
  • Exhibit 99: TSMC - Segment focus
  • Exhibit 100: TSMC - Key offerings
目次
Product Code: IRTNTR21558

About Semiconductor Assembly and Packaging Services

Semiconductor assembly and packaging services are crucial in the semiconductor production process. The package of the semiconductor device is usually made of materials such as plastic, metal, and ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion.

Technavio's analysts forecast the global semiconductor assembly and packaging services market to grow at a CAGR of 4.87% during the period 2018-2022.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor assembly and packaging services market for 2018-2022. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Semiconductor Assembly and Packaging Services Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • ASE
  • Amkor Technology
  • Intel
  • SAMSUNG ELECTRONICS
  • SPIL
  • TSMC

Market driver

  • Rising number of fabs
  • For a full, detailed list, view our report

Market challenge

  • Requirement of high initial capital investment
  • For a full, detailed list, view our report

Market trend

  • Advances in wafer size
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2022 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 05: MARKET SIZING

  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 07: MARKET SEGMENTATION BY APPLICATION

  • Segmentation by application
  • Comparison by application
  • Communication sector - Market size and forecast 2017-2022
  • Computing and networking sector - Market size and forecast 2017-2022
  • Industrial and automotive sector - Market size and forecast 2017-2022
  • Consumer electronics sector - Market size and forecast 2017-2022
  • Market opportunity by application

PART 08: MARKET SEGMENTATION BY PACKAGING TYPE

  • Segmentation by packaging type
  • Comparison by packaging type
  • WLP - Market size and forecast 2017-2022
  • Die level packaging - Market size and forecast 2017-2022
  • Market opportunity by technology

PART 09: MARKET SEGMENTATION BY SERVICE PROVIDER

  • Segmentation by service provider
  • Comparison by service provider
  • OSATs - Market size and forecast 2017-2022
  • IDMs - Market size and forecast 2017-2022
  • Foundries - Market size and forecast 2017-2022
  • Market opportunity by service provider

PART 10: CUSTOMER LANDSCAPE

PART 11: REGIONAL LANDSCAPE

  • Geographical segmentation
  • Regional comparison
  • APAC - Market size and forecast 2017-2022
  • Americas - Market size and forecast 2017-2022
  • EMEA - Market size and forecast 2017-2022
  • Key leading countries
  • South Korea
  • Taiwan
  • China
  • Japan
  • US
  • Market opportunity

PART 12: DECISION FRAMEWORK

PART 13: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 14: MARKET TRENDS

  • Advances in wafer size
  • Integration of semiconductor components in automobiles
  • Short product lifecycle of mobile devices
  • Growing number of OSAT vendors in APAC
  • Rising trend of M&A in semiconductor packaging industry
  • Growing requirement for semiconductor memory devices
  • Rising acceptance of wearable devices

PART 15: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption
  • Competitive scenario

PART 16: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • ASE
  • Amkor Technology
  • Intel
  • SAMSUNG ELECTRONICS
  • SPIL
  • TSMC

PART 17: APPENDIX

  • List of abbreviations
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