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市場調査レポート

半導体製造装置 (SPE) の東南アジア市場:2017年〜2021年

Semiconductor Production Equipment (SPE) Market in Southeast Asia 2017-2021

発行 TechNavio (Infiniti Research Ltd.) 商品コード 541321
出版日 ページ情報 英文 90 Pages
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半導体製造装置 (SPE) の東南アジア市場:2017年〜2021年 Semiconductor Production Equipment (SPE) Market in Southeast Asia 2017-2021
出版日: 2017年08月09日 ページ情報: 英文 90 Pages
概要

東南アジアの半導体製造装置 (SPE) 市場は、2017年〜2021年のCAGR (複合年間成長率) で、9.27%の成長が予測されています。

当レポートでは、東南アジアの半導体製造装置 (SPE) 市場について調査分析し、市場規模と成長率、市場動向、市場促進要因・課題、市場機会について検証するほか、主要ベンダーなどについて、体系的な情報を提供しています。

第1章 エグゼクティブサマリー

第2章 調査範囲

第3章 調査手法

第4章 イントロダクション

第5章 市場情勢

  • 市場概要
  • 市場規模と予測
  • ファイブフォース分析

第6章 半導体製造装置 (SPE) の東南アジア市場:エンドユーザー別

  • 市場概要
  • メモリ
  • ファウンドリ (IC製造)
  • IDM

第7章 半導体製造装置 (SPE) の東南アジア市場:地域別

  • 市場概要
  • 台湾
  • 韓国
  • 日本
  • その他

第8章 意思決定フレームワーク

第9章 促進要因と課題

第10章 市場動向

第11章 ベンダー情勢

  • 競合シナリオ
  • 主要ベンダー
  • その他の有力ベンダー

第12章 付録

第13章 Technavioについて

目次
Product Code: IRTNTR13785

About Semiconductor Production Equipment

The SPE market is divided into front-end and back-end process equipment industries. The front-end process includes the cutting-edge technology and integration. This process includes the silicon wafer process for manufacturing multiple integrated devices and the designing of electric circuits on the wafers. The back-end process involves chip assembling and the test process that includes dicing wafers and testing the chips. Semiconductor devices are used in mobile devices, including smartphones, tablets, data center servers that play a key role in the use of big data, and equipment made of semiconductor components. Furthermore, with the increasing applications of Internet of Things (IoT) globally, the demand for semiconductors will increase in various segments, including consumer electronics, automobile, and healthcare.

Technavio's analysts forecast the semiconductor production equipment market in South East Asia to grow at a CAGR of 9.27% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the semiconductor production equipment market in South East Asia for 2017-2021. To calculate the market size, the report considers the shipment values and exclude replacements, spares, and the aftermarket services market.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Semiconductor Production Equipment Market in South East Asia 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • ASML,
  • Applied Materials,
  • Tokyo Electron,
  • KLA-Tencor,
  • Lam Research

Other Prominent Vendors

  • AIXTRON SE
  • ASM International
  • Veeco
  • Charm Engineering
  • DI
  • DMS
  • Eugene Technology
  • EXICON
  • From30
  • Global Standard Technology
  • Hanmi Semiconductor
  • Jusung Engineering
  • Kookje Electric Korea
  • Mirae
  • Mujin
  • NEONTECH
  • Nikon Instruments
  • Semes
  • SHINSUNG E&G
  • Teradyne

Market driver

  • Increasing applications of IoT
  • For a full, detailed list, view our report

Market challenge

  • Dependence on a limited number of suppliers
  • For a full, detailed list, view our report

Market trend

  • Increase in the use of semiconductor devices in automobiles
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction

  • Market outline
  • Industry overview

PART 05: Market landscape

  • Market overview
  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by end-user

  • Market overview
  • Memory segment
  • Foundry segment
  • IDM segment

PART 07: Geographical segmentation

  • Market overview
  • Taiwan
  • South Korea
  • Japan
  • Rest of Southeast Asia

PART 08: Decision framework

PART 09: Drivers and challenges

  • Market drivers
  • Market challenges

PART 10: Market trends

PART 11: Vendor landscape

  • Competitive Scenario
  • Key vendors
  • Other prominent vendors

PART 12: Appendix

  • List of abbreviations

List of Exhibits

  • Exhibit 01: SPE market in Southeast Asia: Overview based on the manufacturing process
  • Exhibit 02: SPE market in Southeast Asia 2016
  • Exhibit 03: SPE market in Southeast Asia 2016-2021 ($ billions)
  • Exhibit 04: Five forces analysis
  • Exhibit 05: SPE market in Southeast Asia 2016-2021: Segmentation by end-user (% share of revenue)
  • Exhibit 06: SPE market in Southeast Asia 2016-2021: Segmentation by end-user ($ billions)
  • Exhibit 07: SPE market in Southeast Asia by memory segment 2016-2021 ($ billions)
  • Exhibit 08: SPE market in Southeast Asia by the foundry segment 2016-2021 ($ billions)
  • Exhibit 09: SPE market in Southeast Asia by the IDM segment 2016-2021 ($ billions)
  • Exhibit 10: SPE market in Southeast Asia: Geographical segmentation 2016-2021 (% share of revenue)
  • Exhibit 11: SPE market in Southeast Asia: Geographical segmentation 2016-2021 ($ billions)
  • Exhibit 12: SPE market in Taiwan 2016-2021 ($ billions)
  • Exhibit 13: SPE market in South Korea 2016-2021 ($ billions)
  • Exhibit 14: SPE market in Japan 2016-2021 ($ billions)
  • Exhibit 15: SPE market in rest of Southeast Asia 2016-2021 ($ billions)
  • Exhibit 16: Global NAND flash market 2015-2020 (% share of revenue)
  • Exhibit 17: CAGR of the LED chip, sensor, DRAM, and NAND markets 2015-2020
  • Exhibit 18: Growth of the global semiconductor market 1990-2016 ($ billions)
  • Exhibit 19: Car shipment growth rate 2015-2020 (% share)
  • Exhibit 20: Timeline for semiconductor wafer size developments
  • Exhibit 21: Key parameters of competition
  • Exhibit 22: SPE market in Southeast Asia: Market segmentation based on key vendors' penetration 2016 (% share of revenue)
  • Exhibit 23: R&D spending pattern of the key vendors 2014-2016 ($ millions)
  • Exhibit 24: Major SPE vendors: Ranking 2016
  • Exhibit 25: EPS pattern of the key vendors 2014-2016 ($)
  • Exhibit 26: Applied Materials: Revenue generated from semiconductor systems 2014-2016 ($ billions)
  • Exhibit 27: Applied Materials: Overall revenue segmentation 2016 (% share of revenue)
  • Exhibit 28: Applied Materials: R&D expenditure 2014-2016 ($ millions)
  • Exhibit 29: Applied Materials: Region wise segmentation of the revenue from SPE sales 2014-2016 (% share of revenue)
  • Exhibit 30: ASML: Revenue generated from semiconductor systems 2014-2016 ($ billions)
  • Exhibit 31: ASML: R&D expenditure 2014-2016 ($ millions)
  • Exhibit 32: ASML: Region wise segmentation of the revenue from SPE sales 2014-2016 (% share of revenue)
  • Exhibit 33: ASML: Global SPE sales 2016 (% share of revenue)
  • Exhibit 34: ASML: Global SPE sales based on the technology type 2015-2016 (% share of revenue)
  • Exhibit 35: KLA-Tencor: Products and services offered in the chip manufacturing market
  • Exhibit 36: KLA-Tencor: Products and services offered in the wafer manufacturing inspection tools market
  • Exhibit 37: KLA-Tencor: Products and services offered in the data storage media/head manufacturing market
  • Exhibit 38: KLA-Tencor: Products and services offered in the LED manufacturing market
  • Exhibit 39: KLA-Tencor: Products and services offered in the compound semiconductor manufacturing market
  • Exhibit 40: KLA-Tencor: Products and services offered in the MEMS manufacturing market
  • Exhibit 41: KLA-Tencor: Products and services offered in the surface profilometry and surface metrology market
  • Exhibit 42: KLA-Tencor: Revenue generated from semiconductor systems 2014-2016 ($ billions)
  • Exhibit 43: KLA-Tencor: R&D expenditure 2014-2016 ($ millions)
  • Exhibit 44: KLA-Tencor: Region wise segmentation of the revenue from SPE sales 2014-2016 (% share of revenue)
  • Exhibit 45: LAM Research: Product portfolio
  • Exhibit 46: LAM Research: Revenue generated from semiconductor systems 2014-2016 ($ billions)
  • Exhibit 47: LAM Research: R&D expenditure 2014-2016 ($ millions)
  • Exhibit 48: LAM Research: Region wise segmentation of the revenue from SPE sales 2014-2016 ((% share of revenue)
  • Exhibit 49: Tokyo Electron: Product portfolio
  • Exhibit 50: Tokyo Electron: Revenue contribution by clients 2016 (% share of revenue)
  • Exhibit 51: Tokyo Electron: Region wise segmentation of the revenue from SPE sales 2015 and 2016 ((% share of revenue)
  • Exhibit 52: Tokyo Electron: R&D expenditure 2014-2016 ($ millions)
  • Exhibit 53: Other prominent vendors
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