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市場調査レポート

半導体ウェハー用ダイシングソーの世界市場 - 2017〜2021年

Global Wafer Dicing Saws Market 2017-2021

発行 TechNavio (Infiniti Research Ltd.) 商品コード 525373
出版日 ページ情報 英文 86 Pages
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半導体ウェハー用ダイシングソーの世界市場 - 2017〜2021年 Global Wafer Dicing Saws Market 2017-2021
出版日: 2017年07月05日 ページ情報: 英文 86 Pages
概要

半導体ウェハー用ダイシングソーの世界市場は2017年から2021年までの期間において6.35%のCAGR (年平均成長率) にて成長が続くものと予測されます。

当レポートでは、半導体ウェハー用ダイシングソーの世界市場を取り上げ、市場成長促進要因や市場が抱える課題、市場動向、また市場競争状況に関する詳細な調査を通じて、市場の現状分析ならびに2017年から2021年までの将来予測を行っています。

第1章 エグゼクティブ・サマリー

第2章 当レポートのカバー範囲

第3章 市場調査手法

第4章 序論

  • 市場概観
  • 半導体ウェハー用ダイシングソー

第5章 市場概況

  • 市場概要
  • 市場規模および将来予測

第6章 ファイブフォース分析

第7章 エンドユーザ別市場分類

  • 専業ファウンドリ企業
  • 垂直統合型デバイスメーカー (IDM)

第8章 パッケージ技術別市場分類

  • BGA (ボールグリッドアレイ)
  • QFN (クワッドフラットノーリード・パッケージ)

第9章 地域別市場分類

  • 市場概要
  • アジア太平洋地域市場
  • 南北アメリカ地域市場
  • 欧州・中東・アフリカ地域市場

第10章 主要国

  • 台湾
  • 中国
  • 方針決定のための枠組み

第11章 市場成長促進要因および市場の課題

  • 市場成長促進要因
  • 市場の課題

第12章 市場動向

  • AIの進歩
  • ウェハーサイズの拡大
  • 超音波ブレードダイシングの導入
  • スマートシティの成長

第13章 ベンダー情勢

  • 市場競争シナリオ

第14章 主要ベンダー分析

  • DISCO Corporation
  • 株式会社 東京精密
  • Advanced Dicing Technology
  • Dynatex International
  • Loadpoint
  • Micross Components

第15章 付録

図表
  • Exhibit 01: Types of dicing equipment
  • Exhibit 02: Global wafer dicing saws market: Overview
  • Exhibit 03: Global wafer dicing saws market 2016-2021 ($ millions)
  • Exhibit 04: Five forces analysis
  • Exhibit 05: Global wafer dicing saws market by end user in 2016 (% share)
  • Exhibit 06: Global wafer dicing saws market by end user 2016-2021 ($ millions)
  • Exhibit 07: Global wafer dicing saws market by pureplay foundries 2016-2021 ($ millions)
  • Exhibit 08: Global wafer dicing saws market by IDMs ($ millions)
  • Exhibit 09: Global wafer dicing saws market by technology in 2016 ($ millions)
  • Exhibit 10: Global wafer dicing saws market by technology 2016-2021 ($ millions)
  • Exhibit 11: Global wafer dicing saws market by BGA 2016-2021 ($ millions)
  • Exhibit 12: Global wafer dicing saws by QFN 2016-2021 ($ millions)
  • Exhibit 13: Global wafer dicing saws market: Segmentation by geography in 2016 (% share)
  • Exhibit 14: Global wafer dicing saws market by geography 2016-2021 ($ millions)
  • Exhibit 15: Wafer dicing saws market in APAC 2016-2021 ($ millions)
  • Exhibit 16: Major semiconductor foundries located in the APAC (% share)
  • Exhibit 17: Wafer dicing saws market in Americas 2016-2021 ($ millions)
  • Exhibit 18: Wafer dicing saws market in EMEA 2016-2021 ($ millions)
  • Exhibit 19: Key leading countries (% share)
  • Exhibit 20: Basic criteria for selecting a dicing blade
  • Exhibit 21: Die strength comparison between mechanical blade dicing saw and laser dicing saw (Mpa)
  • Exhibit 22: Timeline for increasing wafer size 1975-2017
  • Exhibit 23: Partner cities selected in EU and China under PDSF initiative
  • Exhibit 24: DISCO Corporation: Recent developments
  • Exhibit 25: TOKYO SEIMITSU: Recent developments
  • Exhibit 26: Micross Components: Recent developments
目次
Product Code: IRTNTR12553

About Wafer Dicing Saws

A dicing saw is a saw that is used to dice, groove, or cut semiconductor wafers by using a high-speed spindle that has been fitted with a diamond blade. A dicing saw is a part of a dicing machine, which cuts these wafers into individual chips. Some of the materials that can be diced using this machine are silicon, silicon carbide, gallium nitride, gallium arsenide, ceramic, sapphire, and glass. Dicing blades of varying thickness are used to saw the wafers based on the material being sawed. Dicing equipment can be categorized into three types, namely sawing equipment, scribing equipment, and sawing accessories. Sawing accessories consist of breaking, mounting, and surface grinding.

Technavio's analysts forecast the global wafer dicing saws market to grow at a CAGR of 6.35% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global wafer dicing saws market for 2017-2021. To calculate the market size, the report considers the revenues from major wafer dicing saws vendors..

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Wafer Dicing Saws Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • DISCO Corporation
  • TOKYO SEIMITSU
  • Advanced Dicing Technology
  • Dynatex International
  • Loadpoint
  • Micross Components

Market driver

  • Growing demand for IoT
  • For a full, detailed list, view our report

Market challenge

  • Volatile nature of the semiconductor industry
  • For a full, detailed list, view our report

Market trend

  • Growth of AI
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction

  • Market outline
  • Wafer dicing saws

PART 05: Market landscape

  • Market overview
  • Market size and forecast

PART 06: Five forces analysis

  • Five forces analysis

PART 07: Market segmentation by end-user

  • Pureplay foundries
  • IDMs
  • PART 08: Market segmentation by packaging technology
  • BGA
  • QFN

PART 09: Geographical segmentation

  • Market overview
  • APAC
  • Americas
  • EMEA

PART 10: Key leading countries

  • Taiwan
  • China
  • Decision framework

PART 11: Drivers and challenges

  • Market drivers
  • Market challenges

PART 12: Market trends

  • Growth of AI
  • Increase in wafer size
  • Introduction of ultrasonic blade dicing
  • Growth of smart cities

PART 13: Vendor landscape

  • Competitive scenario

PART 14: Key vendor analysis

  • DISCO Corporation
  • TOKYO SEIMITSU
  • Advanced Dicing Technology
  • Dynatex International
  • Loadpoint
  • Micross Components

PART 15: Appendix

  • List of abbreviations
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