表紙
市場調査レポート

世界の半導体パッケージングと組立装置市場:2016年〜2020年

Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

発行 TechNavio (Infiniti Research Ltd.) 商品コード 350515
出版日 ページ情報 英文 67 Pages
即納可能
価格
本日の銀行送金レート: 1USD=102.85円で換算しております。
Back to Top
世界の半導体パッケージングと組立装置市場:2016年〜2020年 Global Semiconductor Packaging and Assembly Equipment Market 2016-2020
出版日: 2016年01月20日 ページ情報: 英文 67 Pages
概要

ICチップを機能させるためには、パッケージへの接続またはプリント回路への直接接続が必要になります。これにはダイシング、ボンディング、ダイボンディングといったプロセスが含まれ、このプロセス全体を半導体パッケージングと組立といいます。世界の半導体パッケージングと組立装置市場は、2016年〜2020年の期間中、CAGRが4.68%と大幅に増加する見込みとなっております。

当レポートでは、世界の半導体パッケージングと組立装置市場について調査分析を行い、産業の概要、地域市場の概要、市場促進因子、市場の課題、市場動向、主要ベンダーなどについてまとめています。

第1章 エグゼクティブサマリー

第2章 レポートの範囲

第3章 市場調査の方法

  • 調査方法
  • 経済指標
  • PEST分析

第4章 イントロダクション

第5章 技術の状況

  • バックエンドチップ形成
  • ウエハーレベルVSダイレベルの半導体パッケージングと組立
  • 半導体パッケージング産業のロードマップ
  • 半導体ICパッケージング産業のエコシステム

第6章 市場の状況

  • 消費者の視点
  • 市場規模と予測
  • ファイブフォース分析

第7章 市場セグメンテーション:種類別

第8章 地域別セグメンテーション

  • 市場概要
  • アジア太平洋地域
  • 北米
  • 欧州

第9章 市場促進因子とその影響

  • 高分子接着ウエハーボンディング装置の需要増加
  • IoTでの半導体ICの用途の拡大
  • 半導体ICの需要の増加
  • 半導体ICデザインの複雑性の増加
  • 電子機器の小型化

第10章 市場の課題

第11章 促進因子と課題の影響

第12章 市場動向

第13章 ベンダーの状況

第14章 主要ベンダー分析

第15章 投資家/ベンダーへの提案

第16章 付録

第17章 Technavioのその他のレポート

別紙一覧

目次
Product Code: IRTNTR7971

About Semiconductor Packaging and Assembly Equipment

For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation. The increasing application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment.

Technavio's analysts forecast the global semiconductor packaging and assembly equipment market to grow at a CAGR of 4.68% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor packaging and assembly equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sale of die-level and wafer-level packaging and assembly equipment to semiconductor manufacturers.

The market is divided into the following segments based on type:

  • Die- level packaging and assembly equipment
  • Wafer-level packaging and assembly equipment

Technavio's report, Global Semiconductor Packaging and Assembly Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Applied Materials
  • ASMPT
  • DISCO
  • EVG
  • Kulicke and Soffa Industries
  • TEL
  • Tokyo Seimitsu

Other Prominent Vendors

  • Rudolph Technologies
  • SEMES
  • Suss Microtec
  • Ultratech
  • Ulvac Technologies

Market driver

  • Rising demand for polymer adhesive wafer bonding equipment
  • For a full, detailed list, view our report

Market challenge

  • Fluctuating foreign exchange rates
  • For a full, detailed list, view our report

Market trend

  • Higher number of mergers and acquisitions (M&A)
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Top-vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators
  • PEST analysis

PART 04: Introduction

  • Key market highlights
  • Market perspective

PART 05: Technology landscape

  • Back-end chip formation
  • Wafer-level versus die-level packaging and assembly
  • Roadmap of the semiconductor packaging industry
  • Ecosystem of semiconductor IC packaging industry

PART 06: Market landscape

  • Consumer perspective
  • Market size and forecast
  • Five forces analysis

PART 07: Market segmentation by type

  • Market overview
  • Market size and forecast

PART 08: Geographical segmentation

  • Market overview
  • Global semiconductor packaging and assembly equipment market in APAC
  • Global semiconductor packaging and assembly equipment market in North America
  • Global semiconductor packaging and assembly equipment market in Europe

PART 09: Market drivers and their impact

  • Rising demand for polymer adhesive wafer bonding equipment
  • Growing application of semiconductor ICs in the IoT
  • Growing demand for semiconductor ICs
  • Increasing complexity of semiconductor IC designs
  • Increasing miniaturization of electronic devices

PART 10: Market challenges

  • Fluctuating foreign exchange rates
  • Heavy investment required
  • Cyclical nature of the semiconductor industry

PART 11: Impact of drivers and challenges

PART 12: Market trends

  • Higher number of M&A
  • Rapid technological changes in the semiconductor industry
  • High adoption of semiconductor ICs in automobiles

PART 13: Vendor landscape

  • Competitive scenario
  • Key vendors
  • Other prominent vendors

PART 14: Key vendor analysis

  • Applied Materials
  • ASM Pacific Technology (ASMPT)
  • Disco
  • EV Group (EVG)
  • Kulicke and Soffa Industries
  • Tokyo Electron Ltd. (TEL)
  • Tokyo Seimitsu

PART 15: Key suggestions for investors/vendors

PART 16: Appendix

  • List of abbreviations

PART 17: Explore Technavio

List of Exhibits

  • Exhibit 01: Global semiconductor packaging and assembly equipment market segmentation
  • Exhibit 02: Product offerings
  • Exhibit 03: Steps in back-end chip formation
  • Exhibit 04: 2.5D IC block diagram
  • Exhibit 05: 3D IC block diagram
  • Exhibit 06: Old supply chain of semiconductor IC packaging industry
  • Exhibit 07: New supply chain of semiconductor IC packaging industry
  • Exhibit 08: Global semiconductor packaging and assembly equipment market 2015-2020 ($ billions)
  • Exhibit 09: Five forces analysis
  • Exhibit 10: Global semiconductor packaging and assembly equipment market 2015
  • Exhibit 11: Global semiconductor packaging and assembly equipment market 2015-2020 (% share)
  • Exhibit 12: Global semiconductor packaging and assembly equipment market 2015-2020 ($ billions)
  • Exhibit 13: Global semiconductor packaging and assembly equipment market 2015
  • Exhibit 14: Global semiconductor packaging and assembly equipment market in APAC ($ billions)
  • Exhibit 15: Global semiconductor packaging and assembly equipment market in North America ($ billions)
  • Exhibit 16: Global semiconductor packaging and assembly equipment market in Europe ($ millions)
  • Exhibit 17: Impact of drivers on key customer segments
  • Exhibit 18: Global MEMS market 2015-2020 ($ billions)
  • Exhibit 19: Global semiconductor market trend 1992-2014 ($ billions)
  • Exhibit 20: Impact of drivers and challenges
  • Exhibit 21: Global NAND flash market 2015-2020 (% share)
  • Exhibit 22: Global car shipments 2015-2020 (shipment growth)
  • Exhibit 23: Applied Materials: Geographical segmentation by revenue 2014
  • Exhibit 24: ASMPT: Geographical segmentation by revenue 2014
  • Exhibit 25: Disco: Geographical segmentation by revenue 2014
  • Exhibit 26: Kulicke and Soffa Industries: Geographical segmentation by revenue 2014
  • Exhibit 27: TEL: Geographical segmentation by revenue 2015
  • Exhibit 28: TEL: Business performance by revenue 2012-2015
  • Exhibit 29: Tokyo Seimitsu: Geographical segmentation by revenue 2014
  • Exhibit 30: Tokyo Seimitsu: Business segmentation by revenue 2013-2015 ($ millions)
Back to Top