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市場調査レポート

ウエハーレベル製造装置の世界市場:2016-2020年

Global Wafer-level Manufacturing Equipment Market 2016-2020

発行 TechNavio (Infiniti Research Ltd.) 商品コード 350056
出版日 ページ情報 英文 81 Pages
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本日の銀行送金レート: 1USD=102.06円で換算しております。
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ウエハーレベル製造装置の世界市場:2016-2020年 Global Wafer-level Manufacturing Equipment Market 2016-2020
出版日: 2016年01月13日 ページ情報: 英文 81 Pages
概要

世界のウエハーレベル製造装置市場は、2016年から2020年にかけて4.2%のCAGRで成長すると予測されています。

当レポートでは、世界のウエハーレベル製造装置市場について調査分析し、市場規模・成長率の予測、市場成長の主要な促進要因と課題、主な市場動向、主要ベンダー、市場機会と脅威、および競合環境など、体系的な情報を提供しています。

第1章 エグゼクティブサマリー

第2章 調査範囲

  • 市場概要
  • 主要ベンダーの製品

第3章 市場調査手法

  • 調査手法
  • 経済指標
  • PEST分析

第4章 イントロダクション

第5章 技術情勢

  • 半導体IC製造工程
  • ウエハーレベル製造装置の分類

第6章 市場環境

  • 顧客展望
  • 市場規模と予測
  • ファイブフォース分析

第7章 市場区分:製品別

  • 市場概要
  • 世界のウエハーファブ装置市場
  • 世界のウエハーレベルパッケージング・組立部品装置市場

第8章 市場区分:製品別

  • 市場概要
  • 市場規模・予測

第9章 地域区分

  • 市場概要
  • 市場規模・予測

第10章 市場成長促進要因

  • 促進因子の影響力

第11章 市場課題

第12章 促進要因・課題の影響力

第13章 市場動向

第14章 ベンダー情勢

  • 競合状況
  • 主要ベンダー
  • その他の有望ベンダー

第15章 主要ベンダーの分析

  • Applied Materials
  • ASML
  • KLA-Tencor
  • Lam Research
  • Tokyo Electron

第16章 ベンダー/投資家への主な提言

第17章 付録

第18章 Technavioについて

図表一覧

目次
Product Code: IRTNTR7847

About Wafer-Level Manufacturing Equipment

The wafer-level manufacturing equipment is used for the production of semiconductor wafers, which includes processes such as lithography, etching and stripping, inspection, and packaging. The growing number of applications of semiconductor ICs across different segments has led to the increased demand for wafer-level manufacturing equipment.

Technavio's analysts forecast the global wafer-level manufacturing equipment market to grow at a CAGR of 4.2% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global wafer-level manufacturing equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of the wafer fab equipment and wafer-level packaging and assembly equipment to the following customer segments:

  • Foundries
  • Memory device manufacturers
  • Integrated device manufacturers (IDM)

Technavio's report, Global Wafer-Level Manufacturing Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Applied Materials
  • ASML
  • TEL
  • Lam Research
  • KLA-Tencor

Other Prominent Vendors

  • Dainippon
  • Advantest
  • Canon
  • Hitachi
  • JEOL.

Market driver

  • Growing applications of semiconductor ICs in IoT
  • For a full, detailed list, view our report

Market challenge

  • High initial capital investment
  • For a full, detailed list, view our report

Market trend

  • Increase in wafer size
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Top-vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators
  • PEST analysis

PART 04: Introduction

  • Key market highlights

PART 05: Technology landscape

  • Semiconductor IC manufacturing process
  • Wafer-level manufacturing equipment categories

PART 06: Market landscape

  • Customer perspective
  • Market size and forecast
  • Five forces analysis

PART 07: Market segmentation by product

  • Market overview
  • Global wafer fab equipment market
  • Global wafer-level packaging and assembly equipment market

PART 08: Market segmentation by users

  • Market overview
  • Market size and forecast

PART 09: Geographical segmentation

  • Market overview
  • Market size and forecast

PART 10: Market drivers

  • Impact of drivers

PART 11: Market challenges

PART 12: Impact of drivers and challenges

PART 13: Market trends

PART 14: Vendor landscape

  • Competitive scenario
  • Key vendors
  • Other prominent vendors

PART 15: Key vendor analysis

  • Applied Materials
  • ASML
  • KLA-Tencor
  • Lam Research
  • Tokyo Electron

PART 16: Key recommendations for vendors/investors

PART 17: Appendix

  • List of abbreviations

PART 18: Explore Technavio

List of Exhibits

  • Exhibit 01: Global wafer-level manufacturing equipment market segments: A snapshot
  • Exhibit 02: Product offerings
  • Exhibit 03: Front-end chip formation steps
  • Exhibit 04: Back-end chip formation steps
  • Exhibit 05: Wafer-level manufacturing equipment categories
  • Exhibit 06: Requirements of a manufacturing equipment
  • Exhibit 07: Global wafer-level manufacturing equipment market 2015-2020 ($ billions)
  • Exhibit 08: Five forces analysis
  • Exhibit 09: Global wafer-level manufacturing equipment market 2015
  • Exhibit 10: Global wafer fab equipment market 2015-2020 ($ billions)
  • Exhibit 11: Global wafer-level packaging and assembly equipment market 2015-2020 ($ billions)
  • Exhibit 12: Global wafer-level manufacturing equipment market by end-user 2015
  • Exhibit 13: Global wafer-level manufacturing equipment market by end-user 2015-2020
  • Exhibit 14: Global wafer-level manufacturing equipment market by end-user 2015-2020 ($ billions)
  • Exhibit 15: Global wafer-level manufacturing equipment market 2015
  • Exhibit 16: Global wafer-level manufacturing equipment market 2015-2020
  • Exhibit 17: Global wafer-level manufacturing equipment market 2015-2020 ($ billions)
  • Exhibit 18: Impact of drivers on key customer segments
  • Exhibit 19: Global MEMS market 2015-2020 ($ billions)
  • Exhibit 20: Global semiconductor market trend 1992-2014 ($ billions)
  • Exhibit 21: Impact of drivers and challenges
  • Exhibit 22: Timeline for semiconductor wafer size advancements
  • Exhibit 23: Cars shipment 2015-2020
  • Exhibit 24: Global wafer-level manufacturing equipment market by vendor 2014
  • Exhibit 25: ASML customers by end-user segment
  • Exhibit 26: Applied Materials: Business segmentation by revenue 2014
  • Exhibit 27: Applied Materials: Business segmentation by revenue 2013 and 2014 ($ billions)
  • Exhibit 28: Applied Materials: Geographical segmentation by revenue 2014
  • Exhibit 29: ASML: Product segmentation
  • Exhibit 30: ASML: Geographical segmentation by revenue 2014
  • Exhibit 31: KLA-Tencor: Business segmentation by revenue 2014
  • Exhibit 32: KLA-Tencor: Business segmentation by revenue 2013 and 2014 ($ billions)
  • Exhibit 33: KLA-Tencor: Geographical segmentation by revenue 2014
  • Exhibit 34: Lam Research: Geographical segmentation by revenue 2014
  • Exhibit 35: Lam research: Semiconductor production equipment market in South Korea and Taiwan 2013 and 2014 revenue comparison ($ billions)
  • Exhibit 36: Tokyo Electron: Business segmentation by revenue 2015
  • Exhibit 37: Tokyo Electron: Business segmentation by revenue 2014 and 2015 ($ billions)
  • Exhibit 38: Tokyo Electron: Geographical segmentation by revenue 2015
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