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市場調査レポート

ウエハー検査装置の世界市場:2019年~2023年

Global Wafer Inspection Equipment Market 2019-2023

発行 TechNavio (Infiniti Research Ltd.) 商品コード 350020
出版日 ページ情報 英文 127 Pages
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ウエハー検査装置の世界市場:2019年~2023年 Global Wafer Inspection Equipment Market 2019-2023
出版日: 2018年11月15日 ページ情報: 英文 127 Pages
概要

世界のウエハー検査装置市場は、2023年までの期間において、6%を超えるCAGR (複合年間成長率) で拡大する見込みです。

当レポートでは、世界におけるウエハー検査装置市場の現況と今後の成長見通し、技術・エンドユーザー・地域別の市場動向、市場の成長因子と課題、主要企業のプロファイルなどを提供しています。

第1章 エグゼクティブサマリー

第2章 当レポートの調査範囲

第3章 市場情勢

  • 市場エコシステム
  • 市場セグメント分析
  • 市場の特徴

第4章 市場規模

  • 市場定義
  • 市場規模
  • 市場規模と予測

第5章 ファイブフォース分析

第6章 技術別の市場分類

  • 技術別の市場分類
  • 技術別の比較
  • 光学ウエハー検査 - 市場規模と予測
  • 電子ビームウエハー検査 - 市場規模と予測
  • 市場機会

第7章 顧客情勢

第8章 エンドユーザー別の市場分類

  • エンドユーザー別の市場分類
  • エンドユーザー別の比較
  • ファウンドリ - 市場規模と予測
  • IDM - 市場規模と予測
  • 市場機会

第9章 地域情勢

  • 地域分類
  • 地域比較
  • アジア太平洋地域 - 市場規模と予測
  • 南北アメリカ - 市場規模と予測
  • 欧州・中東・アフリカ地域 - 市場規模と予測
  • 主要国
  • 市場機会

第10章 意思決定の枠組み

第11章 市場の成長因子と課題

  • 市場成長因子
  • 市場の課題

第12章 市場動向

第13章 ベンダー情勢

  • 概要
  • 創造的破壊の状況

第14章 ベンダー分析

  • 対象ベンダー
  • ベンダー分類
  • ベンダーの市場ポジショニング
  • Applied Materials
  • ASML
  • 日立ハイテクノロジーズ
  • KLA-Tencor
  • Rudolph Technologies

第15章 付録

  • 調査手法
  • 略語リスト

第16章 Technavioについて

図表
  • Exhibit 01: Global semiconductor manufacturing equipment market
  • Exhibit 02: Segments of global semiconductor manufacturing equipment market
  • Exhibit 03: Market segments
  • Exhibit 04: Market characteristics
  • Exhibit 05: Market definition - Inclusions and exclusions checklist
  • Exhibit 06: Market size 2018
  • Exhibit 07: Global market: Size and forecast 2018-2023 ($ millions)
  • Exhibit 08: Global market: Year-over-year growth 2019-2023 (%)
  • Exhibit 09: Five forces analysis 2018
  • Exhibit 10: Five forces analysis 2023
  • Exhibit 11: Bargaining power of buyers
  • Exhibit 12: Bargaining power of suppliers
  • Exhibit 13: Threat of new entrants
  • Exhibit 14: Threat of substitutes
  • Exhibit 15: Threat of rivalry
  • Exhibit 16: Market condition - Five forces 2018
  • Exhibit 17: Technology - Market share 2018-2023 (%)
  • Exhibit 18: Comparison by technology
  • Exhibit 19: Optical wafer inspection - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 20: Optical wafer inspection - Year-over-year growth 2019-2023 (%)
  • Exhibit 21: E-beam wafer inspection - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 22: E-beam wafer inspection - Year-over-year growth 2019-2023 (%)
  • Exhibit 23: Market opportunity by technology
  • Exhibit 24: Customer landscape
  • Exhibit 25: End-user - Market share 2018-2023 (%)
  • Exhibit 26: Comparison by end-user
  • Exhibit 27: Foundries - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 28: Foundries - Year-over-year growth 2019-2023 (%)
  • Exhibit 29: IDMs - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 30: IDMs - Year-over-year growth 2019-2023 (%)
  • Exhibit 31: Market opportunity by end-user
  • Exhibit 32: Market share by geography 2018-2023 (%)
  • Exhibit 33: Geographic comparison
  • Exhibit 34: Major semiconductor foundries in APAC
  • Exhibit 35: APAC - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 36: APAC - Year-over-year growth 2019-2023 (%)
  • Exhibit 37: Americas - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 38: Americas - Year-over-year growth 2019-2023 (%)
  • Exhibit 39: Major foundries in EMEA
  • Exhibit 40: EMEA - Market size and forecast 2018-2023 ($ millions)
  • Exhibit 41: EMEA - Year-over-year growth 2019-2023 (%)
  • Exhibit 42: Key leading countries
  • Exhibit 43: Market opportunity
  • Exhibit 44: Impact of drivers and challenges
  • Exhibit 45: Vendor landscape
  • Exhibit 46: Landscape disruption
  • Exhibit 47: Vendors covered
  • Exhibit 48: Vendor classification
  • Exhibit 49: Market positioning of vendors
  • Exhibit 50: Applied Materials - Vendor overview
  • Exhibit 51: Applied Materials - Business segments
  • Exhibit 52: Applied Materials - Organizational developments
  • Exhibit 53: Applied Materials - Geographic focus
  • Exhibit 54: Applied Materials - Segment focus
  • Exhibit 55: Applied Materials - Key offerings
  • Exhibit 56: ASML - Vendor overview
  • Exhibit 57: ASML - Organizational developments
  • Exhibit 58: ASML - Geographic focus
  • Exhibit 59: ASML - Key offerings
  • Exhibit 60: Hitachi High-Technologies - Vendor overview
  • Exhibit 61: Hitachi High-Technologies - Business segments
  • Exhibit 62: Hitachi High-Technologies - Organizational developments
  • Exhibit 63: Hitachi High-Technologies - Segment focus
  • Exhibit 64: Hitachi High-Technologies - Key offerings
  • Exhibit 65: KLA-Tencor - Vendor overview
  • Exhibit 66: KLA-Tencor - Organizational developments
  • Exhibit 67: KLA-Tencor - Geographic focus
  • Exhibit 68: KLA-Tencor - Key offerings
  • Exhibit 69: Rudolph Technologies - Vendor overview
  • Exhibit 70: Rudolph Technologies - Organizational developments
  • Exhibit 71: Rudolph Technologies - Geographic focus
  • Exhibit 72: Rudolph Technologies - Key offerings
目次
Product Code: IRTNTR30265

About this market:

The size of wafers has increased from 23 mm to 300 mm in the last forty years. The large surface area provided by large diameter wafers allows the manufacturing of high number of chips at low manufacturing costs. A reduction of 30% in manufacturing costs and 20%-50% in device costs can be achieved by increasing wafer size. Moreover, IC production can be optimized in foundries by making changes to the 300 mm wafer fabs. Memory Ics built on 300 mm wafers are being developed by some leading memory manufacturers such as SAMSUNG, Micron Technology, and SK HYNIX. Thus, the increasing focus on large diameter wafer size is identified as a key trend that will fuel the growth of wafer inspection equipment market during the forecast period. Technavio's analysts have predicted that the wafer inspection equipment market will register a CAGR of over 6% by 2023.

Market Overview:

Growing demand for IoT devices

The development in telecommunication standards such as 3G/4G/5G and wired communication standards have led to increased adoption of IoT devices. IoT devices can collect, record, and transmit data between connected devices on a real-time basis without the need for human interaction. The penetration of IoT devices is expected to increase during the forecast period. This will result in increasing demand for semiconductor devices, which in turn will boost the growth of wafer inspection equipment market.

Cyclic nature of the semiconductor industry

The semiconductor industry is highly volatile due to its cyclic nature. Excess production capacity, rapid price erosion of Ics, and obsolete products affects the growth of the semiconductor industry. The fluctuations in the market can lead to high inventory levels during low demand and low inventory levels during high demand. This cyclic nature of the semiconductor industry drastically impacts the demand for wafer inspection equipment and hampers market growth.

For the detailed list of factors that will drive and challenge the growth of the wafer inspection equipment market during 2019-2023, view our report.

Competitive Landscape:

The market appears to be concentrated and with the presence of few companies including Applied Materials, and ASML the competitive environment is less intense. Factors such as the increasing demand for IoT devices, will provide considerable growth opportunities to wafer inspection equipment manufacturers. Applied Materials, ASML, Hitachi High-Technologies, KLA-Tencor, and Rudolph Technologies are some of the major companies covered in this report.

TABLE OF CONTENTS

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: MARKET LANDSCAPE

  • Market ecosystem
  • Market segmentation analysis
  • Market characteristics

PART 04: MARKET SIZING

  • Market definition
  • Market sizing 2018
  • Market size and forecast 2018-2023

PART 05: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 06: MARKET SEGMENTATION BY TECHNOLOGY

  • Market segmentation by technology
  • Comparison by technology
  • Optical wafer inspection - Market size and forecast 2018-2023
  • E-beam wafer inspection - Market size and forecast 2018-2023
  • Market opportunity by technology

PART 07: CUSTOMER LANDSCAPE

PART 08: MARKET SEGMENTATION BY END-USER

  • Market segmentation by end-user
  • Comparison by end-user
  • Foundries - Market size and forecast 2018-2023
  • IDMs - Market size and forecast 2018-2023
  • Market opportunity by end-user

PART 09: GEOGRAPHIC LANDSCAPE

  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2018-2023
  • Americas - Market size and forecast 2018-2023
  • EMEA - Market size and forecast 2018-2023
  • Key leading countries
  • Market opportunity

PART 10: DECISION FRAMEWORK

PART 11: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 12: MARKET TRENDS

  • Increasing focus on large diameter wafer size
  • Growing investments in lower technology node
  • Growing investment in 3D NAND and FinFET technologies

PART 13: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption

PART 14: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Applied Materials
  • ASML
  • Hitachi High-Technologies
  • KLA-Tencor
  • Rudolph Technologies

PART 15: APPENDIX

  • Research methodology
  • List of abbreviations

PART 16: EXPLORE TECHNAVIO

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