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市場調査レポート

インターコネクトの世界市場 2015-2019年

Global Interconnect Market 2015-2019

発行 TechNavio (Infiniti Research Ltd.) 商品コード 336921
出版日 ページ情報 英文 78 Pages
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インターコネクトの世界市場 2015-2019年 Global Interconnect Market 2015-2019
出版日: 2015年08月05日 ページ情報: 英文 78 Pages
概要

プロセス・ディスクリート産業におけるITとエレクトロニクスの統合が増加したことにより、使用中の様々なデバイスを接続することが可能で、リアルタイムの情報を作業現場のオペレーターへ提供出来るインターコネクトのニーズが高まっています。世界のインターコネクト市場は、2014年から2019年の期間、8.68%のCAGRで拡大する見込みです。

当レポートでは、世界のインターコネクト市場について調査し、市場概要、製品・エンドユーザー・地域別の市場規模の推移と予測、市場成長への各種影響因子の分析、競合環境、主要ベンダーのプロファイルなどをまとめています。

第1章 エグゼクティブサマリー

第2章 略語リスト

第3章 調査範囲

  • 市場概要
  • 主な製品

第4章 市場調査手法

  • 市場調査プロセス
  • 調査手法

第5章 イントロダクション

第6章 市場情勢

  • 市場概要
  • 市場規模・予測
  • ファイブフォース分析

第7章 地域区分

  • 世界のインターコネクト市場:地域区分別
  • APAC (アジア太平洋地域) におけるインターコネクト市場
  • 欧州におけるインターコネクト市場
  • 北米におけるインターコネクト市場
  • その他地域 (ROW) におけるインターコネクト市場

第8章 市場区分:製品別

  • 世界のインターコネクト市場:製品別
  • ケーブルアセンブリ
    • 市場規模・予測
  • コネクター

第9章 市場区分:エンドユーザー別

  • 世界のインターコネクト市場:エンドユーザー別
  • 自動車
    • 市場規模・予測
  • IT
  • 通信
  • 産業
  • その他

第10章 購入基準

第11章 市場成長促進因子

第12章 成長促進因子とその影響

第13章 市場の課題

第14章 成長促進因子と課題の影響

第15章 市場動向

第16章 動向とその影響

第17章 ベンダー情勢

  • 競合状況
  • その他の有力ベンダー

第18章 主要ベンダーの分析

  • Amphenol
    • 主要データ
    • 事業概要
    • 事業区分:収益別
    • 製品区分:収益別
    • 地域区分:収益別
    • 事業戦略
    • 近年の発展動向
    • SWOT分析
  • Hon Hai (Foxconn)
  • Molex
  • TE Connectivity
  • 矢崎

第19章 関連レポート

目次
Product Code: IRTNTR6610

About Interconnect Device

Interconnect is an electrical connection that connects two or more devices. It derives its applications in the process and discrete industries by facilitating effective interconnection and smooth operations. With the increase in integration of IT and electronics in process and discrete industries, there is a growing need of interconnects which can connect various devices in use and provide real-time information to the operators on shop-floor.

Technavio's analysts forecast the global interconnect market to grow at a CAGR of 8.68% over the period 2014-2019.

Covered in this Report

The report includes the present scenario and the growth prospects of the global interconnect market for the period 2015-2019. The market can be segmented into two divisions: connectors and cable assemblies.

Technavio's report, Global Interconnect Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC, Europe, and North America; it also covers the landscape of the global interconnect market and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.

Key Regions

  • APAC
  • Europe
  • North America

Key Vendors

  • Amphenol
  • Foxconn
  • Molex
  • TE Connectivity
  • Yazaki

Other Prominent Vendors

  • 3M
  • Alstom SA
  • Belden Incorporated
  • Delphi
  • JST
  • Phoenix Contact
  • Rosenberger
  • Sumitomo Wiring Systems

Key Market Driver

  • Increasing Demand for Bandwidth
  • For a full, detailed list, view our report

Key Market Challenge

  • Absence of Uniform Standard
  • For a full, detailed list, view our report

Key Market Trend

  • Real-time Data for Industrial Applications
  • For a full, detailed list, view our report

Key Questions Answered in this Report

  • What will the market size be in 2019 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

Table of Contents

01. Executive Summary

02. List of Abbreviations

03. Scope of the Report

  • 03.1. Market Overview
  • 03.2. Product Offerings

04. Market Research Methodology

  • 04.1. Market Research Process
  • 04.2. Research Methodology

05. Introduction

06. Market Landscape

  • 06.1. Market Overview
  • 06.2. Market Size and Forecast
  • 06.3. Five Forces Analysis

07. Geographical Segmentation

  • 07.1. Global Interconnect Market by Geographical Segmentation 2014-2019
  • 07.2. Interconnect Market in the APAC Region
    • 07.2.1. Market Size and Forecast
  • 07.3. Interconnect Market in the Europe
    • 07.3.1. Market Size and Forecast
  • 07.4. Interconnect Market in North America
    • 07.4.1. Market Size and Forecast
  • 07.5. Interconnect Market in RoW
    • 07.5.1. Market Size and Forecast

08. Market Segmentation by Product

  • 08.1. Global Interconnect Market by Product 2014-2019
  • 08.2. Global Interconnect Market by Product: Cable Assembly
    • 08.2.1. Market Size and Forecast
  • 08.3. Global Interconnect Market by Product: Connector
    • 08.3.1. Market Size and Forecast

09. Market Segmentation by End-users

  • 09.1. Global Interconnect Market by End-users 2014-2019
  • 09.2. Global Interconnect Market by End-user: Automotive
    • 09.2.1. Market Size and Forecast
  • 09.3. Global Interconnect Market by End-user: IT
    • 09.3.1. Market Size and Forecast
  • 09.4. Global Interconnect Market by End-user: Telecommunication
    • 09.4.1. Market Size and Forecast
  • 09.5. Global Interconnect Market by End-user: Industrial
    • 09.5.1. Market Size and Forecast
  • 09.6. Global Interconnect Market by End-user: Others
    • 09.6.1. Market Size and Forecast

10. Buying Criteria

11. Market Growth Drivers

12. Drivers and their Impact

13. Market Challenges

14. Impact of Drivers and Challenges

15. Market Trends

16. Trends and their Impact

17. Vendor Landscape

  • 17.1. Competitive Scenario
  • 17.2. Other Prominent Vendors

18. Key Vendor Analysis

  • 18.1. Amphenol
    • 18.1.1. Key Facts
    • 18.1.2. Business Overview
    • 18.1.3. Business Segmentation by Revenue 2013
    • 18.1.4. Products Segmentation by Revenue 2012 and 2013
    • 18.1.5. Geographical Segmentation by Revenue 2013
    • 18.1.6. Business Strategy
    • 18.1.7. Recent Developments
    • 18.1.8. SWOT Analysis
  • 18.2. Hon Hai (Foxconn)
    • 18.2.1. Key Facts
    • 18.2.2. Business Overview
    • 18.2.3. Geographical Segmentation by Revenue 2013
    • 18.2.4. Recent Developments
    • 18.2.5. SWOT Analysis
  • 18.3. Molex
    • 18.3.1. Key Facts
    • 18.3.2. Business Overview
    • 18.3.3. Market Segmentation by Revenue 2013
    • 18.3.4. Product Segmentation by Revenue 2013
    • 18.3.5. Product Segmentation by Revenue 2012 and 2013
    • 18.3.6. Geographical Segmentation by Revenue 2013
    • 18.3.7. Business Strategy
    • 18.3.8. Recent Developments
    • 18.3.9. SWOT Analysis
  • 18.4. TE Connectivity
    • 18.4.1. Key Facts
    • 18.4.2. Business Overview
    • 18.4.3. Business Segmentation by Revenue 2013
    • 18.4.4. Business Segmentation by Revenue 2012 and 2013
    • 18.4.5. Geographical Segmentation by Revenue 2013
    • 18.4.6. Business Strategy
    • 18.4.7. Recent Developments
    • 18.4.8. SWOT Analysis
  • 18.5. Yazaki
    • 18.5.1. Key Facts
    • 18.5.2. Business Overview
    • 18.5.3. Key Offerings
    • 18.5.4. Net Sales by 2012 and 2013
    • 18.5.5. Geographical Segmentation by Revenue 2014
    • 18.5.6. SWOT Analysis

19. Other Reports in this Series

List of Exhibits:

  • Exhibit 1: Market Research Methodology
  • Exhibit 2: Interconnect Components
  • Exhibit 3: Global Interconnect Market
  • Exhibit 4: Global Interconnect Market 2014-2019 ($ billions)
  • Exhibit 5: Interconnect Market by Geographical Segmentation 2014-2019
  • Exhibit 6: Interconnect Market in APAC Region 2014-2019 ($ billions)
  • Exhibit 7: Interconnect Market in Europe 2014-2019 ($ billions)
  • Exhibit 8: Interconnect Market in North America 2014-2019 ($ billions)
  • Exhibit 9: Interconnect Market in RoW 2014-2019 ($ billions)
  • Exhibit 10: Market Segmentation by Product 2014
  • Exhibit 11: Market Segmentation by Product 2014-2019
  • Exhibit 12: Market Segmentation by Product 2019
  • Exhibit 13: Market Segmentation by Product: Cable Assembly 2014-2019 ($ billions)
  • Exhibit 14: Market Segmentation by Product: Cable Assembly 2014-2019 ($ billions)
  • Exhibit 15: Market Segmentation by End-users 2014-2019
  • Exhibit 16: Market Segmentation by End-user: Automotive 2014-2019 ($ billions)
  • Exhibit 17: Market Segmentation by End-user: IT 2014-2019 ($ billions)
  • Exhibit 18: Market Segmentation by End-user: Telecommunication 2014-2019 ($ billions)
  • Exhibit 19: Market Segmentation by End-user: Industrial 2014-2019 ($ billions)
  • Exhibit 20: Market Segmentation by End-user: Others 2014-2019 ($ billions)
  • Exhibit 21: Smartphone Unit Sales (millions)
  • Exhibit 22: Mobile Data Traffic (exabytes)
  • Exhibit 23: Worldwide Electric and Hybrid Vehicle Production Units (millions)
  • Exhibit 24: Amphenol: Business Segmentation by Revenue 2013
  • Exhibit 25: Amphenol: Business Segmentation by Revenue 2012 and 2013 (US$ million)
  • Exhibit 26: Amphenol: Geographical Segmentation by Revenue 2013
  • Exhibit 27: Hon Hai : Geographical Segmentation by Revenue 2013
  • Exhibit 28: Molex: Market Segmentation by Revenue 2013
  • Exhibit 29: Molex: Product Segmentation by Revenue 2013
  • Exhibit 30: Molex: Product Segmentation by Revenue 2012 and 2013 (US$ million)
  • Exhibit 31: Molex: Geographical Segmentation by Revenue 2013
  • Exhibit 32: TE Connectivity: Business Segmentation by Revenue 2013
  • Exhibit 33: TE Connectivity: Business Segmentation by Revenue 2012 and 2013 (US$ billion)
  • Exhibit 34: TE Connectivity: Geographical Segmentation by Revenue 2013
  • Exhibit 35: Yazaki: Key Offerings
  • Exhibit 36: Yazaki: Net Sales 2012 and 2013 (US$ billion)
  • Exhibit 37: Yazaki: Geographical Segmentation by Revenue 2014
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