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市場調査レポート

半導体パッケージング材料の世界市場:2017年〜2021年

Global Semiconductor Packaging Materials Market 2017-2021

発行 TechNavio (Infiniti Research Ltd.) 商品コード 325009
出版日 ページ情報 英文 136 Pages
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本日の銀行送金レート: 1USD=107.29円で換算しております。
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半導体パッケージング材料の世界市場:2017年〜2021年 Global Semiconductor Packaging Materials Market 2017-2021
出版日: 2017年11月14日 ページ情報: 英文 136 Pages
概要

半導体パッケージング材料の世界市場は、2017年から2021年にかけて5.27%の複合年間成長率(CAGR)で推移するものと予測されています。

当レポートは半導体パッケージング材料の世界市場を調査し、市場の概要、材料タイプ・地域別の市場動向、市場規模の推移と予測、顧客動向、市場促進要因と課題の分析、競合情勢、主要ベンダーのプロファイルなど、体系的な情報を提供しています。

第1章 エグゼクティブサマリー

第2章 調査範囲

第3章 市場調査手法

第4章 イントロダクション

第5章 市場概要

  • 市場エコシステム
  • 市場の特徴
  • 市場区分の分析

第6章 市場規模

  • 市場の定義
  • 市場規模
  • 市場規模の予測

第7章 ファイブフォース分析

第8章 顧客動向

第9章 半導体パッケージング材料の世界市場:材料タイプ別

  • 市場区分:材料タイプ別
  • 有機基板
  • リードフレーム
  • ボンディングワイヤ
  • その他
  • 材料タイプ別の市場機会

第10章 半導体パッケージング材料の世界市場:地域別

  • 市場区分:地域別
  • アジア太平洋
  • 南北アメリカ
  • 欧州・中東・アフリカ
  • 市場機会

第11章 意思決定の枠組み

第12章 市場促進要因と課題

  • 市場促進要因
  • 課題

第13章 市場動向

  • フリップチップ、SiP、鉛フリーパッケージソリューションの導入拡大
  • スルーホール実装(THM)に勝る表面実装(SM)の需要
  • LSIチップパッケージングに対する注目
  • 自動車向け半導体ICの導入拡大

第14章 ベンダー環境

  • 競合情勢

第15章 ベンダー分析

  • 調査対象のベンダー
  • ベンダーの分類
  • ベンダーの市場競争力
  • Amkor Technology
  • DuPont
  • Henkel
  • Honeywell
  • 京セラ
  • 凸版印刷

第16章 付録

図表
  • Exhibit 01: Steps in back-end chip formation
  • Exhibit 02: Roadmap of semiconductor packaging
  • Exhibit 03: Old supply chain of semiconductor IC packaging industry
  • Exhibit 04: New supply chain of semiconductor IC packaging industry
  • Exhibit 05: Related market
  • Exhibit 06: Semiconductor packaging materials technologies
  • Exhibit 07: Global semiconductor packaging materials market overview
  • Exhibit 08: Market characteristics
  • Exhibit 09: Market segments
  • Exhibit 10: Market definition - Inclusions and exclusions checklist
  • Exhibit 11: Market size 2016
  • Exhibit 12: Validation techniques employed for market sizing 2016
  • Exhibit 13: Global semiconductor packaging materials - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 14: Global semiconductor packaging materials market- Year-over-year growth 2017-2021 (%)
  • Exhibit 15: Five forces analysis 2016
  • Exhibit 16: Five forces analysis 2021
  • Exhibit 17: Bargaining power of buyers
  • Exhibit 18: Bargaining power of suppliers
  • Exhibit 19: Threat of new entrants
  • Exhibit 20: Threat of substitutes
  • Exhibit 21: Threat of rivalry
  • Exhibit 22: Market condition in 2016 - Five forces
  • Exhibit 23: Customer landscape
  • Exhibit 24: Global semiconductor packaging materials by market type 2016-2021 (%)
  • Exhibit 25: Comparison by end-user
  • Exhibit 26: Organic substrates - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 27: Organic substrates - Year-over-year growth 2017-2021 (%)
  • Exhibit 28: Lead frames - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 29: Lead frames - Year-over-year growth 2017-2021 (%)
  • Exhibit 30: Bonding wires - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 31: Bonding wires - Year over year growth 2017-2021 (%)
  • Exhibit 32: Others - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 33: Others - Year-over-year growth 2017-2021 (%)
  • Exhibit 34: Market opportunity by material type
  • Exhibit 35: Global semiconductor packaging materials market share by geography 2016-2021 (%)
  • Exhibit 36: Regional comparison
  • Exhibit 37: APAC - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 38: APAC - Year-over-year growth 2017-2021 (%)
  • Exhibit 39: Top 3 countries in Americas
  • Exhibit 40: Americas - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 41: Americas - Year-over-year growth 2017-2021 (%)
  • Exhibit 42: Top 3 countries in EMEA
  • Exhibit 43: EMEA - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 44: EMEA - Year-over-year growth 2017-2021 (%)
  • Exhibit 45: Top 3 countries in APAC
  • Exhibit 46: Vendor classification
  • Exhibit 47: Market positioning of vendors
  • Exhibit 48: Amkor Technology overview
  • Exhibit 49: Amkor Technology - Business segments
  • Exhibit 50: Amkor Technology- Organizational developments
  • Exhibit 51: Amkor Technology- Geographic focus
  • Exhibit 52: Amkor Technology - Business segment focus
  • Exhibit 53: Amkor Technology - Key application packaging products
  • Exhibit 54: DuPont overview
  • Exhibit 55: DuPont - Business segments
  • Exhibit 56: Dupont - Organizational developments
  • Exhibit 57: Dupont - Geographic focus
  • Exhibit 58: Dupont - Segment focus
  • Exhibit 59: Dupont - Key offerings
  • Exhibit 60: Henkel overview
  • Exhibit 61: Henkel - Business segments
  • Exhibit 62: Henkel - Organizational developments
  • Exhibit 63: Henkel - Geographic focus
  • Exhibit 64: Henkel - Segment focus
  • Exhibit 65: Henkel - Key offerings
  • Exhibit 66: Honeywell overview
  • Exhibit 67: Honeywell - Business segments
  • Exhibit 68: Honeywell - Organizational developments
  • Exhibit 69: Honeywell - Geographic focus
  • Exhibit 70: Honeywell - Segment focus
  • Exhibit 71: Honeywell - Key offerings
  • Exhibit 72: Kyocera overview
  • Exhibit 73: Kyocera - Business segments
  • Exhibit 74: Kyocera - Organizational developments
  • Exhibit 75: Kyocera - Geographic focus
  • Exhibit 76: Kyocera - Segment focus
  • Exhibit 77: Kyocera - Key offerings
  • Exhibit 78: Toppan Printing overview
  • Exhibit 79: Toppan Printing - Business segments
  • Exhibit 80: Toppan Printing - Organizational developments
  • Exhibit 81: Toppan Printing - Geographic focus
  • Exhibit 82: Toppan Printing - Segment focus
  • Exhibit 83: Toppan Printing - Key offerings
目次
Product Code: IRTNTR15950

About Semiconductor Packaging Materials

Semiconductor packages are plastic, ceramic, and metal components that are not only protect fabricated integrated circuits (ICs) on the semiconductor die, but also act as an interconnect between the printed circuit board (PCB) and the die during shipping and handling. These packaging materials safeguard and protect the die from the external mechanical impacts and corrosion, besides acting as an electrically conductive interconnection with excellent signal propagation properties. Excessive heat in the integrated circuit is dissipation through attached heat spreaders. Semiconductor packaging components vary in dimensions and functionality and are mainly organic substrates, bonding wires, encapsulation resins, lead frames, thermal interface materials, die attach materials, and solder balls. The key customers of these packaging materials are the electronics industry, automotive sector, fabless semiconductor companies, packaging material suppliers, and packaging subcontractors.

Technavio's analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 5.27% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for 2017-2021. To calculate the market size, the report considers the revenue generated by vendors through the sales of semiconductor packaging materials which are organic substrates, lead frames, bonding wires, encapsulation resins, die attach materials, solder balls, thermal interface materials, and WLP dielectrics.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Semiconductor Packaging Materials Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Amkor Technology
  • DuPont
  • Henkel
  • Honeywell
  • Kyocera
  • Toppan Printing

Other Prominent Vendors

  • Hitachi Chemical
  • ASM Pacific Technology
  • BASF
  • Beijing Kehua New Chemical Technology

Market driver

  • Increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT
  • For a full, detailed list, view our report

Market challenge

  • Capital-intensive market
  • For a full, detailed list, view our report

Market trend

  • Increase in adoption of flip-chip, Sip, lead-free packaging solutions
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: INTRODUCTION

  • Market outline

PART 05: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 06: MARKET SIZING

  • Market definition
  • Market sizing 2016
  • Market size and forecast 2016-2021

PART 07: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 08: CUSTOMER LANDSCAPE

PART 09: MARKET SEGMENTATION BY MATERIAL TYPE

  • Segmentation by material type
  • Organic substrates - Market size and forecast 2016-2021
  • Lead frames - Market size and forecast 2016-2021
  • Bonding wires - Market size and forecast 2016-2021
  • Others - Market size and forecast 2016-2021
  • Market opportunity by type of materials

PART 10: REGIONAL LANDSCAPE

  • Geographical segmentation
  • APAC - Market size and forecast 2016-2021
  • Americas - Market size and forecast 2016-2021
  • EMEA - Market size and forecast 2016-2021
  • Market opportunity

PART 11: DECISION FRAMEWORK

PART 12: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 13: MARKET TRENDS

  • Increase in adoption of flip-chip, Sip, lead-free packaging solutions
  • Growing preference of SMT (surface mount technology) over older through-hole technology and surge in popularity of redistributed chip packaging
  • Surge in adoption of semiconductor ICs for automobiles and shift toward copper as bonding wire material

PART 14: VENDOR LANDSCAPE

  • Competitive scenario

PART 15: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Amkor Technology
  • DuPont
  • Henkel
  • Honeywell
  • Kyocera
  • Toppan Printing

PART 16: APPENDIX

  • List of abbreviations
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