表紙
市場調査レポート

世界のウエハレベルパッケージング装置(WLP装置)市場

Global Wafer-level Packaging Equipment Market 2015-2019

発行 TechNavio (Infiniti Research Ltd.) 商品コード 294963
出版日 ページ情報 英文 85 Pages
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世界のウエハレベルパッケージング装置(WLP装置)市場 Global Wafer-level Packaging Equipment Market 2015-2019
出版日: 2015年01月21日 ページ情報: 英文 85 Pages
概要

ICは、非常に繊細なので、汚染による故障を引き起こす傾向があります。そのような懸念を払拭するため、シリコンチップやICは、パッケージングマテリアル(包装材料)を使用して保護されています。世界のウエハレベルパッケージング(WLP)装置市場は、2014年〜2019年のCAGRで、0.1%の成長が見込まれています。

当レポートでは、世界のウエハレベルパッケージング(WLP)装置市場について調査分析し、市場規模と成長率、市場動向、市場促進要因・課題、市場機会について検証するほか、主要ベンダーなどについて、体系的な情報を提供しています。

第1章 エグゼクティブサマリー

第2章 略語リスト

第3章 調査範囲

  • 市場概要
  • 主な製品

第4章 市場調査手法

  • 市場調査プロセス
  • 調査手法

第5章 イントロダクション

第6章 産業概要

  • 半導体産業の概要
    • 半導体バリューチェーン
  • 半導体市場の構造
  • 世界の半導体市場の概要
    • 半導体市場の地域区分

第7章 市場情勢

  • 市場規模と予測
  • ファイブフォース分析

第8章 地域区分

  • 世界のウエハレベルパッケージング装置市場:地域区分別
  • アジア太平洋地域のウエハレベルパッケージング装置市場
    • 市場規模と予測
  • 南北アメリカのウエハレベルパッケージング装置市場
    • 市場規模と予測
  • 欧州・中東・アフリカ地域のウエハレベルパッケージング装置市場
    • 市場規模と予測

第9章 主要国

  • 台湾
  • 韓国
  • 米国

第10章 購入基準

第11章 市場成長促進要因

第12章 促進要因とその影響

第13章 市場の課題

第14章 促進要因と課題の影響

第15章 市場動向

第16章 動向とその影響

第17章 ベンダー情勢

  • 競合シナリオ
  • 市場シェア分析
  • その他の有力ベンダー

第18章 主要ベンダーの分析

  • Applied Materials
  • DISCO
  • EV
  • 東京エレクトロン
  • 東京精密

第19章 市場サマリー

  • 成長推進要因
  • 成長阻害要因
  • 継続的な動向
  • 市場の魅力

第20章 関連レポート

図表

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目次
Product Code: IRTNTR5108

About Wafer-level Packaging Equipment

ICs are very delicate in nature, therefore, prone to contamination that can cause malfunctioning. To eliminate such issues, silicon chips or ICs are protected by using packaging materials. Wafer level packaging is one such type of packaging, which involves the packaging of individual ICs using best fit packaging processes conducted at wafer level manufacturing in semiconductor production process.

TechNavio's analysts forecast the Global Wafer-level Packaging Equipment market to grow at a CAGR of 0.1 percent over the period 2014-2019.

Covered in this Report

This report covers the present scenario and the growth prospects of the Global Wafer-level Packaging Equipment market for the period 2015-2019. This report considers 2014 as the base year and provides data for the trailing 12 months. To calculate the market size, the report considers revenue generated from the sales of wafer-level packaging equipment worldwide. However, the report does not take into consideration the following while calculating the market size:

  • Support or maintenance services that are offered for/with wafer-level packaging equipment
  • Components that are used in the production of wafer-level packaging equipment
  • Aftermarket sales of wafer-level packaging equipment

Key Regions

  • Americas
  • APAC
  • EMEA

Key Vendors

  • Applied Materials
  • Disco
  • EV Group
  • Tokyo Electron
  • Tokyo Seimitsu

Other Prominent Vendors

  • Rudolph Technologies
  • SEMES
  • Suss Microtec
  • Ultratech
  • ULVAC

Market Driver

  • Increased Demand for Smartphones and Tablets
  • For a full, detailed list, view our report

Market Challenge

  • Rapid Changes in Technology
  • For a full, detailed list, view our report

Market Trend

  • Short Replacement Cycle of Portable Electronic Devices
  • For a full, detailed list, view our report

Key Questions Answered in this Report

  • What will the market size be in 2019 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

Table of Contents

01. Executive Summary

02. List of Abbreviations

03. Scope of the Report

  • 03.1. Market Overview
  • 03.2. Product Offerings

04. Market Research Methodology

  • 04.1. Market Research Process
  • 04.2. Research Methodology

05. Introduction

06. Industry Overview

  • 06.1. Semiconductor Industry Overview
    • 06.1.1. Semiconductor Value Chain
  • 06.2. Structure of Semiconductor Market
  • 06.3. Global Semiconductor Market Overview
    • 06.3.1. Geographical Segmentation of Semiconductor Market 2005-2012

07. Market Landscape

  • 07.1. Market Size and Forecast
  • 07.2. Five Forces Analysis

08. Geographical Segmentation

  • 08.1. Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019
  • 08.2. Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (percentage share and revenue split)
  • 08.3. Wafer-level Packaging Equipment Market in APAC Region
    • 08.3.1. Market Size and Forecast
  • 08.4. Wafer-level Packaging Equipment Market in Americas
    • 08.4.1. Market Size and Forecast
  • 08.5. Wafer-level Packaging Equipment Market in EMEA Region
    • 08.5.1. Market Size and Forecast

09. Key Leading Countries

  • 09.1. Taiwan
  • 09.2. South Korea
  • 09.3. US

10. Buying Criteria

11. Market Growth Drivers

12. Drivers and their Impact

13. Market Challenges

14. Impact of Drivers and Challenges

15. Market Trends

16. Trends and their Impact

17. Vendor Landscape

  • 17.1. Competitive Scenario
  • 17.2. Market Share Analysis 2014
  • 17.3. Other Prominent Vendors

18. Key Vendor Analysis

  • 18.1. Applied Materials
    • 18.1.1. Key Facts
    • 18.1.2. Business Overview
    • 18.1.3. Business Segmentation by Revenue 2013
    • 18.1.4. Business Segmentation by Revenue 2011-2013
    • 18.1.5. Geographical Segmentation by Revenue 2013
    • 18.1.6. Business Strategy
    • 18.1.7. Recent Developments
    • 18.1.8. SWOT Analysis
  • 18.2. DISCO
    • 18.2.1. Key Facts
    • 18.2.2. Business Overview
    • 18.2.3. Product Segmentation by Revenue 2013
    • 18.2.4. Product Segmentation by Revenue 2012 and 2013
    • 18.2.5. Geographical Segmentation by Revenue 2013
    • 18.2.6. Business Strategy
    • 18.2.7. Recent Developments
    • 18.2.8. SWOT Analysis
  • 18.3. EV
    • 18.3.1. Key Facts
    • 18.3.2. Business Overview
    • 18.3.3. Product Segmentation 2013
    • 18.3.4. Recent Developments
    • 18.3.5. SWOT Analysis
  • 18.4. Tokyo Electron
    • 18.4.1. Key Facts
    • 18.4.2. Business Overview
    • 18.4.3. Business Segmentation by Revenue 2013
    • 18.4.4. Business Segmentation by Revenue 2011-2013
    • 18.4.5. Geographical Segmentation by Revenue 2013
    • 18.4.6. Business Strategy
    • 18.4.7. Recent Developments
    • 18.4.8. SWOT Analysis
  • 18.5. Tokyo Seimitsu
    • 18.5.1. Key Facts
    • 18.5.2. Business Overview
    • 18.5.3. Product Segmentation by Revenue 2013
    • 18.5.4. Product Segmentation by Revenue 2012 and 2013
    • 18.5.5. Geographical Segmentation by Revenue 2013
    • 18.5.6. Business Strategy
    • 18.5.7. Recent Developments
    • 18.5.8. SWOT Analysis

19. Market Summary

  • 19.1. Growth Propellers
    • 19.1.1. Expansion Plans
    • 19.1.2. Replacement of Old Equipment
  • 19.2. Growth Inhibitor
    • 19.2.1. Cyclic Nature of Semiconductor Industry
    • 19.2.2. Rapid Advances in Technology
  • 19.3. Ongoing Trends
    • 19.3.1. Increasing Number of Innovations
    • 19.3.2. Increasing Penetration of Clean Energy Devices
    • 19.3.3. Increasing Focus on Improving Production Yield
    • 19.3.4. Increasing Adoption of Semiconductors in Automotive Sector
  • 19.4. Market Attractiveness

20. Other Reports in this Series

List of Exhibits

  • Exhibit 1: Market Research Methodology
  • Exhibit 2: Semiconductor Value Chain
  • Exhibit 3: Front-end Process
  • Exhibit 4: Back-end Process
  • Exhibit 5: Structure of Semiconductor Market
  • Exhibit 6: Global Semiconductor Market 2014
  • Exhibit 7: Global Semiconductor Market by Geographical Segmentation 2005-2012
  • Exhibit 8: Global Wafer-level Packaging Equipment Market 2013-2018 (US$ million)
  • Exhibit 9: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014
  • Exhibit 10: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (percentage share)
  • Exhibit 11: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (US$ million)
  • Exhibit 12: Comparison of Geographies by CAGR 2014-2019
  • Exhibit 13: Wafer-level Packaging Equipment Market in Taiwan 2014-2019 (US$ million)
  • Exhibit 14: Wafer-level Packaging Equipment Market in South Korea 2014-2019 (US$ million)
  • Exhibit 15: Wafer-level Packaging Equipment Market in US 2014-2019 (US$ million)
  • Exhibit 16: CAGR Comparison between Key Leading Countries 2014-2019
  • Exhibit 17: Global Smartphone Market by Unit Shipments 2013-2019 (billion units)
  • Exhibit 18: Global Tablets Market by Unit Shipments 2013-2019 (million units)
  • Exhibit 19: Global Wafer-level Packaging Equipment Market by Vendor Ranking 2014
  • Exhibit 20: Applied Materials: Business Segmentation by Revenue 2013
  • Exhibit 21: Applied Materials: Business Segmentation by Revenue 2011-2013 (US$ million)
  • Exhibit 22: Applied Materials: Geographical Segmentation by Revenue 2013
  • Exhibit 23: DISCO: Product Segmentation by Revenue 2013
  • Exhibit 24: DISCO: Product Segmentation by Revenue 2012 and 2013 (US$ million)
  • Exhibit 25: DISCO: Geographical Segmentation by Revenue 2013
  • Exhibit 26: EV: Product Segmentation 2013
  • Exhibit 27: Tokyo Electron: Business Segmentation by Revenue 2013
  • Exhibit 28: Tokyo Electron: Business Segmentation by Revenue 2011-2013 (US$ million)
  • Exhibit 29: Tokyo Electron: Geographical Segmentation by Revenue 2013
  • Exhibit 30: Tokyo Seimitsu: Business Segmentation by Revenue 2013
  • Exhibit 31: Tokyo Seimitsu: Business Segmentation by Revenue 2011-2013 (US$ million)
  • Exhibit 32: Tokyo Seimitsu: Geographical Segmentation by Revenue 2013
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