Global 3D IC Market 2015-2019
|発行||TechNavio (Infiniti Research Ltd.)||商品コード||261565|
|出版日||ページ情報||英文 69 Pages
|3D ICの世界市場：2015年〜2019年 Global 3D IC Market 2015-2019|
|出版日: 2015年12月09日||ページ情報: 英文 69 Pages||
Technavio's research analyst predicts the global 3D IC market to grow at a CAGR above 79% during the forecast period. The demand for compact and high-performance ICs in smartphones, tablet PCs, smart TVs, automotive products, and heavy equipment is the primary growth driver for this market. In comparison to 2D ICs, they have better performance and high bandwidth. Moreover, 3D ICs have a lesser number of interconnections between the packages, consumes less power, and require less space on electronic boards.
The high proliferation of IoT devices is expected to boost the market growth during the forecast period. Vendors in IoT market are constantly innovating in designing, manufacturing, and packaging. This enables them to come up with new IoT products in different verticals such as consumer electronics, healthcare, and manufacturing. 3D MEMS and sensors are used to capture data in a real-time scenario, which helps the company in increasing the returns by streamlining the process, increasing productivity, and enabling predictive maintenance. They also reduce the maintenance cost and the possibility of a sudden stop of work due to machinery failure.
The memory product segment dominated the market during 2014, with a market share of over 62%. Technological advances such as high storage capacity and less power consumption are increasing the adoption of 3D NAND and DDR4 DRAM in smartphones, tablet PCs, consumer electronics, and automotive products, thereby driving the growth of the 3D memory chips.
APAC accounted for 52% of the market share during 2014 and is expected to grow at a CAGR of 86% during the forecast period. The high growth in memory product segment and presence of several prominent manufacturers in the mobile and consumer electronics market such as Xiaomi, Samsung, LG, HTC, ZTE, Huawei, Lenovo, and Sony is expected to create a high demand for 3D ICs in the region during the forecast period.
The global 3D IC market is at the nascent stage and manufacturers are aiming for the first mover advantage by making an early entry into the market. The vendors in the market compete on the basis of price, quality, innovation, and technology. Collaborations between OSAT, IDMs, and OEMs is expected to bring down the cost of 3D ICs in the coming years.
The leading vendors in the market are -
Other prominent vendors in the market include Intel, Micron, SanDisk, SK Hynix, STATS ChipPAC, United Microelectronics, and Xilinx.