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市場調査レポート

半導体製造設備の世界市場 - 2016〜2020年

Global Semiconductor Capital Equipment Market 2016-2020

発行 TechNavio (Infiniti Research Ltd.) 商品コード 239351
出版日 ページ情報 英文 58 Pages
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半導体製造設備の世界市場 - 2016〜2020年 Global Semiconductor Capital Equipment Market 2016-2020
出版日: 2016年06月09日 ページ情報: 英文 58 Pages
概要

半導体製造設備の世界市場は2016年から2020年までの期間において4.02%のCAGR (年平均成長率) にて成長が続くものと予測されます。

当レポートでは、半導体製造設備の世界市場を取り上げ、市場成長促進要因や市場が抱える課題、市場動向、また市場競争状況に関する詳細な調査を通じて、市場の現状分析ならびに2016年から2020年までの将来予測を行っています。

第1章 エグゼクティブ・サマリー

第2章 当レポートのカバー範囲

  • 主要ベンダー製品

第3章 市場調査手法

  • 調査手法
  • 経済指標

第4章 序論

  • 市場に関する重要事項

第5章 半導体製造設備業界の概要

  • 半導体産業バリューチェーン

第6章 半導体製造設備の市場概況

  • 市場概要
  • 市場規模および将来予測
  • ファイブフォースモデル

第7章 半導体製造設備の装置タイプ別市場分類

  • 市場概要
  • 市場規模および将来予測

第8章 半導体製造設備のエンドユーザー別市場分類

  • 市場概要
  • 市場規模および将来予測

第9章 半導体製造設備の地域別市場分類

  • 市場概要
  • 市場規模および将来予測

第10章 半導体製造設備の市場成長促進要因

  • 半導体世界市場の持続性を持った成長
  • 世界的なファブ (マイクロチップ製造工場) 数の増加
  • 小型電子デバイス製造のための高い工作精度の必要性
  • 市場投入までの期間の短縮化

第11章 市場成長促進要因がもたらす影響

第12章 半導体製造設備市場の課題

  • ベンダーに加わる絶え間ない価格的プレッシャ
  • 半導体産業の景況の周期性
  • 世界経済と外国為替レートの変動
  • 限られた主要サプライヤへの依存度の強さ

第13章 市場成長促進要因と市場の課題とがもたらす影響

第14章 半導体製造設備の市場動向

  • 急速な技術進歩
  • 自動車用半導体デバイスの使用量の増大
  • ファブレス半導体企業数の増加

第15章 ベンダー情勢

  • 市場競争シナリオ
  • 現在のベンダーシナリオ
  • 他の有力ベンダー

第16章 付録

第17章 Technavioについて

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目次
Product Code: IRTNTR9284

About the Semiconductor Capital Equipment Market

The semiconductor capital equipment has a bigger role in the making of integrated devices, such as ICs, which are based in a fab. The different types of equipment which come under semiconductor capital equipment include the following:

  • Wafer manufacturing equipment
  • ATE
  • Assembling and packaging equipment
  • Fab related equipment
  • Memory testing equipment
  • Chip handler equipment
  • Logic test equipment
  • Prober equipment
  • Sputter equipment
  • Thin film deposition equipment

Technavio's analysts forecast the global semiconductor capital equipment market to grow at a CAGR of 4.02% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor capital equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from each equipment of the semiconductor production process. This equipment includes the following:

  • Wafer-level manufacturing equipment
  • Die-level packaging and assembly equipment
  • ATE

The market is divided into the following segments based on geography:

  • APAC
  • Europe
  • North America
  • ROW

Technavio's report, Global Semiconductor Capital Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • ASML
  • Applied Materials
  • LAM Research
  • Tokyo Electron

Other Prominent Vendors

  • Advantest
  • ASM International
  • Hitachi High-Technologies
  • KLA-Tencor
  • Nikon
  • Screen Holdings
  • Teradyne

Market driver

  • Need for high precision tolerance for miniaturized electronic devices
  • For a full, detailed list, view our report

Market challenge

  • Cyclical nature of the semiconductor industry
  • For a full, detailed list, view our report

Market trend

  • Increased use of semiconductor devices in automobiles
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Top-vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Industry overview

  • Semiconductor value chain

PART 06: Market landscape

  • Market overview
  • Market size and forecast
  • Five forces model

PART 07: Market segmentation by equipment type

  • Market overview
  • Market size and forecast

PART 08: Market segmentation by end user

  • Market overview
  • Market size and forecast

PART 09: Geographical segmentation

  • Market overview
  • Market size and forecast

PART 10: Market drivers

  • Sustainable growth in global semiconductor industry
  • Increase in number of fabs worldwide
  • Need for high precision tolerance for miniaturized electronic devices
  • Shorter time to market

PART 11: Impact of drivers

PART 12: Market challenges

  • Continuous price pressure on the vendors
  • Cyclical nature of the semiconductor industry
  • Fluctuations in global economy and foreign exchange rates
  • Dependency on limited key suppliers

PART 13: Impact of drivers and challenges

PART 14: Market trends

  • Rapid technological advances
  • Increased use of semiconductor devices in automobiles
  • Rise in the number of fabless semiconductor companies

PART 15: Vendor landscape

  • Competitive scenario
  • Current scenario
  • Other prominent vendors

PART 16: Appendix

  • Summary of figures
  • List of abbreviations

PART 17: Explore Technavio

List of Exhibits

  • Exhibit 01: Product offerings
  • Exhibit 02: Semiconductor value chain
  • Exhibit 03: Description of the processes of the semiconductor value chain
  • Exhibit 04: Significance of semiconductor equipment buying parameter for the customer segment
  • Exhibit 05: Global semiconductor capital equipment market segments: An overview
  • Exhibit 06: Global semiconductor capital equipment market 2015-2020 ($ billions)
  • Exhibit 07: Five forces model
  • Exhibit 08: Global semiconductor capital equipment market 2015 by equipment type (% share)
  • Exhibit 09: Global semiconductor capital equipment market 2020 by equipment type (% share)
  • Exhibit 10: Global semiconductor capital equipment market 2015-2020 by equipment type ($ billions)
  • Exhibit 11: Contribution of different wafer-level manufacturing equipment 2015-2020 (% share)
  • Exhibit 12: Wafer fabrication process steps
  • Exhibit 13: Global smartphone shipment 2015-2020 (% share)
  • Exhibit 14: Global semiconductor capital equipment market by end-user 2015 (% share)
  • Exhibit 15: Global semiconductor capital equipment market by end-user 2015-2020 (% share)
  • Exhibit 16: Global semiconductor capital equipment market by end-user 2015-2020 ($ billions)
  • Exhibit 17: Global semiconductor capital equipment market by geography 2015 (% share)
  • Exhibit 18: Global semiconductor capital equipment market by geography 2015-2020 (% share)
  • Exhibit 19: Global semiconductor capital equipment market by geography 2015-2020 ($ billions)
  • Exhibit 20: Key leading countries of APAC
  • Exhibit 21: CAGR of LED chip, sensor, DRAM, and NAND market 2015-2020
  • Exhibit 22: Global NAND flash market 2015-2020 (% share)
  • Exhibit 23: Impact of drivers
  • Exhibit 24: Global semiconductor market trend 1990-2015 ($ billions)
  • Exhibit 25: Impact of drivers and challenges
  • Exhibit 26: Timeline for semiconductor wafer size advances
  • Exhibit 27: Car shipment 2015-2020
  • Exhibit 28: Principle parameters of competition
  • Exhibit 29: R&D spending by prominent vendors in the global semiconductor capital equipment market 2015
  • Exhibit 30: Global semiconductor capital equipment market share by vendor contribution 2015 (% share)
  • Exhibit 31: ASML customers by end-user segment
  • Exhibit 32: Major customers of Lam Research
  • Exhibit 33: Key vendors
  • Exhibit 34: Key news
  • Exhibit 35: Other prominent vendors
  • Exhibit 36: Summary of figures
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