株式会社グローバルインフォメーション
TEL: 044-952-0102
表紙SALE
市場調査レポート

半導体資本設備の世界市場:2017年〜2021年

Global Semiconductor Capital Equipment Market 2017-2021

発行 TechNavio (Infiniti Research Ltd.) 商品コード 239351
出版日 ページ情報 英文 81 Pages
即納可能
価格
本日の銀行送金レート: 1USD=114.65円で換算しております。
SALE 2017年12月31日まで 期間限定キャンペーン
Back to Top
半導体資本設備の世界市場:2017年〜2021年 Global Semiconductor Capital Equipment Market 2017-2021
出版日: 2017年07月12日 ページ情報: 英文 81 Pages
概要

半導体資本設備の世界市場は、2017年から2021年までの期間、6.36%のCAGR (複合年間成長率) で拡大することが予測されています。

当レポートでは、世界における半導体資本設備市場の現状分析と今後の予測を装置タイプ、エンドユーザーおよび地域別に提供しており、市場の成長因子と課題、主な動向、主要ベンダーのプロファイルなどとともにお届けします。

第1章 エグゼクティブサマリー

第2章 当レポートの調査範囲

第3章 調査手法

第4章 イントロダクション

  • 市場概要
  • 半導体産業のバリューチェーン

第5章 市場情勢

  • 市場概要
  • 市場規模と予測
  • ファイブフォース分析

第6章 装置タイプ別の市場分類

  • 世界の半導体資本設備市場:タイプ別
  • ウエハレベル製造装置
  • ダイレベルパッケージング・アセンブリー装置
  • 自動検査装置

第7章 エンドユーザー別の市場分類

  • 世界の半導体資本設備市場:エンドユーザー別
  • ファウンドリ
  • メモリ製造業者
  • IDM

第8章 地理区分

  • 世界の半導体資本設備市場:地域別
  • アジア太平洋地域
  • 南北アメリカ
  • 欧州・中東・アフリカ地域

第9章 主要国

  • 主要国
  • 台湾
  • 韓国
  • 日本
  • 中国

第10章 意思決定の枠組み

第11章 市場の成長因子と課題

  • 市場成長因子
  • 市場の課題

第12章 市場動向

第13章 ベンダー情勢

  • 競合シナリオ
  • 主要ベンダー
  • その他の有力ベンダー

第14章 付録

  • 略語リスト
図表
  • Exhibit 01: Semiconductor industry value chain
  • Exhibit 02: Description of semiconductor industry value chain
  • Exhibit 03: Segmentation of global semiconductor capital equipment market
  • Exhibit 04: Global semiconductor capital equipment market 2016-2021 ($ billions)
  • Exhibit 05: Requirements for semiconductor capital equipment
  • Exhibit 06: Factors influencing the purchase decisions
  • Exhibit 07: Five forces analysis
  • Exhibit 08: Global semiconductor capital equipment market by type 2016-2021 (% share of revenue)
  • Exhibit 09: Global semiconductor capital equipment market by type 2016-2021 ($ billions)
  • Exhibit 10: Global semiconductor capital equipment by wafer-level manufacturing equipment market 2016-2021 ($ billions)
  • Exhibit 11: Global semiconductor capital equipment market by die-level packaging and assembly equipment 2016-2021 ($ billions)
  • Exhibit 12: Global semiconductor capital equipment market by automated test equipment 2016-2021 ($ billions)
  • Exhibit 13: Global semiconductor capital equipment market by end-user 2016-2021 (% share of revenue)
  • Exhibit 14: Global semiconductor capital equipment market by end-user 2016-2021 ($ billions)
  • Exhibit 15: Global semiconductor capital equipment market by foundries 2016-2021 ($ billions)
  • Exhibit 16: Global semiconductor capital equipment market by memory manufacturers 2016-2021 ($ billions)
  • Exhibit 17: Global semiconductor capital equipment market by IDMs 2016-2021 ($ billions)
  • Exhibit 18: Global semiconductor capital equipment market by geography 2016-2021 (% share of revenue)
  • Exhibit 19: Global semiconductor capital equipment market by geography 2016-2021 ($ billions)
  • Exhibit 20: Semiconductor capital equipment market in APAC 2016-2021 ($ billions)
  • Exhibit 21: Global semiconductor capital equipment market in Americas 2016-2021 ($ billions)
  • Exhibit 22: Semiconductor capital equipment market in EMEA 2016-2021 ($ billions)
  • Exhibit 23: Key leading countries
  • Exhibit 24: Share of key leading countries 2016-2021 (% share of revenue)
  • Exhibit 25: Forecast by application of semiconductor devices 2016 and 2021 (% share of revenue)
  • Exhibit 26: Global NAND flash market 2016-2021 (% share of revenue)
  • Exhibit 27: Global semiconductor market trend 1990-2016 ($ billions)
  • Exhibit 28: Timeline for semiconductor wafer size advances
  • Exhibit 29: Principle parameters of competition
  • Exhibit 30: R&D spending of leading vendors 2016
  • Exhibit 31: Vendor share in global semiconductor capital equipment market 2016 (% share of revenue)
  • Exhibit 32: Key vendors
  • Exhibit 33: Other prominent vendors

このページに掲載されている内容は最新版と異なる場合があります。詳細はお問い合わせください。

目次
Product Code: IRTNTR14755

About Semiconductor Capital Equipment

Semiconductor capital equipment is machinery used in the production of semiconductor devices. Equipment for manufacturing semiconductor devices is classified as front-end or back-end based on the processes used. Front-end includes wafer fabrication along with other functions such as lithography, deposition, etching, cleaning, and chemical and mechanical polishing to name a few. Back-end encompasses assembly, packaging, and testing of ICs. Semiconductors are the building blocks for electronics. They form the crucial core of any electronic component. Semiconductor capital spending essentially refers to the capital investments by vendors in the semiconductor domain.

Technavio's analysts forecast the global semiconductor capital equipment market to grow at a CAGR of 6.36 % during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor capital equipment market for 2017-2021. To calculate the market size, the report considers the sale of semiconductor capital equipment to end-user segments.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Semiconductor Capital Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Applied Materials
  • ASML
  • KLA-Tencor
  • Lam Research
  • Tokyo Electron

Other Prominent Vendors

  • ASM International
  • ADVANTEST
  • Hitachi High-Technologies
  • Kulicke & Soffa
  • Nikon
  • Planar
  • Rudolph Technologies
  • SCREEN Semiconductor Solutions (SCREEN Holdings)
  • Teradyne
  • TOKYO SEIMITSU
  • Veeco Instruments

Market driver

  • Integration of semiconductor devices across industrial sectors
  • For a full, detailed list, view our report

Market challenge

  • High inventory levels in supply chain
  • For a full, detailed list, view our report

Market trend

  • Rapid changes in technology driving equipment orders
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction

  • Market outline
  • Semiconductor industry value chain

PART 05: Market landscape

  • Market overview
  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by equipment type

  • Global semiconductor capital equipment by type
  • Wafer-level manufacturing equipment
  • Die-level packaging and assembly equipment
  • Automated test equipment

PART 07: Market segmentation by end-user

  • Global semiconductor capital equipment by end-user
  • Foundries
  • Memory manufacturers
  • IDMs

PART 08: Geographical segmentation

  • Global semiconductor capital equipment market by geography
  • APAC
  • Americas
  • EMEA

PART 09: Key leading countries

  • Key leading countries
  • Taiwan
  • South Korea
  • Japan
  • China

PART 10: Decision framework

PART 11: Drivers and challenges

  • Market drivers
  • Market challenges

PART 12: Market trends

  • Rapid changes in technology driving equipment orders
  • Rising prominence of 3D packaging
  • Large-scale development of the Chinese semiconductor industry
  • Automation in automobiles
  • Development of multi-beam e-beam inspection
  • Proliferation of IoT technology

PART 13: Vendor landscape

  • Competitive scenario
  • Key vendors
  • Other prominent vendors

PART 14: Appendix

  • List of abbreviations
Back to Top