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半導体業界:2018年~2019年の要約・2020年の予測

2018-2019 Recap and 2020 Forecast for the Semiconductor Industry

出版日: | 発行: MIC - Market Intelligence & Consulting Institute | ページ情報: 英文 74 Pages | 納期: 即納可能 即納可能とは

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=104.83円
半導体業界:2018年~2019年の要約・2020年の予測
出版日: 2020年05月27日
発行: MIC - Market Intelligence & Consulting Institute
ページ情報: 英文 74 Pages
納期: 即納可能 即納可能とは
  • 全表示
  • 概要
  • 図表
  • 目次
概要

2020年第1四半期の世界の半導体市場は、COVID-19アウトブレイクの最中、引き続き堅調です。2020年の市場金額は、前年比1.2%増の4,172億米ドルに達すると予測されています。同年、台湾の半導体業界の出荷額は、前年比1.7%増で、世界の平均よりも高いNTD2.45兆(831億米ドル)に達すると予測されています。

当レポートでは、世界の半導体市場と台湾の半導体業界の発展について調査分析し、概要のほか、主要企業、主要動向、主要機会について、体系的な情報を提供しています。

目次

第1章 概要

  • 世界の半導体開発
  • 台湾の半導体開発

第2章 世界のIC設計業界の発展

  • 世界の業界金額の成長
  • ファブレスIC設計業界:地域別
  • 主要なIC設計企業の発展

第3章 台湾のIC設計業界の発展

  • 台湾のファブレスIC設計業界の出荷額
  • 製品ミックス分析
  • 台湾の主要なIC設計企業
  • 業界の発展動向

第4章 機会と課題

  • 米中貿易紛争の影響
  • AIエッジコンピューティングがIC設計業界のビジネスモデルを変える

第4章 台湾のIC設計業界の見通し

  • 台湾のIC設計業界は大幅に減速

第5章 MICの見解

  • 貿易紛争からの新たな輸出機会
  • 新興技術

第6章 世界の半導体製造業の発展

  • 世界のファウンドリは安定成長
  • TSMCが引き続き世界最大のファウンドリ

第7章 業界開発の動向

  • EUVリソグラフィー
  • 先進のナノテクノロジープロセスと成熟したプロセス用途

第8章 主要企業の発展

  • TSMC
  • Samsung
  • GlobalFoundries
  • UMC
  • SMIC

第9章 台湾の半導体製造業の見通し

  • 高速コンピューティング用途は好調
  • COVID-19は短期的な影響、過剰在庫で出荷に影響
  • COVID-19は最終消費者市場の需要に影響、メモリ価格は下落

第10章 MICの見解

  • 在庫一掃と経済の不確実性が業績に影響
  • 世界経済に対する米中貿易戦争の影響は続く

第11章 世界のOSAT業界の発展

  • 安定成長
  • 台湾のランキング

第12章 主要な国際OSAT企業の発展

  • Amkor
  • JECT
  • Tianshui Huatian Technology
  • Tongfu Microelectronics

第13章 台湾の主要OSAT企業の発展

  • ASE
  • PTI、など

第14章 台湾のOSAT業界の見通し

  • 進行中のCOVID-19がOSAT業界に影響
  • 重要成長要因としての真のワイヤレスステレオの需要

第15章 MICの見解

付録

図表

List of Topics

  • Recap the development of both global and Taiwanese semiconductor industry in 2018-2019, touching on shipment value and key development trends of three semiconductor sectors: fabless IC design, semiconductor manufacturing, and OSAT (Outsourced Semiconductor Assembly and Test).
  • Development of major players in the fabless IC design such as MediaTek, Novatek, Realtek, etc; in the semiconductor manufacturing such as TSMC, Samsung, GlobalFoundries, UMC, and SMIC; in the OSAT such as Amkor, JECT, Tianshui Huatian, Tongfu Microelectronics, etc.
  • Outlook for the global and Taiwanese semiconductor industry in 2020 and includes their shipment value forecasts until 2021

Companies covered

  • AMD
  • Amkor
  • Apple
  • ASE
  • ASML
  • Asus
  • Beijing Horizon Robotics Technology
  • Beijing International Space Science Institute
  • Beijing Smartchip Microelectronics
  • Bitfily
  • Bitmain
  • Broadcom
  • Cambrian
  • Canaan Creative
  • China Electronics Corporation
  • Chipbond
  • ChipMOS
  • DeePhi Technology
  • Elite
  • FCI
  • Fujitsu Semiconductor
  • GalaxyCore
  • Giga Solution
  • Global Unichip
  • GlobalFoundries
  • Huahong Semiconductor
  • Hijian Technology Corporation
  • Hikvision
  • Himax
  • HiSilicon
  • Huahong Semiconductor
  • Huawei
  • Huiding Technology
  • Hynix
  • Intel
  • J-Device
  • JECT
  • JHICC
  • JSCK
  • KYEC
  • Marvell
  • MediaTek
  • Mie Fujitsu Semiconductor
  • Nanium
  • Nokia
  • Novatek
  • Microelectronics
  • NVidia
  • OmniVision
  • On Semiconductor
  • OnePlus
  • Oppo
  • Panasonic
  • Panasonic Semiconductor
  • Phison
  • Powerchip
  • PTI
  • Qorvo
  • Qualcomm
  • Raydium
  • Realtek
  • Rockchip
  • Samsung
  • Sigurd
  • Silicon Motion
  • Sitronix
  • SJSemi
  • Skyworks
  • SMIC
  • SPIL
  • STATS ChipPAC
  • Tainshui Huatian Technology
  • Tera Probe
  • Tongu Microelectronics
  • TowerJazz
  • TSI
  • Tsinghua Unigroup
  • TSMC
  • UMC
  • Unisem
  • Unisoc
  • UTAC
  • VIS
  • Vivo
  • Winstek
  • Xiaomi
  • Xilinx
  • Zhejiang Dahua
  • ZTE Microelectronics
目次
Product Code: SCRPT20052601

Amid COVID-19 outbreak, global semiconductor market growth remained robust in the first quarter of 2020. Therefore, it is anticipated global semiconductor market value will reach USD 417.2 billion in 2020, up 1.2% year-on-year. In the same year, shipment value of the Taiwanese semiconductor industry is forecast to grow 1.7% year-on-year and arrive at NTD2.45 trillion (USD 83.1 billion), higher than the global average. This is attributed mainly to Taiwan’s advancements in advanced semiconductor manufacturing processes and the benefits of acquisitions and mergers. This report provides an overview of the development of the global semiconductor market and Taiwanese semiconductor industry - comprising of fabless IC, semiconductor manufacturing, and OSAT (Outsourced Semiconductor Assembly and Test) - between 2018 and April 2020; examines the development of major players and explores key trends and opportunities.

Table of Contents

1. Overview

  • 1.1 Global Semiconductor Development
  • 1.2 Taiwanese Semiconductor Development

2 Global IC Design Industry Development

  • 2.1 Global Industry Value Witness Growth in 2018
  • 2.2. The Fabless IC Design Industry by Region
    • 2.2.1 Chinese IC Design Industry’s Global Share is Increasing Constantly
  • 2.3 Development of Major IC Design Companies
    • 2.3.1 Shipment Value of the Chinese Fabless IC Design Industry Continues to Grow

3.Taiwanese IC Design Industry Development

  • 3.1 Shipment Value of the Taiwanese Fabless IC Design Industry
  • 3.2 Product Mix Analysis
    • 3.2.1 Fabless ICs for Computing, Communication, and Consumer Applications
    • 3.2.2 Communication ICs Remain Mainstream
  • 3.3 Major Taiwan IC Design Companies
  • 3.4 Industry Development Trends
    • 3.4.1 Panel Driver and TDDI ICs to Lead the Evolution on Smartphones
    • 3.4.2 New Products and Applications to Drive Future Opportunity

4. Opportunities and Challenges

  • 4.1 Impact of the US-China Trade Fight
    • 4.1.1 Fabless IC Design is China’s Key Investment Focus
    • 4.1.2 US-China Trade War Speeding Up Localization of the Semiconductor Industry in China
    • 4.1.3 Uncertainties Lead to New Industry Reorganization
  • 4.2 AI Edge Computing Changing the IC Design Industry’s Business Model

4. Outlook for the Taiwanese IC Design Industry

  • 4.1 Taiwan's IC Design Industry Will Slow Down Significantly in 2020

5. MIC Perspective

  • 5.1 Seeking New Export Opportunities from Trade Fight
  • 5.2 Emerging Technologies Make More Applications Possible

6. Development of the Global Semiconductor Manufacturing Industry

  • 6.1 Global Foundry Growth Stays Stable
  • 6.2 TSMC Continues to be The World’s Largest Foundry

7. Industry Development Trends

  • 7.1 EUV Lithography Ready to Extend the Life of Moore’s Law
  • 7.2 Strategies Focus on Advanced Nanotechnology Processes and Mature Process Applications

8. Development of Major Players

  • 8.1 TSMC
  • 8.2 Samsung
  • 8.3 GlobalFoundries
  • 8.4 UMC
  • 8.5 SMIC

9.Outlook for the Taiwanese Semiconductor Manufacturing Industry

  • 9.1 Momentum from High-speed Computing Applications Continues but from Communications Applications Fall Sharply
  • 9.2 COVID Has Short-term Impact While Excessive Inventory to Affect Shipments in 2H 2020
  • 9.3 COVID-19 Affects End-consumer Market Demand and Memory Prices are Falling

10.MIC Perspective

  • 10.1 Inventory Clearance and Economic Uncertainty Affect 2019 Performance
  • 10.2 Influence of US-China Trade War on Global Economy Continues

11.Development of the Worldwide OSAT Industry

  • 11.1 Steady Growth in 2018
    • 11.1.1 OSAT Companies’ Market Share Struck by Trade War
    • 11.1.2 Worldwide OSAT Market Slows Down in 2019 with Shipment Value Similar to 2018
  • 11.2 Taiwan Ranked No.1 in 2018 IC Packaging and Testing Shipment Value, Followed by China
    • 11.2.1 Top Six OSAT Companies’ Spots Remain Unchanged While Gap between Top Three Narrowing
    • 11.2.2 Taiwanese IC Packaging and Testing Industry Posts Higher-than-Global-Average Growth at 8.4% in 2018

12.Development of Leading International OSAT Companies

  • 12.1 Amkor Remain Steady Growth with Continued Focus on Automotive Electronics
  • 12.2 JECT’s M&A Continues to Deliver Synergy, Boosting High-end Packaging Share
  • 12.3 Tianshui Huatian Technology Did Not Live Up to Expectations in 2018
  • 12.4 Tongfu Microelectronics Maintains High Growth Fueled by International Customers

13. Development of Leading Taiwanese OSAT Companies

  • 13.1 ASE Benefits from M&A Synergy with Focus on SiP Technology
    • 13.1.1 ASE Aggressively Develops SiP to Help Customers Reduce Costs
  • 13.2 PTI Strives for Product Diversification by Expanding Non-Memory Business
  • 13.3 CoF Packaging Becomes Mainstream, Driving up Chipbond and ChipMOS Revenues

14. Outlook for theTaiwanese OSAT industry

  • 14.1 Ongoing COVID-19 Affect OSAT Industry
  • 14.2 Demand for True Wireless Stereo as Key Growth Factor

15. MIC Perspective

  • 15.1 A Significant Slowdown in Worldwide IC Packaging and Testing Industry Growth in 2019
  • 15.2 SiP and Heterogeneous Integration as Key Driving Force for Growth
  • 15.3 Trade Restrictions Put Stability of Supply Chain to Test

Appendix

  • List of Companies

List of Tables

  • Table 1 Global Top 10 IC Design Companies in 2018
  • Table 2 China’s Top 10 Fabless IC Design Companies in 2018
  • Table 3 Taiwan’s Top 10 IC Design Companies by Revenue in 2019
  • Table 4 Global Semiconductor Manufacturer Production Value Rankings
  • Table 5 Taiwan’s Top 10 Foundries by Revenue in 2019
  • Table 6 M&A of Leading OSAT Companies, 2014-2019
  • Table 7 Taiwan’s Top 10 OSAT Companies by Revenue in 2019
  • Table 8 Milestones of ASE-SPIL Merger

List of Figures

  • Figure 1 Global Semiconductor Market Value, 2011-2021
  • Figure 2 Taiwanese Semiconductor Industry Shipment Value, 2011-2020
  • Figure 3 Global IC Design Industry Shipment Value, 2013-2019
  • Figure 4 Global IC Design Industry Market Share by Production Base, 2015 - 2018
  • Figure 5 Shipment Value of the Taiwan Fabless IC Design Industry, 2013-2019
  • Figure 6 Taiwan IC Design Industry Shipment Share by Application
  • Figure 7 Taiwan IC Design Industry Shipment Share by Product Mix
  • Figure 8 Global Semiconductor Manufacturing Industry Shipment Value, 2015-2019
  • Figure 9 Shipment Value of the Taiwanese Semiconductor Manufacturing Industry, 2016-2019
  • Figure 10 Taiwanese Semiconductor Manufacturing Shipment Value Share by Process Technology, 3Q17 - 4Q19
  • Figure 11 Global Major IC Manufacturers’ Development Roadmap
  • Figure 12 Benchmarking of TSMC, UMC, and SMIC Production Value Share by Process Technology
  • Figure 13 GlobalFoundries Process Development Roadmap
  • Figure 14 SMIC Revenue and Net Profit, 2015-2018
  • Figure 15 Worldwide OSAT Industry Shipment Value and Growth Rates, 2016-2019
  • Figure 16 World’s Top Ten OSAT Companies by Revenue in 2019
  • Figure 17 Taiwanese OSAT Industry Shipment Value and Growth Rates, 2016-2019
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