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世界と台湾の半導体産業・市場の発展動向:中国本土との産業連関構造

Development of the Global Semiconductor Industry and Market, and Cross-strait Industrial Chains

発行 MIC - Market Intelligence & Consulting Institute 商品コード 711686
出版日 ページ情報 英文 32 Pages
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世界と台湾の半導体産業・市場の発展動向:中国本土との産業連関構造 Development of the Global Semiconductor Industry and Market, and Cross-strait Industrial Chains
出版日: 2018年09月19日 ページ情報: 英文 32 Pages
概要

家電市場の成熟化に伴い、世界の半導体市場も成長率が低下してきています。また、近年は企業合併・買収 (M&A) も活発化しており、市場再編・企業再生に向けて様々な取り組みが進められています。他方、中国政府は独自の半導体産業・企業は育成せず、代わりに (台湾を含む) 国外の企業との提携関係を強めようとしています。

当レポートでは、世界と台湾・中国の半導体産業の発展動向について分析し、市場の基本構造や最新情勢、企業別・分野別の市場シェア、分野別 (デザインハウス、ファウンドリ、パッケージング/検査サービス) の市場ランキング構造、同時期 (2009〜2017年) の世界市場と台湾/中国市場の比較、中国政府の半導体産業政策、主要ファウンドリの大量生産スケジュール、台湾の半導体産業の発展段階と出荷量の動向、市場の将来像に関する不透明性、といった項目について調査しております。

目次

  • 世界の半導体産業の動向
  • 半導体市場の主な傾向
  • 台湾の半導体産業の動向と、中国本土との間の産業連関構造

分析対象企業

  • AMD
  • Amkor Technology
  • ASE Group
  • Big Fund
  • Broadcom
  • Chang Xing
  • Changjiang Electronics Technology
  • ChipMOS
  • Cirrus Logic
  • CR Microelectronics
  • 富士通
  • GigaDevice
  • GlobalFoundries
  • Guo Gao MEMS
  • Hanking Group
  • HiSilicon
  • Hitech Semiconductor
  • HiWafer
  • Hua Capital Management
  • Hua Hong Semiconductor
  • Hua Tian Technology
  • HuaHong NEC
  • Huali Microelectronics
  • Hubei Science & Technology Investment Group
  • Intel
  • ISSI
  • JHICC
  • Jiangsu Changjiang Electronics
  • Jilin Sino-Microelectronics
  • KYEC
  • Marvell
  • Mediatek
  • MEMSensing
  • Micro Sensor
  • Micron
  • NantongFujitsu Microelectronics
  • Nepes
  • Nexchip
  • Nvidia
  • OV
  • Powerchip
  • ProMos
  • PTI (Powertech)
  • Qualcomm
  • RDA Microelectronics
  • Samsung
  • Silan Microelectronics
  • Silex Microsystems AB
  • SITRI
  • SK Hynix
  • SMIC
  • SPIL
  • Spreadtrum
  • STATS ChipPAC
  • Summitview Capital
  • Tacoma
  • TDK
  • TI
  • Tianshui Huatian
  • Tongfu Microelectronics
  • TowerJazz
  • Tsinghua Unigroup
  • TSMC
  • UMC
  • United Semi
  • US CIS
  • US FCI
  • UTAC
  • Vanguard
  • Wuhan Xinxin
  • Wuxi China Resources Micro-Assembly Technology
  • Xi'an Micro-electronics Institute of Technology
  • Xilinx
  • XMC
  • Yandong Microelectronics
  • Yangtze Memory
  • Yangtze River Storage Technology
  • YMT
図表

List of Topics:

  • Development of the global semiconductor industry and includes the top 15 IC design house, foundry, packaging and testing service provider rankings in 2015 and 2016.
  • Key highlights observed in the global semiconductor industry, including the global market share by application for the period 2010-2016, business performance of Intel, NVidia, Qualcomm, and MediaTek as of 2H 2016.
  • Comparison of worldwide and Chinese semiconductor markets for the period 2009-2017 in terms of market value and annual growth and includes major semiconductor vendors' deployment plans in China, such as Intel, Samsung, TSMC, SK Hynix, Qualcomm, Micron, and TI.
  • China's national policy and major players' plans for IC design, foundry, and packaging and testing are also included.
  • Leading foundries' mass production schedule for wafers using advanced processes, such as TSMC, Samsung, Intel, Global Foundries, UMC, and SMIC, as of 2H 2018, as well as leading IC packaging and testing service providers' schedule.
  • Development of the Taiwanese semiconductor industry, touching on the shipment value for the period 2010-2017 and uncertainty factors facing individual sectors.

Companies covered:

  • AMD
  • Amkor Technology
  • ASE Group
  • Big Fund
  • Broadcom
  • Chang Xing
  • Changjiang Electronics Technology
  • ChipMOS
  • Cirrus Logic
  • CR Microelectronics
  • Fujitsu
  • GigaDevice
  • GlobalFoundries
  • Guo Gao MEMS
  • Hanking Group
  • HiSilicon
  • Hitech Semiconductor
  • HiWafer
  • Hua Capital Management
  • Hua Hong Semiconductor
  • Hua Tian Technology
  • HuaHong NEC
  • Huali Microelectronics
  • Hubei Science & Technology Investment Group
  • Intel
  • ISSI
  • JHICC
  • Jiangsu Changjiang Electronics
  • Jilin Sino-Microelectronics
  • KYEC
  • Marvell
  • Mediatek
  • MEMSensing
  • Micro Sensor
  • Micron
  • NantongFujitsu Microelectronics
  • Nepes
  • Nexchip
  • Nvidia
  • OV
  • Powerchip
  • ProMos
  • PTI (Powertech)
  • Qualcomm
  • RDA Microelectronics
  • Samsung
  • Silan Microelectronics
  • Silex Microsystems AB
  • SITRI
  • SK Hynix
  • SMIC
  • SPIL
  • Spreadtrum
  • STATS ChipPAC
  • Summitview Capital
  • Tacoma
  • TDK
  • TI
  • Tianshui Huatian
  • Tongfu Microelectronics
  • TowerJazz
  • Tsinghua Unigroup
  • TSMC
  • UMC
  • United Semi
  • US CIS
  • US FCI
  • UTAC
  • Vanguard
  • Wuhan Xinxin
  • Wuxi China Resources Micro-Assembly Technology
  • Xi'an Micro-electronics Institute of Technology
  • Xilinx
  • XMC
  • Yandong Microelectronics
  • Yangtze Memory
  • Yangtze River Storage Technology
  • YMT
目次
Product Code: SCSYM18091401

With growing maturity of consumer electronics, worldwide semiconductor market has slowed down. Showing strong signs of maturity these days, the industry has had a number of M&As, indicating the market is undergoing restructuring. The Chinese government has spared no efforts to level up andfoster its own semiconductor supply chain, which is getting more full-fledged and pressuring counterparts in the globe, including Taiwan. This report provides an overview of global, Chinese, and Taiwanese semiconductor industry developments, comprising of IC design, foundry, and testing & packaging sectors; explores the key highlights and trends observed in the semiconductor market; examines the cross-strait industrial chains and issues.

Table of Contents

  • Development of the Global Semiconductor Industry
  • Key Highlights of the Semiconductor Market
  • Development of the Taiwan Semiconductor Industry and Cross-strait Industrial Chains
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