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世界のウエハー・ファウンドリ産業:最新情勢と将来展望

Recap and Outlook for The Worldwide Wafer Foundry Industry in 2018

発行 MIC - Market Intelligence & Consulting Institute 商品コード 621926
出版日 ページ情報 英文 24 Pages
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世界のウエハー・ファウンドリ産業:最新情勢と将来展望 Recap and Outlook for The Worldwide Wafer Foundry Industry in 2018
出版日: 2018年08月17日 ページ情報: 英文 24 Pages
概要

世界のウエハー・ファウンドリ産業では、出荷量のおよそ76%を上位5社が占めており、非常に集中化した産業です。垂直統合型デバイスメーカー (IDM) による発注やCPU、GPU、FPGAおよびASICといった新たなアプリケーションICの普及が、長年にわたってこの産業の主要な成長要因でした。加えて、カーエレクトロニクス、IoT、5Gアプリケーションの登場により、指紋センサーIC、ドライバーIC、GPS ICおよびRF ICの需要が高まっています。

当レポートでは、世界のウエハー・ファウンドリ産業における最新情勢や将来展望について分析すると共に、主要企業の昨今の動向、今後の見通しなどについて調査しております。

第1章 世界のウエハー・ファウンドリ産業の概況

  • 世界のウエハー・ファウンドリ産業の持続的成長
  • 台湾系企業による市場支配の継続

第2章 世界のウエハー・ファウンドリ産業の発展動向

  • 次世代型メモリの開発に関心が集まる
  • 中国系のウエハー・ファウンドリ企業は、台湾の大手企業より未だに大きく立ち遅れる

第3章 主要ベンダーの動向

  • TSMC
  • GlobalFoundries
  • UMC
  • Samsung
  • SMIC

第4章 結論

  • 新たな用途の重要性が、今も上がり続けている
  • 次世代型メモリを巡るファウンドリ間の競争が始まる

付録

分析対象企業

  • Adesto、AMD、Apple、Avalanche Tech、Bitfury、Bitmain、Canaan、Celis、Crossbar、Cypress、EverSpin、Faraday Technology、富士通、GlobalFoundries、HiSilicon、HuaHong、IBM、MediaTek、Micron、NXP、パナソニック、Powerchip、Qualcomm、ローム、Samsung、SK Hynix、SMIC、ソニー、Spin Transfer、Telechips、TI、東芝、TowerJazz、TSMC、UMC、USCXM、VIS、WD、Winbond
目次
Product Code: SCRPT18081701

Abstract

The global wafer foundry industry is highly concentrated with the top-five players taking up about 76% of the total shipments. The increasing share of orders released by IDMs and the proliferation of emerging application ICs such as CPUs, GPUs, FPGAs, and ASICs have been major growth factors to drive the industry's growth over the years. In addition, the rise of automotive electronics, IoT, and 5G applications have also boosted the demand for fingerprint sensor ICs, driver ICs, GPS ICs, and RF ICs. Hence, the market is expected to continue the steady growth this year. This report reviews the industry's development in 2017 and provides a future outlook for 2018 and beyond. Also included are development highlights of major players: TSMC, GlobalFoundries, UMC, Samsung, and SMIC.

Table of Contents

1. Overview of the Worldwide Wafer Foundry Industry

  • 1.1 Global Wafer Foundry Industry Continuing Steady Growth in 2018
  • 1.2 Taiwanese Wafer Foundry Continues to Dominate the Landscape

2. Development Trends of the Worldwide Wafer Foundry Industry

  • 2.1 Next Generation Memory Development Gains Increasing Attention
  • 2.2 Chinese Wafer Foundries Still Lagging Behind Big Names

3. Development of Leading Vendors

  • 3.1 TSMC
  • 3.2 GlobalFoundries
  • 3.3 UMC
  • 3.4 Samsung
  • 3.5 SMIC

4. Conclusion

  • 4.1 Importance of Emerging Applications Keeps Rising
  • 4.2 Foundries' Next Generation Memory Competition Gets Started

Appendix

  • Glossary of Terms
  • List of Companies

List of Tables

  • Table 1 Global Foundries' Ranking by Shipment Value, 2017
  • Table 2 Next Generation Memory Investors
  • Table 3 TSMC's Major R&D Plans
  • Table 4 GlobalFoundries Expansion Plans

List of Figures

  • Figure 1 Worldwide Wafer Foundry Industry Shipment Value, 2015 - 2018
  • Figure 2 Global Semiconductor Market Share by Application, 2016
  • Figure 3 Taiwanese Wafer Foundry Industry Shipment Value, 2015 - 2018
  • Figure 4 Taiwanese Wafer Foundry Industry Shipment Value Share by Process Technology, 1Q 2015 - 1Q 2018
  • Figure 5 Comparison of 2016 and 2017 Major Taiwanese and Chinese Foundries' Advanced Processes
  • Figure 6 GlobalFoundries' Process Development Layout
  • Figure 7 SMIC's Gross Profit, 2015 - 2017

List of Topics

Development of the worldwide and Taiwanese wafer foundry industries, touching on their status of quo and their shipment value for the period 2015-2018

Development of the worldwide and Taiwanese wafer foundry industries, touching on their status of quo and their shipment value for the period 2015-2018

Chinese foundries' advanced process developments and developers and inventors of next generation memories such as MRAM, PCRAM, ReRAM FeRAM, and XPoint

Latest development of major players such as TSMC, GlobalFoundries, UMC, Samsung, and SMIC and includes global foundries' rankings for the period 2014-2017

Chinese foundries' advanced process developments and developers and inventors of next generation memories such as MRAM, PCRAM, ReRAM FeRAM, and XPoint

Latest development of major players such as TSMC, GlobalFoundries, UMC, Samsung, and SMIC and includes global foundries' rankings for the period 2014-2017

Companies covered

Adesto, AMD, Apple, Avalanche Tech, Bitfury, Bitmain, Canaan, Celis, Crossbar, Cypress, EverSpin, Faraday Technology, Fujitsu, GlobalFoundries, HiSilicon, HuaHong, IBM, MediaTek, Micron, NXP, Panasonic, Powerchip, Qualcomm, Rohm, Samsung, SK Hynix, SMIC, Sony, Spin Transfer, Telechips, TI, Toshiba, TowerJazz, TSMC, UMC, USCXM, VIS, WD, Winbond

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