市場調査レポート

台湾と韓国における半導体産業の概要と競合分析

Semiconductor Industry Overview and Competitive Analysis Between Taiwan and Korea

発行 Market Intelligence & Consulting Institute (MIC) 商品コード 348155
出版日 ページ情報 英文 46 Pages
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台湾と韓国における半導体産業の概要と競合分析 Semiconductor Industry Overview and Competitive Analysis Between Taiwan and Korea
出版日: 2015年12月31日 ページ情報: 英文 46 Pages
概要

2014年の半導体産業の出荷額は、台湾が638億米ドル、韓国が486億米ドルに達しました。これにより、台湾は世界第2位、韓国は世界第3位の市場となりました。産業全体の出荷額では、台湾が21%、韓国が16%を占めています。

当レポートでは、台湾と韓国の半導体産業について調査分析し、分野別 (ファブレスIC設計、ウエハーファウンドリ、ICパッケージング・試験) の競合分析、将来の見通しについて、体系的な情報を提供しています。

第1章 台湾の半導体産業の分析

  • 台湾のファブレスIC設計産業
  • 台湾のIC製造産業
  • 台湾のICパッケージング・試験産業

第2章 競合分析

  • 韓国と台湾の半導体産業における世界のプレゼンス
  • 韓国と台湾の主要ベンダーの発展

第3章 検証と見通し

  • ファブレスIC設計
  • ウエハーファウンドリ
  • ICパッケージング・試験

付録

用語集

企業リスト

目次
Product Code: SCRPT15123101

Shipment value of the Taiwanese and Korean semiconductor industry totaled around NT$2.1 trillion (US$63.8 billion; US$1 = NT$32.8) and NT$1.6 trillion (US$48.6 billion), respectively, in 2014. This made Taiwan and Korea the world's second and third largest semiconductor market, respectively, with the United States securing the first spot. The Taiwan's and Korea's share of shipment value in the global semiconductor industry reached 21% and 16%, respectively. This report provides an in-depth analysis of Taiwanese semiconductor industry in three areas: fabless IC design, wafer foundry and IC packaging and testing; provides a competitive analysis of semiconductor industry in Korea and Taiwan and examines their future outlook.

Table of Contents

1. Analysis of Taiwanese Semiconductor Industry

  • 1.1 Taiwanese Fabless IC Design Industry
    • 1.1.1 Overview of Listed/OTC Fabless IC Design Houses in Taiwan
    • 1.1.2 Role of the Taiwanese IC Design Industry in the World
    • 1.1.3 Importance of the Taiwanese IC Design Industry
  • 1.2 Taiwanese IC Manufacturing Industry
    • 1.2.1 Overview of Listed/OTC IC Manufacturing Companies in Taiwan
    • 1.2.2 Role of the Taiwanese IC Manufacturing Industry in the World
    • 1.2.3 Importance of the Taiwanese IC Manufacturing Industry
  • 1.3 Taiwanese IC Packaging & Testing Industry
    • 1.3.1 Overview of Listed/OTC IC Packaging & Testing Companies in Taiwan
    • 1.3.2 Role of the Taiwanese IC Packaging and Testing Industry in the World
    • 1.3.3 Importance of the Taiwanese IC Packaging and Testing Industry

2. Competitive Analysis

  • 2.1 Global Presence of the Korean and Taiwanese Semiconductor Industry
    • 2.1.1 Fabless IC Design
    • 2.1.2 Wafer Foundry
    • 2.1.3 Memory
    • 2.1.4 Packaging and Testing
  • 2.2 Development of Leading Korean and Taiwanese Semiconductor Vendors
    • 2.2.1 Fabless IC Design
    • 2.2.2 Wafer Foundry
    • 2.2.3 Memory
    • 2.2.4 IC Packaging and Testing

3. Review and Outlook

  • 3.1 Fabless IC Design
  • 3.2 Wafer Foundry
  • 3.3 IC Packaging and Testing

Appendix

Glossary of Terms

List of Companies

List of Topics

Overview of Taiwan's semiconductor industry, including fabless IC design, IC manufacturing, and IC packaging and testing sub-industries; touching on listed and OTC companies, major players' global rankings, and their role in the worldwide supply chain

Competitive analysis of the Taiwanese and Korean semiconductor industries, covering their global market share by sub-industry, major vendors' role in the supply chains, and leading vendors' global share ranking; also included are the development and outlook for the Taiwanese and Korean semiconductor industries

List of Figures

  • Figure 1: Market Share of Taiwanese IC Packaging and Testing Industry, 2014
  • Figure 2: Worldwide Top 10 IC Packaging and Testing Companies by Shipment Value, 2014
  • Figure 3: Taiwanese IC Packaging & Testing Companies' Advantages in Developing SiP
  • Figure 4: Global Fabless IC Design Industry's Share by Region
  • Figure 5: Global Foundry Market Share by Country
  • Figure 6: DRAM, NOR Flash and NAND Flash Memory's Global Market Share by Country
  • Figure 7: Global Packaging and Testing Market Share by Country
  • Figure 8: Supply Chains of Korean and Taiwanese Semiconductor Industry
  • Figure 9: Leading Korean and Taiwanese Fabless IC Design Houses' Global Share Ranking
  • Figure 10: Leading Korean and Taiwanese Wafer Foundries' Global Share Ranking
  • Figure 11: Leading Korean and Taiwanese DRAM Makers' Global Share Ranking
  • Figure 12: Leading Korean and Taiwanese NOR Flash Memory Makers' Global Share Ranking
  • Figure 13: Korean and Taiwanese Leading NAND Flash Memory Manufacturers' Global Share Ranking
  • Figure 14: Korean and Taiwanese Leading Packaging and Testing Companies' Global Share Ranking

List of Tables

  • Table 1: Listed Fabless IC Design Companies in Taiwan
  • Table 2: OTC Fabless IC design Companies in Taiwan
  • Table 3: IC Design Companies in Taiwan
  • Table 4: Global Market Share of Taiwanese IC Design Industry, 2013-2014
  • Table 5: 2014 Global Rankings of Taiwanese IC Design Companies
  • Table 6: Taiwanese Suppliers for Smartphone ICs
  • Table 7: Features and Core Competence of Taiwanese IC Design Industry
  • Table 8: Listed/OTC IC Manufacturing Companies in Taiwan
  • Table 9: Global Market Share of Taiwanese IC Manufacturing Industry in 2014
  • Table 10: Worldwide Top 10 Semiconductor Foundry, 2012-2014
  • Table 11: Features and Core Competence of Taiwanese IC Manufacturing Industry
  • Table 12: Listed IC Packaging & Testing Companies in Taiwan
  • Table 13: OTC IC Packaging & Testing Companies in Taiwan
  • Table 14: Top 5 Vendors in Taiwan's IC Packaging & Testing Industry, 2013-2014
  • Table 15: Features and Core Competence of Taiwanese IC Packaging and Testing Industry 2
  • Table 16: Top 50 Korean and Taiwanese Semiconductor Vendors by Revenue
  • Table 17: Comparison of Korean and Taiwanese Listed Micro-component IC Fabless IC Companies

Companies covered

  • 3S, AAT, Acard, AIC, Alcor Micro, Ali, Alpha Imaging, Alpha Microelectronics, AMAZING, AME, AMICCOM, Amkor, AMPI, Anpec, APEC, Ardentec, ARM, Asix, ASMedia, Aspeed, Averlogic, AVID, Cadence, Champion (CMC), Chingis, Chipbond, ChipMOS, Cmedia, Davicom, Dongbu, EDA, EETI, EMC, eMemory, ENE, Episemi, ESMT, Etron, Faraday, FATC, Feeling Technology, FocalTech, Foxconn, Generalplus, Genesys Logic, Giga Solution, GlobalFoundries, GMT, GUC, Hana Micron, Himax Technologies, Hisilicon, Holtek, Hua Hong, Hycon, IC Plus, Ilitek, Inotera, JCET, J-Device, KYEC, Leadtrend, Lingsen, Liteon Semiconductor, Macroblock, Macronix International, Marvell, MediaTek, Megawin, Micron, Myson Century, Nanya Technology, Niko-Sem, Novatek, Nuvoton, Nvidia, Orise Technology, OSE, Phison, PixArt, Powerchip, Prescope, Princeton, Prolific, PTC, PTI, Qualcomm, RDC, Realtek, Renesas SP, Richtek, Samsung, Semiteq, ShunSin, Signetics, Siguard, Silicon Motion, SiS, SiTI, Sitronix, SK Hynix, Skymedi, SMIC, Sonix, SPIL, Spreadtrum, SQ Technology, STATS ChipPAC, SummitView Capital, Sunplus, Synaptics, Syntek, Sysnopsys, Test-Serv Inc., TIPC, Tmtech, Tontek, TowerJazz, UltraChip, UMC, Universal Scientific Industrial Co., UTAC, Vate Technology, VIA, VIS, V-TAC, Walton, Weltrend, Winbond, X-FAB, Xintec, YTEC, Zentel
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