市場調査レポート

半導体先端プロセス技術:Intel、Samsung、TSMCの競合分析

Semiconductor Advanced Process Technologies: Competitive Analysis of Intel, Samsung and TSMC

発行 Market Intelligence & Consulting Institute (MIC) 商品コード 344753
出版日 ページ情報 英文 14 Pages
即納可能
価格
本日の銀行送金レート: 1USD=107.50円で換算しております。
Back to Top
半導体先端プロセス技術:Intel、Samsung、TSMCの競合分析 Semiconductor Advanced Process Technologies: Competitive Analysis of Intel, Samsung and TSMC
出版日: 2015年11月06日 ページ情報: 英文 14 Pages
概要

世界の半導体ファウンドリ市場は、スマートフォン、コンピューター、ウェアラブル機器、IoT対応デバイスへの需要によって、近年は着実に成長を続けています。

当レポートでは、Intel、Samsung、TSMCの競争力について調査分析し、技術展開、生産能力、顧客関係に焦点を当てて、半導体ファウンドリ市場の将来の発展動向について、体系的な情報を提供しています。

第1章 先端プロセス技術の分析

  • 技術のロードマップ
  • 主要技術の発展
  • 資本支出

第2章 生産能力の分析

  • 多様な生産ラインで競争力を強化
  • スマート生産で経済的利益を生む

第3章 顧客関係の分析

  • Samsung、Intelは顧客の信頼が低い

結論

  • Intel
  • Samsung
  • TSMC

付録

  • 用語集
  • 企業リスト
目次
Product Code: SCRPT15110601

The worldwide semiconductor foundry market has been growing steadily in recent years, thanks to the demand for smartphones, computers, wearables, and IoT (Internet of Things) application devices. Advanced processes have been the major driving force behind the growth. For this reason, IDMs such as Intel and Samsung have been deploying in 14nm and 10nm process technologies, thereby shaking the leadership of TSMC's market share. This report profiles the competition among Intel, Samsung, and TSMC-from the perspective of technology deployment, manufacturing capabilities, and customer relationship-and analyzes the future development of the semiconductor foundry market.

Table of Contents

1. Analysis of Advanced Process Technologies

  • 1.1 Technology Roadmaps
    • 1.1.1 Intel's Technology Leadership Had Little Impact on Pure-play Foundries
    • 1.1.2 TSMC Dominates 20nm Process; Samsung Has a Head Start in 14nm Process
    • 1.1.3 TSMC, Samsung Head-to-Head Competition for 10nm Process
  • 1.2 Development of Key Technologies
    • 1.2.1 Vendors Pursue 3D FinFET in Sub-2xnm Designs
    • 1.2.2 TSMC Gets the Upper Hand over Samsung on 16/14nm Process
    • 1.2.3 Samsung Faces More Challenges at 10nm Technology
    • 1.2.4 Vendors All Focus on 3D IC Packaging Services
  • 1.3 Capital Expenditures (Capex)
    • 1.3.1 TSMC Concentrates on Advanced Process Investments

2. Analysis of Manufacturing Capabilities

  • 2.1 Diversified Production Lines to Strengthen Competitiveness
    • 2.1.1 TSMC Continues to Expand Market Share of Homogeneous ICs
    • 2.1.2 Samsung, Intel Have a Head Start in Heterogeneous Integration
  • 2.2 Smart Manufacturing to Create Economic Benefits
    • 2.2.1 TSMC can Use Big Data Analytics to Widen its Advantage

3. Analysis of Customer Relationship

  • 3.1 Samsung, Intel May Have Lower Customer Trust

Conclusion

  • Intel Strengthens Advanced Process Capacity by Acquisitions
  • Samsung Could Focus on Heterogeneous Integration
  • TSMC Needs to Reinforce Cooperation with Memory Vendors on 3D ICs
  • Appendix
  • Glossary of Terms
  • List of Companies

List of Topics

Analysis of the three companies' advanced process technologies, including their technology roadmaps, key technologies, pros and cons, and capital expenditures during 2011 and 2014

Overview of their manufacturing capabilities, touching on homogeneous integration, heterogeneous integration, and big data analytics applications on semiconductor fabrication

Profile of each company's customer relationship, comparing IDMs and pure-play foundries in terms of customer trust

List of Figures

  • Figure 1: Major Vendors' Advanced Technology Roadmap
  • Figure 2: Comparison of Major Vendors' Key Technologies
  • Figure 3: Comparison of Major Vendors' Packaging & Testing Technologies
  • Figure 4: Comparison of Major Vendors' Capex, 2011-2014
  • Figure 5: Product Lines of Major Vendors' Contract Manufacturing Services
  • Figure 6: Application of Big Data Analytics on Semiconductor Fabrication
  • Figure 7: Major Vendors' Position in the Semiconductor Industry Chain

Companies covered

Altera, Apple, Archronix, ESMT, Etron, IBM, Intel, MediaTek, NVIDIA, Qualcomm, Samsung, Spreadtrum, Tabula, Tsinghua Unigroup, TSMC, Xilinx

Back to Top