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市場調査レポート

世界のTSV 3D IC産業の将来動向

Future Trends of the Worldwide TSV 3D IC Industry

発行 Market Intelligence & Consulting Institute (MIC) 商品コード 320893
出版日 ページ情報 英文 16 Pages
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世界のTSV 3D IC産業の将来動向 Future Trends of the Worldwide TSV 3D IC Industry
出版日: 2014年12月11日 ページ情報: 英文 16 Pages
概要

電子デバイスは、よりコンパクトなフォームファクター、汎用性、高性能、低消費電力を目指し、単一チップパッケージからSiP(パッケージ内のシステム)へとICパッケージング技術を促進しています。

当レポートでは、世界のTSV(シリコン貫通電極)3D IC産業について調査分析し、技術・市場・産業面から発展の概要について検証して、体系的な情報を提供しています。

第1章 世界のパッケージング技術の発展

  • SiPが主流技術になる
  • TSV 3D IC:パッケージング技術の将来動向
  • TSV 3D IC技術の独自性
  • TSV 3D ICに対する既存の課題
  • TSV 3D ICで主導する外国企業

第2章 TSV 3D IC市場の発展

  • 強力な成長可能性
  • 大量生産活動は低い
  • 市場成長は技術の強化で加速

第3章 TSV 3D IC産業の発展

  • 業界を超えてアライアンスを形成
  • HMCCには台湾のICデザインハウスが不在
  • 台湾の上流・下流の企業間で求められる緊密な協力関係

MICの見通し

付録

図表

目次
Product Code: SCRPT14121101

Electronics devices are developing towards more compact form factors, more versatility, higher performance, and lower power consumption, driving IC packaging technologies towards SiP (System-in-Package) from single chip package. Among various SiP technologies, TSV 3D IC (Through-Silicon-Via) which vertically interconnects stacked dies using TSV technology has been considered the future packaging technology due to its high space efficiency and performance. Up to now, TSV 3D IC technology has only been applied to the integration of homogeneous chips, resulting in a low industrial value. However, the situation is about to change as some foreign vendors are projected to make technological progress. This report provides the overview development of TSV 3D IC from the aspects of technology, market, and industry.

Table of Contents

1. Development of Global Packaging Technologies

  • 1.1. SiP to Become Mainstream Technology
  • 1.2. TSV 3D IC: The Future Trend of Packaging Technology
  • 1.3. Uniqueness of TSV 3D IC Technology
  • 1.4. Existing Challenges for TSV 3D IC
  • 1.5. Foreign Players' Leading Position in TSV 3D IC

2. Development of TSV 3D IC Market

  • 2.1. Strong Growth Potential
  • 2.1. Mass Production Activities Remain Low
  • 2.2. Market Growth to Speed Up with Technological Enhancement

3. Development of the TSV 3D IC Industry

  • 3.1. Formation of Cross-industry Alliances
  • 3.2. Taiwanese IC Design Houses' Absence in HMCC
  • 3.3. Close Cooperation between Taiwanese Upstream and Downstream Players Required
  • MIC Perspective
  • Appendix

List of Topics

Overview of the development of global packaging technology SiP (System-in-Package), in particular TSV (Through-Silicon-Via) 3D IC technology; four major production processes and existing challenges of TSV 3D IC in stacking, circuit, stress, heat dissipation, yield and cost are also covered.

Development of the TSV 3D IC market and industry, including the global industry value forecast up to 2017 and major players' development plan in 2015 and 2016; also provided are those players' mass production timetable for TSV 3D IC.

Overview of the deployment of TSV 3D IC industry alliances, covering upstream to downstream segments of fabless, foundry, memeory, packaging and IDM; also included are the position of US, UK, Korean, Singaporean, and Taiwanese players in the TSV 3D IC supply chain.

List of Figures

  • Figure 1: Development of Electronic Devices and Packaging Technologies
  • Figure 2: Comparison of TSV 3D IC and Other Packaging Technologies
  • Figure 3: Production Process of TSV 3D IC
  • Figure 4: Worldwide TSV 3D IC Industry Value Forecast, 2014 - 2017
  • Figure 5: Major Players' Development Plan in 2015 and 2016
  • Figure 6: Comparison of Industry Alliances Worldwide
  • Figure 7: Participation of Taiwanese and Korean HMCC Members

List of Tables

  • Table 1: Current Challenges in TSV 3D IC Development
  • Table 2: Technology Development and Mass Production Timetable of Taiwanese and Foreign TSC IC Chipmakers
  • Table 3: TSV-based ICs Mass Produced as of Year-end 2014
  • Table 4: Impact on Taiwan's Semiconductor Industry

Companies covered

Altera, AMD, Amkor, ARM Holding, ASE Kaohsiung, GlobalFoundry, HMCC, Hynix, Inotera Memories, Micron, Samsung, STATS ChipPAC, STMicro, Toshiba, TSMC, UMC, Xilinx.

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