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市場調査レポート

台湾の半導体製造業:最新動向(四半期データ)

Taiwanese Semiconductor Manufacturing Industry, 4Q 2019

発行 MIC - Market Intelligence & Consulting Institute 商品コード 286405
出版日 ページ情報 英文 23 Pages
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台湾の半導体製造業:最新動向(四半期データ) Taiwanese Semiconductor Manufacturing Industry, 4Q 2019
出版日: 2020年01月17日 ページ情報: 英文 23 Pages
概要

当レポートでは、台湾の半導体製造業(ICファウンドリー、DRAMベンダー、IDM(総合デバイスメーカー)など)の最新動向について分析し、市場全体の出荷量・出荷額(四半期ベース)を調査すると共に、その結果を製品の種類やサイズ、企業形態などを整理しいます。

目次

  • 台湾の半導体製造業の出荷額
  • 台湾の半導体製造業の出荷額:企業の種類別
  • 半導体製造業の8インチ型相当ウエハーの出荷量と使用率
  • ウエハー出荷量:寸法別
  • 12インチ型ウエハーの出荷量と使用率
  • 12インチ型ウエハーの出荷量:ベンダーの種類別
  • 8インチ型以下のウエハーの出荷量と使用率
  • 8インチ型以下ウエハーの出荷量:ベンダーの種類別
  • 台湾のファウンドリー産業:出荷額ランキング
  • ファウンドリー産業の出荷額:プロセス技術別
  • ファウンドリー産業の出荷額シェア:プロセス技術別
  • 台湾のDRAM産業:出荷額ランキング
  • DRAM産業の8インチ型相当ウエハーの出荷量と使用率
  • DRAM産業の8インチ型相当ウエハーの出荷量シェア:プロセス技術別
  • 為替レート
  • 分析範囲・定義
図表

List of Topics

This research report presents shipment value forecast and recent quarter review of the Taiwanese semiconductor manufacturing industry.

Companies surveyed in this research are those owning facilities to make MOS (Metal Oxide Semiconductor) wafers in Taiwan, including foundries, DRAM (Dynamic Random Access Memory) makers, flash memory makers, and IDMs (Integrated Device Manufacturers).

The content of this report is based on primary data obtained from interviews and publicly available information.

Companies covered

Inotera

Nanya

Powerchip

TSMC

UMC

Winbon

目次
Product Code: SCSTL20011702

Abstract

The report finds that shipment value of the Taiwanese semiconductor manufacturing industry - comprising mainly of foundry, DRAM, flash memory, and IDM sectors - reached US$ 11.5 billion, growing 17.6% sequentially in the third quarter of 2019. The decline in the frist half of 2019 was mainly attributed to relatively high inventory levels. As the inventory levels have reached the optimal level and TSMC’s advanced processes have entered mass production, the industry’s shipment performance in the second half of 2019 is expected to witness year-on-year growth. The market demand is anticipated to regain momentum in the second half of 2020 thanks to the surging demand for 5G applications and 8K TVs.

Table of Contents

  • The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.15 billion in the third first quarter of 2019, up 12.1% sequentially and 1.7% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectorTaiwanese Semiconductor Manufacturing Industry Shipment Value, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry Shipment Value by Business Type, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry 8"-equiv. Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry Wafer Shipment Volume by Wafer Dimension, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 3Q 2019
  • Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume by Vendor's Business Type, 1Q 2017 - 3Q 2019
  • Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 3Q 2019
  • Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume by Business Type, 1Q 2017 - 3Q 2019
  • Taiwanese Foundry Industry’s Shipment Value Ranking, 1Q 2017 - 3Q 2019
  • Taiwanese Foundry Industry Shipment Value by Process Technology, 1Q 2017 - 3Q 2019
  • Taiwanese Foundry Industry Shipment Value Share by Process Technology, 1Q 2017 - 3Q 2019
  • Taiwanese DRAM Industry's Shipment Value Ranking, 1Q 2017 - 3Q 2019
  • Taiwanese DRAM Industry's 8"-equiv. Wafwer Shipment Volume by Process, 1Q 2017 - 3Q 2019
  • Taiwanese DRAM Industry's 8"-equiv. Wafer Shipment Volume Share by Process, 1Q 2017 - 3Q 2019
  • Exchange Rate, 1Q 2017 - 3Q 2019
  • Research Scope & Definitions