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ニッチ市場における化学物質および材料サプライヤー市場と戦略

Niche Markets and Strategies for Small/Mid-size Semiconductor Material and Chemical Companies

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出版日 ページ情報 英文
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ニッチ市場における化学物質および材料サプライヤー市場と戦略 Niche Markets and Strategies for Small/Mid-size Semiconductor Material and Chemical Companies
出版日: 2018年04月01日 ページ情報: 英文
概要

当レポートでは、太陽エネルギー、MEMS、高輝度LED、HDD用薄膜リード/ライトヘッド、ウエハ加工などの分野における化学物質および材料サプライヤー市場の動向をまとめ、各市場の動向と今後の予測と見通しを交え、概略以下の構成でお届けします。

第1章 イントロダクション

第2章 太陽エネルギー

  • イントロダクション
  • 結晶・多結晶電池の製造
    • シリコン成長とウエハリング
    • エッチングとテキスチャリング
    • 反射防止コーティング
  • 薄膜電池の製造
    • アモルファスシリコン蒸着
    • マイクロ結晶シリコン蒸着
    • CdTe
    • CIGS
    • GaA
  • 材料サプライヤー市場
    • 結晶・多結晶電池
    • 薄膜電池
    • 化学物質および材料
  • ナノマテリアル
    • 無機ナノ結晶
    • CdSeおよびCdTeナノロッド
    • 量子ドット
    • ナノコンポジットと量子ドットの合成
    • 量子井戸
    • 有機ポリマー - フラーレン
    • イオン有機ポリマー
    • CIGS
    • 色素増感太陽電池
    • 太陽電池向けナノマテリアル市場の分析

第3章 MEMS

  • MEMS市場インフラ
  • 主な用途と市場予測
    • MEMSデバイス市場予測
    • MEMSシステム市場予測
    • 材料サプライヤー市場

第4章 高輝度LED(HB-LED)

  • 高輝度LED技術および応用における近年の進歩
  • 構造材料
    • 蛍光物質
    • 基板
  • OLEDの製造
  • 世界のOLED市場の見通し
  • 世界の高輝度LED市場の見通し

第5章 HDD用薄膜リード/ライトヘッド

  • HDD動向
  • レコーディングヘッド市場予測
  • ヘッド加工
  • ヘッド製造
  • 蒸着課題
  • CMPの課題
  • CMPスラリー市場

第6章 ウエハレベルプロセシング

  • イントロダクション
  • フリップチップ/WLP加工上の課題と動向
  • 金属化の課題と動向
  • UBMエッチの課題と動向
    • エッチプロセス
    • エッチ物質
  • WLP市場分析

図表

目次

In this report we identify areas of related technologies where a small or mid-sized chemical and material companies can compete against larger competitors: Solar, MEMS, LEDs, HDD, and WLP.

Table of Contents

Chapter 1: Introduction

Chapter 2 Solar

  • 2.1 Introduction
  • 2.2 Crystalline and Polycrystalline Cell Manufacturing
    • 2.2.1 Silicon Growing and Wafering
    • 2.2.2 Etching and Texturing
    • 2.2.3 Anti-Reflection Coatings
  • 2.3 Thin Film Cell Manufacturing
    • 2.3.1 Amorphous Silicon Deposition
    • 2.3.2 Microcrystalline Silicon Deposition
    • 2.3.3 CdTe - Cadmium Telluride Deposition
    • 2.3.4 CIGS - Copper Indium Gallium Selenide Deposition
    • 2.3.5 GaAs - Gallium Arsenide
  • 2.4 Markets for Materials Suppliers
    • 2.4.1 Crystalline and Polycrystalline Cell Forecast
    • 2.4.2 Thin Film Cell Forecast
    • 2.4.3 Chemicals and Materials Forecast
  • 2.5 Nanomaterials As Solar Conversion
    • 2.5.1 Inorganic Nanocrystals
    • 2.5.2 CdSe And CdTe Nanorods
    • 2.5.3 Quantum Dots
    • 2.5.4 Nanocomposite - Quantum Dot Combination
    • 2.5.5 Quantum Wells
    • 2.5.6 Organic Polymers - Fullerenes
    • 2.5.7 Ionic Organic Polymers
    • 2.5.8 CIGS
    • 2.5.9 Dye-Sensitized Solar Cells
    • 2.5.10 Analysis Of Nanomaterial Markets For Solar Cells

Chapter 3 MEMs

  • 3.1 The MEMS Market Infrastructure
  • 3.2 Forecast Of The Key Applications And Markets
    • 3.2.1 MEMS Device Market Forecast
    • 3.2.2 MEMS System Market Forecast
    • 3.3.2 Markets for Materials Suppliers

Chapter 4 HB-LEDs

  • 4.1 Recent Progress in High Brightness LED Technology and Applications
  • 4.2 Materials of Construction
    • 4.2.1 Phosphor
    • 4.2.2 Substrate
  • 4.3 OLED Manufacturing
  • 4.4 Outlook for the Worldwide OLED Market
  • 4.5 Outlook for the Worldwide HB-LED Market

Chapter 5 Thin Film Read/Write Heads for HDD

  • 5.1 Trends in HDDs
  • 5.2 Recording Head Market Forecast
  • 5.3 Head Processing
  • 5.4 Head Fabrication -
  • 5.5 Deposition Challenges
  • 5.6 CMP Challenges
  • 5.7 CMP Slurry Market
    • 5.7.1 Ceria Slurry For Glass Disk Market
    • 5.7.2 Oxide Slurry For Metal Disk Market
    • 5.7.3 Oxide Slurry For Thin Film Head Market

Chapter 6 Wafer Level Processing (WLP)

  • 6.1 Introduction
  • 6.2 Flip Chip/WLP Processing Issues and Trends
    • 6.2.1 Wafer Bumping
    • 6.2.2 Wafer Level Packaging
    • 6.2.3 Pad Redistribution
    • 6.2.4 Wafer Bumping Costs
  • 6.3 Metallization Issues and Trends
    • 6.3.1 Gold Bumping Metallization
    • 6.3.2 Solder Bumping Metallization
  • 6.4 UBM Etch Issues And Trends
    • 6.4.1 Etch Process
    • 6.4.2 Etch Chemistry
  • 6.5 Analysis of WLP Market

List of Figures

  • 2.1 Diagram Of Solar Cell
  • 2.2 Cross Section Of A Solar Cell Under Illumination
  • 2.3 Polysilicon Manufacturing And Supply Chain
  • 2.4 Cross-Sectional Schematic Diagram Of The InGaP/InGaAs/Ge/ATJ Cell
  • 2.5 Percentage Gas Costs For Amorphous Silicon Solar Cell
  • 3.1 MEMs Chemicals Forecast
  • 3.2 MEMs Photomasks Forecast
  • 3.3 MEMs Substrate Forecast
  • 3.4 Forecast of MEMs Wafer Size
  • 4.1 Operation of LED
  • 4.2 Market drivers for LED Biz and Applications
  • 4.3 SSL vs. Classical Technologies
  • 4.4 LED Performance vs. Traditional Light Sources
  • 4.5 Regular LED (white) Front-End Steps
  • 4.6 Packaged LED Cost Basis - 2009
  • 4.7 Packaged LED Cost Basis - 2013
  • 4.8 Regular LED (White) Production Costs For 100k Wafers/Year
  • 4.9 HB LED (White) Production Costs For 100k Wafers/Year
  • 4.10 LED Cost Model: Impact Of Substrate Choice
  • 4.11 Main Manufacturing Steps For GaN-Based Led
  • 4.12 Schematic Of AMOLED
  • 4-13 Active Matrix OLED Capacity And Demand Forecast
  • 5.1 Hard Disk Drive Roadmap
  • 5.2 Decrease In Average Price Of Storage
  • 5.3 Heads Per Drive
  • 5.4 Market Forecast Of Recording Head Consumption
  • 5.5 Heads Per Drive Forecast
  • 5.6 Thin Film Head Structure
  • 5.7 Critical Features In Thin Film Head Structure
  • 5.8 Spin Valve Head Structure
  • 5.9 Cross-Sectional View TFH Stacks
  • 5.10 Cross-Sectional View Of A TFH Design
  • 5.11 CMP Slurry System For TFH Wafer Polishing
  • 5-12 Total Slurry Consumption For HDD Forecast
  • 6.1 Solder Bumping Process
  • 6.2 Pillar-WLP CSP Process
  • 6.3 Pad Redistribution Process

List of Tables

  • 2.1 Historic Solar Cell Production By Region
  • 2.2 Solar Cell Forecast
  • 2.3 Market Share Of Solar Cells By Technology
  • 2.4 Cost Comparison Of Thin Film Technologies
  • 2.5 Polysilicon Production Capacities By Company
  • 2.6 Affect Of Substrate Material On Cigs Solar Efficiency
  • 2.7 Forecast Of Transparent Electrodes For Photovoltaics
  • 2.8 Solar Materials Forecast - Crystalline Silicon Cells
  • 3.1 MEMS Device Market Forecast
  • 3.2 MEMS System Markets Forecast
  • 4.1 Color, Wavelength Material Of LED
  • 4.2 Comparison of LED, HB-LED, UHB-LED Characteristics
  • 4.3 Production Method for Various LEDs
  • 4.4 Comparison Of $/Klm For LED Made On Various 2" Substrates
  • 4.5 Forecast Of Sapphire Substrate Size Distribution By Area
  • 4.6 Sapphire Substrate Market Forecast
  • 4.7 Projected Costs Of OLED Lighting Panels (Sheet Processed) Stage
  • 4.8 Projected Costs Of OLED Lighting Panels (Web Processed) Stage
  • 4.9 Global LED Market Forecast
  • 5.1 Slurry And Abrasive Suppliers And Products
  • 5.2 Worldwide Ceria Slurry For Glass Media Market Forecast
  • 5.3 Worldwide Oxide Slurry For Metal Market Forecast
  • 5.4 Worldwide Oxide Slurry For Thin Film Heads Market Forecast
  • 6.1 Common UBM Stacks For Solder And Gold Bumping
  • 6.2 Solder Bumping Guidelines
  • 6.3 ITRS Pin Counts For Different Applications
  • 6.4 Pillar-WLP CSP Guidelines
  • 6.5 Pad Redistribution Guidelines
  • 6.6 Common UBM Stacks For Gold And Solder Bumping
  • 6.7 UBM Film Etchants
  • 6.8 WLP Demand By Device (Units)
  • 6.9 WLP Demand By Device (Wafers)
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