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中小半導体装置メーカーのニッチ市場と戦略

Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies

発行 Information Network 商品コード 122068
出版日 ページ情報 英文
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中小半導体装置メーカーのニッチ市場と戦略 Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies
出版日: 2016年07月01日 ページ情報: 英文
概要

当レポートでは、中小半導体装置メーカーの動向と戦略について分析し、300mmウエハ加工のニッチ市場、SUB 3mmウエハ装置のニッチ市場それぞれの動向各セグメントにおける今後の見通しと課題などについてまとめ、概略以下の構成でお届けします。

第1章 イントロダクション

第2章 300mmウエハ加工のニッチ市場

  • イントロダクション
  • ウエハレベルプロセシング
    • イントロダクション
    • フリップチップ/WLP加工上の課題と動向
    • リトグラフィー上の課題と動向
    • UBMエッチの課題と動向
    • 金属化の課題と動向
    • 市場分析
  • 3-D TSV
    • 重要課題の検証
    • コスト構造
    • 重要加工技術
    • 重要開発セグメントの評価
    • TSVデバイス予測
  • 不揮発性メモリデバイスMRAM、RRAM、およびFeRAM
    • MRAMの加工要件
    • RRAMの加工要件
    • FeRAMの加工要件
    • 商品化へのロードマップ
  • 超薄型ウエハ
    • 超薄型ウエハの応用
    • 基板の薄膜化
    • 背部金属化要件
    • 表面ストレス除去
    • 超薄型ウエハ市場

第3章 SUB 3mmウエハ装置のニッチ市場

  • イントロダクション
  • MEMS
    • 市場インフラ
    • 応用と市場予測
    • 装置および材料サプライヤー市場
  • 高輝度LED(HB-LED)
    • 高輝度LED技術および応用における近年の進歩
    • 加工装置
    • 有機EL製造
    • 世界の有機EL市場の見通し
    • 世界の高輝度LED市場の見通し
  • 化合物半導体
    • GaA装置
    • 装置動向
    • ウエハサイズ
    • GaA IC市場予測
    • SiGeとの競合
  • HDD用薄膜リード/ライトヘッド
    • HDD動向
    • レコーディングヘッド市場予測
    • ヘッド加工
    • ヘッド製造
    • CMPの課題
    • リトグラフィーの課題
  • バルク超音波
    • バルク超音波装置の基本的構成
    • AINレイヤー品質要件
    • バルク超音波およびFBARフィルター装置の要件
    • バルク超音波市場

図表

目次

In this report we identify and forecast areas of semiconductor-related technologies where a small or mid-sized company can compete. These high-tech applications segmented as those are fabricated on 300mm wafers and those built on non-300mm wafers.

The small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience.

Table of Contents

Chapter 1 Introduction

Chapter 2 Niche Markets for PROCESSES for 300mm Wafers

  • 2.1 Introduction
  • 2.2 Wafer Level Processing (WLP)
    • 2.2.1 Introduction
    • 2.2.2 Flip Chip/WLP Processing Issues and Trends
      • Wafer Bumping
      • Wafer Level Packaging
      • Pad Redistribution
      • Wafer Bumping Costs
    • 2.2.3 Lithography Issues And Trends
    • 2.2.4 UBM Etch Issues And Trends
    • 2.2.5 Metallization Issues and Trends
      • Gold Bumping Metallization
      • Solder Bumping Metallization
    • 2.2.6 Analysis of WLP Market
  • 2.3 3-D TSV
    • 2.3.1 Insight Into Critical Issues
    • 2.3.2 Cost Structure
    • 2.3.3 Critical Processing Technologies
    • 2.3.4 Evaluation Of Critical Development Segments
    • 2.3.5 TSV Device Forecast
  • 2.4 Non-volatile Memory Devices MRAM, RRAM and FeRAM
    • 2.4.1 Processing Requirements for MRAMs
    • 2.4.2 Processing Requirements for RRAMs
    • 2.4.3 Processing Requirements for FeRAMs
    • 2.4.4 Roadmap for Commercialization
  • 2.5 Ultrathin Wafers
    • 2.5.1 Applications for Ultrathin Wafers
    • 2.5.2 Substrate Thinning
    • 2.5.3 Backside Metallization Requirements
    • 2.5.4 Surface Stress Relief
    • 2.5.5 Ultrathin Wafer Market

Chapter 3 Niche Markets for EQUIPMENT for SUB 300mm Wafers

  • 3.1 Introduction
  • 3.2 MEMs
    • 3.2.1 The MEMS Market Infrastructure
    • 3.2.2 Forecast Of The Key Applications And Markets
      • MEMS Device Market Forecast
      • MEMS System Market Forecast
    • 3.2.3 Markets for Equipment and Materials Suppliers
  • 3.3 HB-LEDs
    • 3.3.1 Recent Progress in High Brightness LED Technology and Applications
    • 3.3.2 Processing Equipment
    • 3.3.3 Materials of Construction
    • 3.3.4 OLED Manufacturing
    • 3.3.5 Outlook for the Worldwide OLED Market
    • 3.3.6 Outlook for the Worldwide HB-LED Market
  • 3.4 Compound Semiconductors
    • 3.4.1 GaAs Devices
    • 3.4.2 Equipment Trends
    • 3.4.3 Wafer Sizes
    • 3.4.4 GaAs IC Market Forecast
    • 3.4.5 Competing Against SiGe
  • 3.5 Thin Film Read/Write Heads for HDD
    • 3.5.1 Trends in HDDs
    • 3.5.2 Recording Head Market Forecast
    • 3.5.3 Head Processing
    • 3.5.4 Head Fabrication - CMP, Deposition, Lithography
    • 3.5.5 CMP Challenges
    • 3.5.6 Lithography Challenges
  • 3.6 Bulk Acoustic Wave (BAW)
    • 3.6.1 Basic Elements of the BAW Device
    • 3.6.2 AlN Layer Quality Requirements
    • 3.6.3 Equipment Requirements for BAW and FBAR Filtering Devices
    • 3.6.4 Bulk Acoustic Wave (BAW) Market

List of Tables

  • 2.1 Common UBM Stacks For Solder And Gold Bumping
  • 2.2 Solder Bumping Guidelines
  • 2.3 ITRS Pin Counts For Different Applications
  • 2.4 Pillar-WLP CSP Guidelines
  • 2.5 Pad Redistribution Guidelines
  • 2.6 UBM Film Etchants
  • 2.7 Common UBM Stacks For Gold And Solder Bumping
  • 2.8 WLP Demand By Device (Units)
  • 2.9 WLP Demand By Device (Wafers)
  • 2.10 Forecast Of TSV Devices By Wafers
  • 3.1 MEMS Device Markets
  • 3.2 MEMS System Markets
  • 3.3 MEMS Equipment Markets
  • 3.4 Color, Wavelength Material Of LED
  • 3.5 Comparison of LED, HB-LED, UHB-LED Characteristics
  • 3.6 Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap
  • 3.7 Process Control Metrics
  • 3.8 Production Method for Various LEDs
  • 3.9 GaAs IC Market Forecast
  • 3.10 Comparison Of Piezoelectric Materials For BAW Applications

List of Figures

  • 2.1 Solder Bumping Process
  • 2.2 Pillar-WLPCSP Process
  • 2.3 Pad Redistribution Process
  • 2.4 Via First (iTSV) Cost Of Ownership
  • 2.5 Via First (iTSV) Cost Of Ownership Front And Back Side
  • 2.6 Via First (iTSV) Process Flow
  • 2.7 iTSV Versus pTSV Cost Of Ownership
  • 2.8 Effect Of TSV Depth And Diameter On Cost
  • 2.9 Illustration Of Bosch Process
  • 2.10 Process And Equipment Flow For EMC3D Consortium Members
  • 2.11 Various TSV Integration Schemes
  • 2.12 Forecast OF TSV Devices By Wafers
  • 3.1 Operation of LED
  • 3.2 Market drivers for LED Biz and Applications
  • 3.3 SSL vs. Classical Technologies
  • 3.4 LED Performance vs. Traditional Light Sources
  • 3.5 Pareto Analysis Of SSL Manufacturing Costs
  • 3.6 Nanoimprint Lithography System
  • 3.7 Regular LED (white) Front-End Steps
  • 3.8 Schematic of AMOLED
  • 3.9 Active Matrix OLED Capacity and Demand Forecast
  • 3.10 LED Market by Sector
  • 3.11 Worldwide LED Market Forecast
  • 3.12 Schematic of GaAs MESFET
  • 3.13 Schematic of GaAs HEMT Device
  • 3.14 Schematic of GaAs HBT Device
  • 3.15 Schematic of GaAs HBT Device
  • 3.16 pHEMT MMIC Process Flow Chart
  • 3.17 0.15 Micron 3MI Process Cross Section
  • 3.18 InGaP HBT Process
  • 3.19 Worldwide SiGe Market Forecast
  • 3.20 Hard Disk Drive Roadmap
  • 3.21 Decrease In Average Price Of Storage
  • 3.22 Heads Per Drive
  • 3.23 Increase In Areal Density
  • 3.24 Market Forecast Of Recording Head Consumption
  • 3.25 Heads Per Drive Forecast
  • 3.26 Thin Film Head Structure
  • 3.27 Critical Features In Thin Film Head Structure
  • 3.28 Spin Valve Head Structure
  • 3.29 Cross-Sectional View TFH Stacks
  • 3.30 Cross-Sectional View Of A TFH Design
  • 3.31 CMP Slurry System For Tfh Wafer Polishing
  • 3.32 Critical Feature Trends In Thin Film Heads
  • 3.33 Application Space For Rf Filters
  • 3.34 FBAR Diagram
  • 3.35 BAW-SMR Diagram
  • 3.36 RF Front-End Filters In Mobile Devices
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