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25/100Gから400/600Gへ:光モジュール・コンポーネントの競合分析

From 25/100G to 400/600G: A Competitive Analysis of Optical Modules & Components

発行 Heavy Reading 商品コード 337762
出版日 ページ情報 英文 80 Pages
納期: 即日から翌営業日
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25/100Gから400/600Gへ:光モジュール・コンポーネントの競合分析 From 25/100G to 400/600G: A Competitive Analysis of Optical Modules & Components
出版日: 2017年07月31日 ページ情報: 英文 80 Pages
概要

当レポートでは、主なネットワーキング、光モジュールおよび半導体技術とその25G/100G/200G/400Gポートへのアプリケーションについて詳細に分析し、主要ベンダー (光モジュールベンダー、シリコンベンダー) の製品と戦略について検証しています。

第1章 エグゼクティブサマリー

第2章 100/400G 市場・技術

  • 市場概要
  • 40/100G イーサネット
  • 25/50/200G イーサネット
  • 400G イーサネット
  • InfiniBand
  • ファイバーチャンネル
  • Sonet/SDH、DWDM、OTN

第3章 データセンター/エンタープライズ向け光モジュール

  • 25G & 100G 光モジュールの概要
  • 200G/400G 光モジュールの概要
  • アクティブケーブル
  • SFP28光モジュール
  • QSFP28/QSFP56 & QFSP-DD光モジュール
  • CXP 光モジュール
  • CFP 光モジュール
  • CFP2 光モジュール
  • CFP4 光モジュール
  • CFP8 光モジュール
  • Cisco CPAK 光モジュール

第4章 ロングホール・メトロソリューション

  • ODB・DPSK・DQPSK OOK変調
  • DP-QPSK & コヒーレントレシーバー
  • QAM変調
  • メトロ/ロングホールCFPモジュール
  • メトロCFP2モジュール
  • ロングホール・メトロトランスポンダーモジュール

第5章 100-600G シリコンデバイス

  • ランシーバー & ギアボックスデバイス
  • PAM4 PHY/Mux デバイス
  • マルチレーンCDRデバイス
  • ドライバー・レシーバーアレイ
  • 100-400Gパケット光トランスポートプラットフォーム (P-OTP) デバイス

第6章 光モジュールベンダー

  • Acacia Communications Inc.
  • Amphenol Corp.
  • Applied Optoelectronics Inc. (AOI)
  • Champion ONE (Champion Optical Network Engineering LLC)
  • Cisco Systems Inc.
  • ColorChip Inc.
  • Effdon Networks Ltd.
  • Eoptolink Technology Inc.
  • Finisar Corp.
  • Foxconn Interconnect Technology Limited (FIT)
  • 富士通オプティカルコンポーネンツ
  • Gigalight (Shenzhen Gigalight Technology Co. Ltd.)
  • Hisense Broadband Multimedia Technologies Co. Ltd.
  • InnoLight Technology Corp.
  • Inphi Corp.
  • Intel Corp.
  • Kaiam Corp.
  • Lumentum Holdings Inc.
  • Luxtera Inc.
  • Mellanox Technologies Ltd.
  • Menara Networks
  • Molex Inc.
  • NEC (日本電気)
  • NeoPhotonics Corp.
  • Oclaro Inc.
  • OE Solutions Co. Ltd.
  • Oplink Communications LLC
  • Optcore Technology Co. Ltd.
  • ProLabs Ltd.
  • Reflex Photonics Inc.
  • Smartoptics AS
  • Source Photonics Inc.
  • 住友電気工業
  • TE Connectivity Ltd.
  • Wuhan RayOptek Co. Ltd.

第7章 シリコンベンダー

  • Achronix Semiconductor Corp.
  • Broadcom Corp.
  • Credo Semiconductor Inc.
  • eTopus Technology Inc.
  • Flex Logix Technologies Inc.
  • Integrated Device Technology Inc. (IDT)
  • Inphi Corp.
  • Intel Corp.
  • Macom (M/A-COM Technology Solutions Holdings Inc.)
  • MaxLinear Inc.
  • Mellanox Technologies Ltd.
  • Microsemi Corp.
  • MoSys Inc.
  • MultiPhy Ltd.
  • NTTエレクトロニクス (NEL)
  • Semtech Corp.
  • Xilinx Inc.

付録A:著者について

付録B:免責事項

図表

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目次

Global communications networks are changing dramatically. High-speed mobile access and cloud services are driving massive bandwidth demand from users. Virtualization is changing the network, with application servers and many of the network functions themselves hosted in large data centers. Hyperscale data center operators and service providers are installing 100 Gbit/s (100G) connections across their networks, deploying 25G to servers, 400G connections between data centers and looking forward to terabit connections. These developments are pushing the industry to deliver lower costs and greater bandwidths.

The optical module and components industry has responded to these demands with 100G solutions that already cost less per gigabit than equivalent 10G and 40G solutions, and new developments to further drive down cost and increase bandwidths. The keys to these 100G developments have been low-power and cost-effective 25G components, and smart assembly of optical modules either by using standard subassemblies with automated test, or by the use of silicon photonics or similar technologies.

These developments have enabled a shift to modules with four 25/28G lanes or wavelengths for 100G Ethernet. The next step is using PAM4 coding in place of NRZ. The first components and optical modules using PAM4 are already becoming available, supporting 100G with two lanes/wavelengths, 200G with four lanes/wavelengths or 400G with eight lanes/wavelengths. The ultimate goal for client-side component and module vendors at the moment is single-lane/wavelength 100G, using PAM4 and 56 Gbaud serial lanes to further drive down the cost and real estate for 100G. This also enables four-lane/wavelength 400G and eight-lane/ wavelength 800G. The IEEE has agreed on PSM4 with four parallel fibers for the 500 m 400GBASE-DR4 specification that is part of the IEEE802.3bs standard being developed for approval by the end of 2017. The industry is already developing solutions including semiconductor and optical components, and optical modules for all of these applications.

The QSFP28 modules for 100G Ethernet and SFP28 modules for 25G Ethernet are now the dominant form factors. CFP, CFP2 and CFP4 remain important for some applications but have been eclipsed by QSFP28. The first 200G modules for data center and enterprise applications are using QSFP modules - either QSFP56 or QSFP-DD. The big question is, what is the right module for 400G? The first CFP8 modules are already available. QSFP-DD is backward compatible with QSFP, and OSFP may deliver better performance, especially as networks move to 800G interfaces.

Coherent technology developed for 100G long-haul networks is now enabling 200G, 400G and 600G connections in metro networks and between data centers. The market for data center interconnect (DCI) and metro networks is growing rapidly, with many systems vendors offering solutions in the all-important 80-500 km reach. New digital signal processor (DSP) ASICs and CFP2-ACO modules are giving equipment manufacturers many options with support for multiple modulation schemes including coherent DP-QPSK, 16QAM and 64QAM. For long-haul and metro applications, many equipment manufacturers are currently using in-house designs. That may change with the latest DSP and module developments, and with Ciena making its coherent technology available to three leading optical module vendors.

This is a market in flux. Several new players have recently entered the market with innovative semiconductor and optical components or new approaches to module manufacturing. Several vendors that are focused on supplying optical modules direct to service providers, and therefore shortening the supply chain, are now delivering on a wide range of 100G modules. We are also seeing several Chinese vendors expanding their sales outside China and offering large product portfolios. Established players are responding to these challenges with highly integrated products and investments to deliver on the latest requirements.

Silicon devices are critical for 25-600G systems and optical modules. Transceiver and gearbox devices integrate support for the different modulation schemes. PAM4 PHY/Mux and 50G CDR devices are required for the latest optical modules. Laser driver and receiver arrays enable cost-effective optical modules and packet-optical transport platform (P-OTP) devices integrate most of the functionality for 100G and 400G P-OTP systems on a single device.

‘From 25/100G to 400/600G: A Competitive Analysis of Optical Modules & Components’ identifies key networking, optical module and semiconductor technologies and details their application to 25G, 100G, 200G, 400G and 600G ports, identifying and analyzing the full spectrum of vendors developing optical modules and components. The report includes not only granular information on the optical modules and components themselves - of interest to telecom equipment manufacturers, service providers, optical module vendors and semiconductor vendors - but also insights into how the overall market and ecosystem is developing - of interest to a wide audience, including investors.

The report evaluates and analyzes the products and strategies of 49 leading vendors in this rapidly growing market, including more than 300 optical modules and almost 150 semiconductor components.

Global communications networks are changing dramatically. High-speed mobile access and cloud services are driving massive bandwidth demand from users. Virtualization is changing the network, with application servers and many of the network functions themselves hosted in large data centers. Hyperscale data center operators and service providers are installing 100 Gbit/s (100G) connections across their networks, deploying 25G to servers, 400G connections between data centers and looking forward to terabit connections. These developments are pushing the industry to deliver lower costs and greater bandwidths.

The optical module and components industry has responded to these demands with 100G solutions that already cost less per gigabit than equivalent 10G and 40G solutions, and new developments to further drive down cost and increase bandwidths. The keys to these 100G developments have been low-power and cost-effective 25G components, and smart assembly of optical modules either by using standard subassemblies with automated test, or by the use of silicon photonics or similar technologies.

These developments have enabled a shift to modules with four 25/28G lanes or wavelengths for 100G Ethernet. The next step is using PAM4 coding in place of NRZ. The first components and optical modules using PAM4 are already becoming available, supporting 100G with two lanes/wavelengths, 200G with four lanes/wavelengths or 400G with eight lanes/wavelengths. The ultimate goal for client-side component and module vendors at the moment is single-lane/wavelength 100G, using PAM4 and 56 Gbaud serial lanes to further drive down the cost and real estate for 100G. This also enables four-lane/wavelength 400G and eight-lane/ wavelength 800G. The IEEE has agreed on PSM4 with four parallel fibers for the 500 m 400GBASE-DR4 specification that is part of the IEEE802.3bs standard being developed for approval by the end of 2017. The industry is already developing solutions including semiconductor and optical components, and optical modules for all of these applications.

The QSFP28 modules for 100G Ethernet and SFP28 modules for 25G Ethernet are now the dominant form factors. CFP, CFP2 and CFP4 remain important for some applications but have been eclipsed by QSFP28. The first 200G modules for data center and enterprise applications are using QSFP modules - either QSFP56 or QSFP-DD. The big question is, what is the right module for 400G? The first CFP8 modules are already available. QSFP-DD is backward compatible with QSFP, and OSFP may deliver better performance, especially as networks move to 800G interfaces.

Coherent technology developed for 100G long-haul networks is now enabling 200G, 400G and 600G connections in metro networks and between data centers. The market for data center interconnect (DCI) and metro networks is growing rapidly, with many systems vendors offering solutions in the all-important 80-500 km reach. New digital signal processor (DSP) ASICs and CFP2-ACO modules are giving equipment manufacturers many options with support for multiple modulation schemes including coherent DP-QPSK, 16QAM and 64QAM. For long-haul and metro applications, many equipment manufacturers are currently using in-house designs. That may change with the latest DSP and module developments, and with Ciena making its coherent technology available to three leading optical module vendors.

This is a market in flux. Several new players have recently entered the market with innovative semiconductor and optical components or new approaches to module manufacturing. Several vendors that are focused on supplying optical modules direct to service providers, and therefore shortening the supply chain, are now delivering on a wide range of 100G modules. We are also seeing several Chinese vendors expanding their sales outside China and offering large product portfolios. Established players are responding to these challenges with highly integrated products and investments to deliver on the latest requirements.

Silicon devices are critical for 25-600G systems and optical modules. Transceiver and gearbox devices integrate support for the different modulation schemes. PAM4 PHY/Mux and 50G CDR devices are required for the latest optical modules. Laser driver and receiver arrays enable cost-effective optical modules and packet-optical transport platform (P-OTP) devices integrate most of the functionality for 100G and 400G P-OTP systems on a single device.

‘From 25/100G to 400/600G: A Competitive Analysis of Optical Modules & Components’ identifies key networking, optical module and semiconductor technologies and details their application to 25G, 100G, 200G, 400G and 600G ports, identifying and analyzing the full spectrum of vendors developing optical modules and components. The report includes not only granular information on the optical modules and components themselves - of interest to telecom equipment manufacturers, service providers, optical module vendors and semiconductor vendors - but also insights into how the overall market and ecosystem is developing - of interest to a wide audience, including investors.

The report evaluates and analyzes the products and strategies of 49 leading vendors in this rapidly growing market, including more than 300 optical modules and almost 150 semiconductor components.

‘From 25/100G to 400/600G: A Competitive Analysis of Optical Modules & Components’ is published in PDF format.

Table of Contents

1. EXECUTIVE SUMMARY

  • 1.1. Key Findings
  • 1.2. Companies Covered

2. 100/400G MARKETS & TECHNOLOGY

  • 2.1. Market Overview
  • 2.2. 40/100G Ethernet
  • 2.3. 25/50/200G Ethernet
  • 2.4. 400G Ethernet
  • 2.5. InfiniBand
  • 2.6. Fibre Channel
  • 2.7. Sonet/SDH, DWDM & OTN

3. OPTICAL MODULES FOR DATA CENTER & ENTERPRISE

  • 3.1. 25G & 100G Optical Module Overview
  • 3.2. 200G/400G Optical Module Overview
  • 3.3. Active Cables
  • 3.4. SFP28 Optical Modules
  • 3.5. QSFP28/QSFP56 & QSFP-DD Optical Modules
  • 3.6. CXP Optical Modules
  • 3.7. CFP Optical Modules
  • 3.8. CFP2 Optical Modules
  • 3.9. CFP4 Optical Modules
  • 3.10. CFP8 Optical Modules
  • 3.11. Cisco CPAK Optical Modules

4. LONG-HAUL & METRO SOLUTIONS

  • 4.1. ODB, DPSK, DQPSK, OOK Modulation
  • 4.2. DP-QPSK & Coherent Receiver
  • 4.3. QAM Modulation
  • 4.4. Metro/Long-Haul CFP Modules
  • 4.5. Metro CFP2 Modules
  • 4.6. Long-Haul & Metro Transponder Modules

5. 100-600G SILICON DEVICES

  • 5.1. Transceiver & Gearbox Devices
  • 5.2. PAM4 PHY/Mux Devices
  • 5.3. Multi-Lane CDR Devices
  • 5.4. Driver & Receiver Arrays
  • 5.5. 100-400G Packet-Optical Transport Platform (P-OTP) Devices

6. OPTICAL MODULE VENDORS

  • 6.1. Acacia Communications Inc.
  • 6.2. Amphenol Corp.
  • 6.3. Applied Optoelectronics Inc. (AOI)
  • 6.4. Champion ONE (Champion Optical Network Engineering LLC)
  • 6.5. Cisco Systems Inc.
  • 6.6. ColorChip Inc.
  • 6.7. Effdon Networks Ltd.
  • 6.8. Eoptolink Technology Inc.
  • 6.9. Finisar Corp.
  • 6.10. Foxconn Interconnect Technology Limited (FIT)
  • 6.11. Fujitsu Optical Components Ltd.
  • 6.12. Gigalight (Shenzhen Gigalight Technology Co. Ltd.)
  • 6.13. Hisense Broadband Multimedia Technologies Co. Ltd.
  • 6.14. InnoLight Technology Corp.
  • 6.15. Inphi Corp.
  • 6.16. Intel Corp.
  • 6.17. Kaiam Corp.
  • 6.18. Lumentum Holdings Inc.
  • 6.19. Luxtera Inc.
  • 6.20. Mellanox Technologies Ltd.
  • 6.21. Menara Networks
  • 6.22. Molex Inc.
  • 6.23. NEC Corp.
  • 6.24. NeoPhotonics Corp.
  • 6.25. Oclaro Inc.
  • 6.26. OE Solutions Co. Ltd.
  • 6.27. Oplink Communications LLC
  • 6.28. Optcore Technology Co. Ltd.
  • 6.29. ProLabs Ltd.
  • 6.30. Reflex Photonics Inc.
  • 6.31. Smartoptics AS
  • 6.32. Source Photonics Inc.
  • 6.33. Sumitomo Electric Industries Ltd.
  • 6.34. TE Connectivity Ltd.
  • 6.35. Wuhan RayOptek Co. Ltd.

7. SILICON VENDORS

  • 7.1. Achronix Semiconductor Corp.
  • 7.2. Broadcom Corp.
  • 7.3. Credo Semiconductor Inc.
  • 7.4. eTopus Technology Inc.
  • 7.5. Flex Logix Technologies Inc.
  • 7.6. Integrated Device Technology Inc. (IDT)
  • 7.7. Inphi Corp.
  • 7.8. Intel Corp.
  • 7.9. Macom (M/A-COM Technology Solutions Holdings Inc.)
  • 7.10. MaxLinear Inc.
  • 7.11. Mellanox Technologies Ltd.
  • 7.12. Microsemi Corp.
  • 7.13. MoSys Inc.
  • 7.14. MultiPhy Ltd.
  • 7.15. NTT Electronics Corp. (NEL)
  • 7.16. Semtech Corp.
  • 7.17. Xilinx Inc.

TERMS OF USE

LIST OF FIGURES

SECTION 1

SECTION 2

  • Figure 2.1: Global IP Traffic
  • Figure 2.2: Data Center Connections
  • Figure 2.3: 40/100GE Layer Model
  • Figure 2.4: 40/100GE Interfaces
  • Figure 2.5: IEEE 40GE Port Types
  • Figure 2.6: IEEE 100GE Port Types
  • Figure 2.7: 100G MSA/Alliance Interfaces
  • Figure 2.8: IEEE 25GE Port Types
  • Figure 2.9: 400GE Interfaces
  • Figure 2.10: IEEE 400GE Port Types
  • Figure 2.11: InfiniBand Data Rates
  • Figure 2.12: Fibre Channel Speed Roadmap

SECTION 3

  • Figure 3.1: 25G SFP28 Optical Module
  • Figure 3.2: 100G Optical Modules for Data Center & Enterprise
  • Figure 3.3: CFP Module Diagram
  • Figure 3.4: CFP Modules
  • Figure 3.5: CDFP Optical Module
  • Figure 3.6: 200/400G Optical Modules for Data Center & Enterprise
  • Figure 3.7: CFP8 Module
  • Figure 3.8: QSFP-DD 2x1 Stacked Cage With Integrated Connector
  • Figure 3.9: QSFP-DD 1xn Cage With SMT Connector In
  • Figure 3.10: OSFP 400G Module
  • Figure 3.11: Typical Optical Active Cable
  • Figure 3.12: 25G SFP28 Active Cables
  • Figure 3.13: 100G QSFP28 & QSFP-DD Active Optical Cables
  • Figure 3.14: CXP Active Optical Cable
  • Figure 3.15: CXP Active Optical Cables
  • Figure 3.16: SFP28 Module
  • Figure 3.17: SFP28 Short-Reach Modules
  • Figure 3.18: SFP28 Long-Reach Modules
  • Figure 3.19: QSFP28 Optical Module
  • Figure 3.20: QSFP-DD & PAM4 QSFP Modules
  • Figure 3.21: 100G MMF QSFP28 Modules
  • Figure 3.22: 100G PSM4 QSFP28 Modules
  • Figure 3.23: 100G 2 km CLR4/CWDM4 QSFP28 Modules
  • Figure 3.24: 100G 4WDM-10 QSFP28 Modules
  • Figure 3.25: Long-Reach QSFP28 100GBASE-LR4 Modules
  • Figure 3.26: Extended-Reach QSFP28 100GBASE-ER4 Modules
  • Figure 3.27: CXP Module
  • Figure 3.28: CXP Optical Modules
  • Figure 3.29: CFP Module
  • Figure 3.30: Short-Reach 100G CFP Modules
  • Figure 3.31: Long-Reach 100G CFP Modules
  • Figure 3.32: Extended-Reach 100G CFP Modules
  • Figure 3.33: CFP2 Module
  • Figure 3.34: CFP2 Modules
  • Figure 3.35: CFP4 Module
  • Figure 3.36: CFP4 Modules
  • Figure 3.37: CFP8 Module
  • Figure 3.38: 400G CFP8 Modules
  • Figure 3.39: Cisco CPAK 100GBASE-LR4 Module
  • Figure 3.40: Cisco CPAK Modules

SECTION 4

  • Figure 4.1: 100G DP-QPSK Coherent Transceiver
  • Figure 4.2: QAM Modulation
  • Figure 4.3: 100/200G Metro/Long Haul CFP Modules
  • Figure 4.4: 100-600G Metro CFP2 Modules
  • Figure 4.5: Long-Haul Transponder Modules
  • Figure 4.6: 168-Pin 100G Long-Haul DWDM Optical Module
  • Figure 4.7: 100G OIF 168-Pin MSA Modules
  • Figure 4.8: 400G Coherent Module
  • Figure 4.9: 400G Modules

SECTION 5

  • Figure 5.1: 100-600G Coherent Transceivers
  • Figure 5.2: 100G Gearbox Devices
  • Figure 5.3: 100G Mux & Demux Devices
  • Figure 5.4: PAM4 PHY Devices
  • Figure 5.5: 50G Multi-Lane CDR Devices
  • Figure 5.6: 25G Multi-Lane CDR Devices
  • Figure 5.7: DML/EML Driver Arrays
  • Figure 5.8: VCSEL Driver Arrays
  • Figure 5.9: Receiver Arrays
  • Figure 5.10: Typical 100/120G Integrated Packet-Optical Transport Device
  • Figure 5.11: 100-400G P-OTP Device Summary
  • Figure 5.12: 100-400G P-OTP Device Features

SECTION 6

  • Figure 6.1: Data Center & Enterprise Optical Module Vendors
  • Figure 6.2: Long-Haul & Metro Optical Module Vendors

SECTION 7

  • Figure 7.1: Silicon Vendors

OPTICAL MODULE VENDORS PROFILED:

  • Acacia Communications Inc. (Nasdaq: ACIA)
  • Amphenol Corp. (NYSE: APH)
  • Applied Optoelectronics Inc. (AOI; Nasdaq: AAOI)
  • Champion ONE (Champion Optical Network Engineering LLC)
  • Cisco Systems Inc. (Nasdaq: CSCO)
  • ColorChip Ltd.
  • Effdon Networks Ltd.
  • Eoptolink Technology Inc. Ltd. (SZ: 300502)
  • Finisar Corp. (Nasdaq: FNSR)
  • Foxconn Interconnect Technology Limited (FIT; a wholly owned subsidiary of Hon Hai Precision Industry Co. Ltd.)
  • Fujitsu Optical Components, a subsidiary of Fujitsu Ltd. (TSE: 6702; OTC: FJTSY)
  • Gigalight (Shenzhen Gigalight Technology Co. Ltd.)
  • Hisense Broadband Multimedia Technologies Co. Ltd.
  • InnoLight Technology Corp.
  • Inphi Corp. (NYSE: IPHI)
  • Intel Corp. (Nasdaq: INTC)
  • Kaiam Corp.
  • Lumentum Holdings Inc. (Nasdaq: LITE)
  • Luxtera Inc.
  • Mellanox Technologies Ltd. (Nasdaq: MLNX)
  • Menara Networks, a wholly-owned subsidiary of IPG Photonics Corp. (Nasdaq: IPGP)
  • Molex Inc. (Nasdaq: MOLX)
  • NEC Corp. (TSE: 6701)

SILICON VENDORS PROFILED:

  • Achronix Semiconductor Corp.
  • Broadcom Corp. (Nasdaq: BRCM)
  • Credo Semiconductor Inc.
  • eTopus Technology Inc.
  • Flex Logix Technologies Inc.
  • Inphi Corp. (NYSE: IPHI)
  • Integrated Device Technology Inc. (Nasdaq: IDTI)
  • Intel Corp. (Nasdaq: INTC)
  • Macom (M/A-COM Technology Solutions Holdings Inc. [Nasdaq: MTSI])
  • MaxLinear Inc. (NYSE: MXL)
  • Mellanox Technologies Ltd. (Nasdaq: MLNX)
  • Microsemi Corp. (Nasdaq: MSCC)
  • MoSys Inc.
  • MultiPhy Ltd.
  • NTT Electronics Corp. (NEL)
  • Semtech Corp. (Nasdaq: SMTC)
  • Xilinx Inc. (Nasdaq: XLNX)
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