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フォトニック集積、スーパーチャンネルおよびテラビットネットワークへの歩み

Photonic Integration, Super Channels & the March to Terabit Networks

発行 Heavy Reading 商品コード 248000
出版日 ページ情報 英文 64 Pages
納期: 即日から翌営業日
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フォトニック集積、スーパーチャンネルおよびテラビットネットワークへの歩み Photonic Integration, Super Channels & the March to Terabit Networks
出版日: 2012年07月31日 ページ情報: 英文 64 Pages
概要

当レポートは、フォトニック集積回路(PIC)の現況と将来の発展について詳細に分析しており、光集積のイントロダクション、定義、技術、概要およびメリット、フォトニック集積の主な市場機会と課題、主要ベンダーのプロファイルなどをまとめ、概略下記の構成でお届けいたします。

第1章 イントロダクション・主要調査結果

第2章 光集積化

  • 定義・技術
  • フォトニック集積回路
  • 光集積のメトリクス
  • 主な課題

第3章 市場概要

  • フォトニック集積企業の情勢
  • 主な市場機会

第4章 光伝送&クライアントインターフェースの促進因子

  • 高速光伝送
  • 100Gを超えるラインサイドの開発
  • クライアントサイドのインターフェース

第5章 追加のフォトニック集積促進因子

  • ショート・ミッドリーチの相互接続
  • パッシブ光ネットワーク
  • ROADM&マルチキャストスイッチ
  • 次世代のスイッチ

第6章 システムベンダーのプロファイル

  • Alcatel-Lucent/Bell Labs
  • Cisco Systems lnc./Lightwire
  • Huawei Technologies Co. Ltd./CIP Technologies
  • Infinera Corp

第7章 コンポーネントベンダーのプロファイル

  • Acacia Communications Inc.
  • Aurrion Inc.
  • Avago Technologies Inc.
  • CyOptics Inc.
  • Enablence Technologies Inc.
  • Finisar Corp
  • JDS Uniphase Corp
  • Kotura Inc.
  • Luxtera Inc.
  • NeoPhotonics Corp
  • NTT Electronics Corp. (NEL)
  • Oclaro-Opnext
  • OneChip Photonics Inc.
  • Skorpios Technologies Inc.
  • Sumitomo Electric Industries Ltd. (SEI)
  • u2t Photonics AG

付録A:著者について

付録B:免責事項

図表

目次

In this report, Heavy Reading takes an in-depth look at the present state and future evolution of photonic integrated circuits (PICs). PICs have been the subject of much academic and laboratory research, and significant market hype, over the past four decades. Commercial applications for PICs emerged during the 1990s, and commercial PICs took a great leap forward with Infinera's PIC-based DWDM systems in 2004. The introduction and, more importantly, significant success of that DWDM system, sparked new levels of interest in PICs.

Heavy Reading last explored PICs in depth in our March 2008 report, “Photonic Integration & the Future of Optical Networking.” In that report, we stated: “Photonic integration is the optical industry's best hope for scaling to meet future bandwidth needs, while reducing costs per bit.” At that time, we did not factor in the tremendous impact coherent detection would have on long-haul optical transport. In the past five years, we have seen an important shift in innovation in long-haul optical transport from optics to electronics - with the latter centered on coherent detection.

As of 2012, coherent detection has become a central technology for 100G long-haul DWDM transport. In short, the industry is using sophisticated electronic processing to enable 100G transport using less sophisticated optics. We believe coherent detection has, in essence, taken some of the burden off of photonic integration in fulfilling the mission to increase bandwidth and reduce cost per bit for the long-haul market specifically. Thus, in hindsight, we would amend our 2008 statement to include both photonic integration and coherent detection in scaling bandwidth and reducing costs in optical transport.

While photonic integration has not completely revolutionized the optical industry over the past five years, it has matured steadily and broadened its base of commercial suppliers and commercial applications. As we have noted, PICs can be found today in commercial line-side and client-side modules, optical interconnects, PON equipment, and elsewhere. Systems suppliers are increasingly viewing photonic integration as a strong potential differentiator and are moving to bring this optics expertise in-house.

‘Photonic Integration, Super Channels & the March to Terabit Networks’ provides an introduction to the topic of optical integration and includes definitions and technologies as well as an overview of the benefits of photonic integration. The report also provides a market overview, detailing the company landscape and discussing the main market opportunities and challenges for photonic integration.

This report also profiles the four main DWDM systems suppliers with in-house photonic integration expertise and 16 leading optical components suppliers active in photonic integration.

As the industry looks at modules and applications three to five years into the future, photonic integration and PICs are widely viewed as an absolute requirement. Beyond the five-year horizon, Heavy Reading envisions PICs will enter a new phase of evolution focused on systems designs. In this third phase, optics will be pervasive down to centimeter reaches, with such advances leading to a new architecture at each level of design, including system, backplane, line card, and intra-chip. These advances will be required as systems scale to tens and even hundreds of terabits per capacity in the future. The excerpt below depicts this optical integration evolution.

Excerpt 1: Optical Integration - Three Stages of Evolution

Source: Heavy Reading

Optical integration expertise has become a key tool aiding optical component companies, especially the generalist players. Optical component specialists also have an important industry role, focusing on specific markets or using their expertise to develop differentiated products. Meanwhile, system vendors are realizing that owning key technologies such as optical integration is important if they want to better control costs and differentiate their products. For equipment vendors, optical integration is emerging as an important technology asset, as evidenced by certain recent acquisitions. The characteristics of these optical vendor and component categories are summarized in the excerpt below.

Excerpt 2: Optical Integration Company Landscape

OPTICAL COMPONENTS PLAYERSSYSTEM VENDORS
SEGMENTGENERALISTSSPECIALISTSTECHNOLOGY OWNERSBUYERS OR PARTNER
StrengthsScale and vertical
integration
FocusProduct differentiation;
can still choose
component partners
Choice of component partners
WeaknessesLimited ability to
differentiate products
Focus;limited scale;
ability to fund investment
Time taken to absorb
new technology
Limited margins
extreme competition
OpportunitiesThrough execution
the promise of
greater profitability
Fewer specialists, this is
both an opportunity and a threat
Plan new products
earlier and across
plafforms
Varied partnerships
ThreatsConsolidation;
many generalists
impacting profitability
Acquisition targets
limited ability to adapt
Successfully absorbing
acquisitions consolidation
Consolidation

Source: Heavy Reading

REPORT SCOPE & STRUCTURE

‘Photonic Integration, Super Channels & the March to Terabit Networks’ is structured as follows:

Section I is an introduction to the report, with complete report key findings.

Section II provides an introduction to the topic of optical integration and includes definitions and technologies as well as an overview of the benefits of photonic integration.

Section III provides a market overview, detailing the company landscape and discussing the main market opportunities and challenges for photonic integration.

Section IV focuses in depth on the current and future role of photonic integration in both the line-side and client-side modules.

Section V discusses other applications for photonic integration, including short-reach optical interconnects, passive optical networking, and ROADMs and switches.

Section VI profiles the four main DWDM systems suppliers with in-house photonic integration expertise.

Section VII profiles 16 leading optical components suppliers active in photonic integration.

Photonic Integration, Super Channels & the March to Terabit Networks is published in PDF format.

Table of Contents

LIST OF FIGURES

I. INTRODUCTION & KEY FINDINGS

  • 1.1. Key Findings
  • 1.2. Report Scope & Structure

II. OPTICAL INTEGRATION

  • 2.1. Definitions & Technologies
  • 2.2. Photonic Integrated Circuit
    • Hybrid PIC
    • Silicon Photonics
  • 2.3. The Merits of Optical Integration
    • Cost Reduction
    • Size
    • Power Consumption
    • Product Differentiation
  • 2.4. The Key Challenges

III. MARKET OVERVIEW

  • 3.1. Photonic Integration Company Landscape
    • Generalist & Specialists
    • System Vendors
    • Recent Optical Component Acquisitions
    • Recent System Vendor Photonic Integration Acquisitions
  • 3.2. The Main Market Opportunities
    • High-Speed Transmission
    • Short-Reach Interfaces
    • Client-Side Interfaces
    • ROADMs
    • PON

IV. OPTICAL TRANSMISSION & CLIENT INTERFACE DRIVERS

  • 4.1. High-Speed Optical Transmission
    • IQQG Coherent
    • DP-QPSK Transmitter
    • Infinera's 500G Transmitter PIC
    • DP-QPSK Coherent Receiver
    • IQOG Direct Detection
  • 4.2. Line-Side Developments Beyond 100G
    • The Role of Optical Integration
    • Tunable XFP & SFP+
  • 4.3. Client-Side Interfaces
    • 40 GBASE-LR4
    • 100 GBASE-LR4 & 100 GBASE-ER4
    • The IOxIOMSA
    • Integration Opportunities
    • 400GE

V. ADDITIONAL PHOTONIC INTEGRATION DRIVERS

  • 5.1. Short & Mid-Reach Interconnect
    • IEEE Short & Mid-Reach Standards
    • Optical Engines
    • Short- & Mid-Reach Integration Opportunities
  • 5.2. Passive Optical Networking
    • GPON & EPON
    • 10G PON
    • Next-Generation PON
  • 5.3. ROADM & Multicast Switches
  • 5.4. Next-Generation Switches
    • Petabit Packet Crossconnect (PPXC)
    • Silicon Photonics Switch

VI. SYSTEM VENDOR PROFILES

  • 6.1. Alcatel-Lucent/Bell Labs
  • 6.2. Cisco Systems lnc./Lightwire
    • Secondary Drivers & Applications
  • 6.3. Huawei Technologies Co. Ltd./CIP Technologies
    • Photonic Integrated Device (PID)
    • CIP Technologies Acquisition & Strategy
  • 6.4. Infinera Corp
    • Infinera's Optical Functions

VII. COMPONENTS VENDOR PROFILES

  • 7.1. Acacia Communications Inc.
  • 7.2. Aurrion Inc.
  • 7.3. Avago Technologies Inc.
  • 7.4. CyOptics Inc.
  • 7.5. Enablence Technologies Inc.
  • 7.6. Finisar Corp
  • 7.7. JDS Uniphase Corp
  • 7.8. Kotura Inc.
  • 7.9. Luxtera Inc.
  • 7.10. NeoPhotonics Corp
  • 7.11. NTT Electronics Corp. (NEL)
  • 7.12. Oclaro-Opnext
  • 7.13. OneChip Photonics Inc.
  • 7.14. Skorpios Technologies Inc.
  • 7.15. Sumitomo Electric Industries Ltd. (SEI)
  • 7.16. u2t Photonics AG

APPENDIX A: ABOUT THE AUTHOR

APPENDIX B: LEGAL DISCLAIMER

LIST OF FIGURES

SECTION - I

  • Figure 1.1: Optical Integration Three Stages of Evolution

SECTION - II

  • Figure 2.1: Optical & Semiconductor Industry Comparisons
  • Figure 2.2: Linear & Parallel Integration
  • Figure 2.3: Optical Integration Elements

SECTION - III

  • Figure 3.1: Optical Integration Company Landscape
  • Figure 3.2: Huawei & Cisco Recent Optical Integration Acquisitions
  • Figure 3.3: Optical Integration Opportunities Adoption Curve

SECTION - IV

  • Figure 4.1: Modulation Evolution for 40G & 100G Optical Transmission
  • Figure 4.2: A Hybrid Lithium Niobate-PLC DP-QPSK Coherent Transmitter Modulator
  • Figure 4.3: 100G Direct Detection Vendor Product Offerings
  • Figure 4.4: CFP Module Using MultiPhy's MLSE DSP Direct-Detection Receiver Chip
  • Figure 4.5: Key Metrics of the Latest Coherent DSP-ASICs from Ciena & Alcatel-Lucent
  • Figure 4.6: Reach-Modulation Scheme Performance for Coherent Transmission Vendors
  • Figure 4.7: 100G Evolution Roadmap
  • Figure 4.8: IEEE 40G & 100G 10/40km Interface Standards

SECTION - V

  • Figure 5.1: IEEE Interconnect Standards up to 2km
  • Figure 5.2: VCSEL & Silicon Photonics SWOT Analysis
  • Figure 5.3: NGPON2 Reach vs. Bit Rate
  • Figure 5.4: Candidate NGPON2 PON Technologies

SECTION - VI

  • Figure 6.1: Cisco's Target Application Space for Lightwire Technology
  • Figure 6.2: Infinera's PIC Roadmap
  • Figure 6.3: Optical Functions on an Infinera Transmit PIC Circuit

SECTION - VII

  • Figure 7.1: Oclaro-Opnext's Merger & Acquisition History
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