デフォルト表紙
市場調査レポート
商品コード
1212635

3Dチップ(3D IC)の世界市場 2023

3D Chips (3D IC)

出版日: | 発行: Global Industry Analysts, Inc. | ページ情報: 英文 276 Pages | 納期: 即日から翌営業日

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=152.52円
3Dチップ(3D IC)の世界市場 2023
出版日: 2023年01月01日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 276 Pages
納期: 即日から翌営業日
● ご注意事項
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 目次
概要

3Dチップ(3D IC)の世界市場は2030年に404億米ドルに達する

変化したCOVID-19後のビジネス環境において、2022年に107億米ドルと推定される3Dチップ(3D IC)の世界市場は、2030年までに404億米ドルの改定規模に達し、分析期間2022-2030年に18.1%のCAGRで成長すると予測されます。本レポートで分析しているセグメントの一つであるメモリは、CAGRが19.2%を記録し、分析期間終了時には200億米ドルに達すると予測されます。パンデミック後の回復を考慮し、LED分野の成長は、今後8年間のCAGRが18.2%に修正されました。

米国市場は31億米ドル、中国はCAGR16.8%で成長予測

米国の3Dチップ(3D IC)市場は、2022年に31億米ドルと推定されます。世界第2位の経済大国である中国は、2022年から2030年にかけてのCAGRが16.8%となり、2030年には67億米ドルの市場規模に達すると予測されています。その他の注目すべき地域市場としては、日本とカナダがあり、2022年から2030年にかけてそれぞれ16.6%と15.4%の成長が予測されています。欧州では、ドイツがCAGR12.9%で成長すると予測されています。

調査対象企業の例

  • Amkor Technology, Inc.
  • Applied Materials, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Micron Technology, Inc.
  • NVIDIA Corporation
  • Renesas Electronics Corporation
  • STATS ChipPAC Pte., Ltd.
  • STMicroelectronics NV
  • Taiwan Semiconductor Manufacturing Co., Ltd.(TSMC)
  • Toshiba Corporation

目次

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向と促進要因
  • 世界市場の見通し

第3章 市場分析

  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • その他欧州
  • アジア太平洋
  • 世界のその他の地域

第4章 競合

目次
Product Code: MCP-6575

What`s New for 2023?

»Special coverage on Russia-Ukraine war; global inflation; easing of "zero-Covid" policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.

»Global competitiveness and key competitor percentage market shares

» Market presence across multiple geographies - Strong/Active/Niche/Trivial

»Online interactive peer-to-peer collaborative bespoke updates

»Access to our digital archives and MarketGlass Research Platform

»Complimentary updates for one year

Looking Ahead to 2023

The global economy is at a critical crossroads with a number of interlocking challenges and crises running in parallel. The uncertainty around how Russia`s war on Ukraine will play out this year and the war`s role in creating global instability means that the trouble on the inflation front is not over yet. Food and fuel inflation will remain a persistent economic problem. Higher retail inflation will impact consumer confidence and spending. As governments combat inflation by raising interest rates, new job creation will slowdown and impact economic activity and growth. Lower capital expenditure is in the offing as companies go slow on investments, held back by inflation worries and weaker demand. With slower growth and high inflation, developed markets seem primed to enter into a recession. Fears of new COVID outbreaks and China's already uncertain post-pandemic path poses a real risk of the world experiencing more acute supply chain pain and manufacturing disruptions this year. Volatile financial markets, growing trade tensions, stricter regulatory environment and pressure to mainstream climate change into economic decisions will compound the complexity of challenges faced. Year 2023 is expected to be tough year for most markets, investors and consumers. Nevertheless, there is always opportunity for businesses and their leaders who can chart a path forward with resilience and adaptability.

Global 3D Chips (3D IC) Market to Reach $40.4 Billion by 2030

In the changed post COVID-19 business landscape, the global market for 3D Chips (3D IC) estimated at US$10.7 Billion in the year 2022, is projected to reach a revised size of US$40.4 Billion by 2030, growing at a CAGR of 18.1% over the analysis period 2022-2030. Memory, one of the segments analyzed in the report, is projected to record a 19.2% CAGR and reach US$20 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the LEDs segment is readjusted to a revised 18.2% CAGR for the next 8-year period.

The U.S. Market is Estimated at $3.1 Billion, While China is Forecast to Grow at 16.8% CAGR

The 3D Chips (3D IC) market in the U.S. is estimated at US$3.1 Billion in the year 2022. China, the world`s second largest economy, is forecast to reach a projected market size of US$6.7 Billion by the year 2030 trailing a CAGR of 16.8% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 16.6% and 15.4% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 12.9% CAGR.

Select Competitors (Total 26 Featured):

  • Amkor Technology, Inc.
  • Applied Materials, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Micron Technology, Inc.
  • NVIDIA Corporation
  • Renesas Electronics Corporation
  • STATS ChipPAC Pte., Ltd.
  • STMicroelectronics NV
  • Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
  • Toshiba Corporation

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • 3D Chips (3D IC) - Global Key Competitors Percentage Market Share in 2022 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
    • Impact of Covid-19 and a Looming Global Recession
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 2: World 8-Year Perspective for 3D Chips (3D IC) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2023 & 2030
    • TABLE 3: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 4: World 8-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2023 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for LEDs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 6: World 8-Year Perspective for LEDs by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2023 & 2030
    • TABLE 7: World Recent Past, Current & Future Analysis for Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 8: World 8-Year Perspective for Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2023 & 2030
    • TABLE 9: World Recent Past, Current & Future Analysis for MEMS by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 10: World 8-Year Perspective for MEMS by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2023 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Stacked 3D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 12: World 8-Year Perspective for Stacked 3D by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2023 & 2030
    • TABLE 13: World Recent Past, Current & Future Analysis for Monolithic 3D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 14: World 8-Year Perspective for Monolithic 3D by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2023 & 2030
    • TABLE 15: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 16: World 8-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2023 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 18: World 8-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2023 & 2030
    • TABLE 19: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 20: World 8-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2023 & 2030
    • TABLE 21: World Recent Past, Current & Future Analysis for Military & Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 22: World 8-Year Perspective for Military & Aerospace by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2023 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for Medical Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 24: World 8-Year Perspective for Medical Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2023 & 2030
    • TABLE 25: World Recent Past, Current & Future Analysis for Industrial Sector by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 26: World 8-Year Perspective for Industrial Sector by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2023 & 2030
    • TABLE 27: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 28: World 8-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2023 & 2030
    • TABLE 29: World 3D Chips (3D IC) Market Analysis of Annual Sales in US$ Million for Years 2012 through 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2023 (E)
    • TABLE 30: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 31: USA 8-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2023 & 2030
    • TABLE 32: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 33: USA 8-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2023 & 2030
    • TABLE 34: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 35: USA 8-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2023 & 2030
  • CANADA
    • TABLE 36: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 37: Canada 8-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2023 & 2030
    • TABLE 38: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 39: Canada 8-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2023 & 2030
    • TABLE 40: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 41: Canada 8-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2023 & 2030
  • JAPAN
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2023 (E)
    • TABLE 42: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 43: Japan 8-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2023 & 2030
    • TABLE 44: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 45: Japan 8-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2023 & 2030
    • TABLE 46: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 47: Japan 8-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2023 & 2030
  • CHINA
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2023 (E)
    • TABLE 48: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 49: China 8-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2023 & 2030
    • TABLE 50: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 51: China 8-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2023 & 2030
    • TABLE 52: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 53: China 8-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2023 & 2030
  • EUROPE
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)
    • TABLE 54: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 55: Europe 8-Year Perspective for 3D Chips (3D IC) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2023 & 2030
    • TABLE 56: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 57: Europe 8-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2023 & 2030
    • TABLE 58: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 59: Europe 8-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2023 & 2030
    • TABLE 60: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 61: Europe 8-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2023 & 2030
  • FRANCE
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2023 (E)
    • TABLE 62: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 63: France 8-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2023 & 2030
    • TABLE 64: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 65: France 8-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2023 & 2030
    • TABLE 66: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 67: France 8-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2023 & 2030
  • GERMANY
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2023 (E)
    • TABLE 68: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 69: Germany 8-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2023 & 2030
    • TABLE 70: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 71: Germany 8-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2023 & 2030
    • TABLE 72: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 73: Germany 8-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2023 & 2030
  • ITALY
    • TABLE 74: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 75: Italy 8-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2023 & 2030
    • TABLE 76: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 77: Italy 8-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2023 & 2030
    • TABLE 78: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 79: Italy 8-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2023 & 2030
  • UNITED KINGDOM
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2023 (E)
    • TABLE 80: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 81: UK 8-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2023 & 2030
    • TABLE 82: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 83: UK 8-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2023 & 2030
    • TABLE 84: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 85: UK 8-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2023 & 2030
  • REST OF EUROPE
    • TABLE 86: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 87: Rest of Europe 8-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2023 & 2030
    • TABLE 88: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 89: Rest of Europe 8-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2023 & 2030
    • TABLE 90: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 91: Rest of Europe 8-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2023 & 2030
  • ASIA-PACIFIC
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2023 (E)
    • TABLE 92: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 93: Asia-Pacific 8-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2023 & 2030
    • TABLE 94: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 95: Asia-Pacific 8-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2023 & 2030
    • TABLE 96: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 97: Asia-Pacific 8-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2023 & 2030
  • REST OF WORLD
    • TABLE 98: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 99: Rest of World 8-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2023 & 2030
    • TABLE 100: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 101: Rest of World 8-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2023 & 2030
    • TABLE 102: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 103: Rest of World 8-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2023 & 2030

IV. COMPETITION