表紙:半導体 & ICパッケージングマテリアルの世界市場
市場調査レポート
商品コード
908966

半導体 & ICパッケージングマテリアルの世界市場

Semiconductor and IC Packaging Materials

出版日: | 発行: Global Industry Analysts, Inc. | ページ情報: 英文 452 Pages | 納期: 即日から翌営業日

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半導体 & ICパッケージングマテリアルの世界市場
出版日: 2022年02月01日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 452 Pages
納期: 即日から翌営業日
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本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 目次
概要

当レポートでは、世界の半導体 & ICパッケージングマテリアル市場を調査し、市場の定義と概要、市場動向・市場成長への各種影響因子の分析、世界および地域・主要国別の市場規模の推移と予測、各種区分別の内訳、主要企業のプロファイルなどをまとめています

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向・成長推進因子
    • タイプ別
      • 有機基板
      • ボンディングワイヤー
      • リードフレーム
      • セラミックパッケージ
      • カプセル化樹脂
      • その他のタイプ
    • パッケージング技術別
      • SOP
      • GA
      • QFN
      • DFN
      • その他のパッケージング技術

第3章 市場分析

  • 地域市場の分析
  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • その他の欧州
  • アジア太平洋
  • その他の地域

第4章 競合企業

  • BASF SE
  • HENKEL AG & CO., KGAA
  • 日立化成
  • LG CHEM
  • 三井ハイテック
  • 住友化学
  • TANAKAホールディングス
  • 東レ

第5章 調査資料

目次
Product Code: MCP14657

What`s New for 2022?

» Global competitiveness and key competitor percentage market shares

» Market presence across multiple geographies - Strong/Active/Niche/Trivial

» Online interactive peer-to-peer collaborative bespoke updates

» Access to our digital archives and MarketGlass Research Platform

» Complimentary updates for one year

Global Semiconductor and IC Packaging Materials Market to Reach US$33.4 Billion by the Year 2026

Semiconductor or integrated circuit (IC) packaging materials are advanced electronic solutions intended to connect an IC chip to package substrates, another packages or a printed circuit board (PCB). These materials hold critical significance for semiconductor wafer-level packaging, 3D integration and heterogeneous integration technologies. The semiconductor market is likely to register strong growth in 2022 and beyond, mainly due to the pandemic situation which spiked the demand for various electronic systems that help people connect with one another. But this growth, despite being strong, is anticipated to decelerate in years to come. The automotive industry is expected to considerably drive gains in the chip market. Autonomous driving and electric vehicles, among others will aid market growth. Rising focus on the safety aspects in cars such as ADAS and sensors has also been boding well for the market. AI is another driving force of the semiconductor market. HPC (high performance computing) is required in AI. Flip-chip BGA, associated with HPC or AI applications, is registering strong demand. That also comprises high density fan-out, 3D or 2.5D. AI is gaining increasing application in the cloud, with adoption in data centers on the rise. With 5G infrastructure expected to be established, efforts are being made to fulfil the potential rise in demand for SiP (system-in-package).

Amid the COVID-19 crisis, the global market for Semiconductor and IC Packaging Materials estimated at US$21.1 Billion in the year 2020, is projected to reach a revised size of US$33.4 Billion by 2026, growing at a CAGR of 7.7% over the analysis period. Organic Substrates, one of the segments analyzed in the report, is projected to grow at a 8.7% CAGR to reach US$10.5 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the Bonding Wires segment is readjusted to a revised 8.9% CAGR for the next 7-year period. This segment currently accounts for a 19% share of the global Semiconductor and IC Packaging Materials market.

The U.S. Market is Estimated at $1.6 Billion in 2021, While China is Forecast to Reach $7.1 Billion by 2026

The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$1.6 Billion in the year 2021. The country currently accounts for a 7.14% share in the global market. China, the world`s second largest economy, is forecast to reach an estimated market size of US$7.1 Billion in the year 2026 trailing a CAGR of 9.1% through the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 7% and 4.3% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 4.6% CAGR while Rest of European market (as defined in the study) will reach US$615.7 Million by the end of the analysis period.

Ceramic Packages Segment to Reach $5.1 Billion by 2026

In the global Ceramic Packages segment, USA, Canada, Japan, China and Europe will drive the 4.7% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.6 Billion in the year 2020 will reach a projected size of US$2.3 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$2.6 Billion by the year 2026.

Select Competitors (Total 106 Featured) -

  • Amkor Technology, Inc.
  • BASF SE
  • DuPont de Nemours, Inc.
  • Element Solutions Inc.
  • Henkel AG & Co. KGaA
  • Honeywell International Inc.
  • Kyocera Chemical Corporation
  • LG Chem Ltd.
  • Mitsui High-tec, Inc.
  • Showa Denko Materials Co., Ltd.
  • Sumitomo Bakelite Co., Ltd.
  • Tanaka Holdings Co., Ltd.
  • Toppan Printing Co., Ltd.
  • Toray Industries, Inc.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Semiconductor and IC Packaging Materials - Global Key Competitors Percentage Market Share in 2022 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
    • The Race Between the Virus & Vaccines Intensifies. Amidst this Chaotic Battle, Where is the World Economy Headed?
    • Progress on Vaccinations: Why Should Businesses Care?
    • With IMF's Upward Revision of Global GDP Forecasts, Most Companies are Bullish about an Economic Comeback Despite a Continuing Pandemic
    • A Strong Yet Exceedingly Patchy & Uncertain Recovery Shaped by New Variants Comes Into Play: World Economic Growth Projections (Real GDP, Annual % Change) for 2020 through 2022
    • Easing Unemployment Levels in 2021 Although Moderate Will Infuse Hope for Industries Reliant on Consumer Discretionary Incomes: Global Number of Unemployed People (In Million) for Years 2019, 2020, 2021, and 2022
    • Semiconductors are Key Part of the Electronics Value Chain. COVID-19 Exposes the Risk of Value Chain Modularity
    • Among the Hammered in the Supply Chain is the "Semiconductor Industry"
    • The Human Cost of the Pandemic Intensifies the Shockwaves Ripping Through the Semiconductor Industry
    • A Big Blow to Consumerism, Rising Levels of Unemployment Threatens to Shrink the Global Middle Class Population: Unemployment in the U.S. (In Million)
    • Eventual Recovery after the Downturn
    • The Importance of Semiconductors!
    • Global Semiconductor Market to Register Healthy Growth
    • Factors Driving Gains in the Semiconductors Market
    • Amid Perplexing Chip Supply Shortages, Semiconductor Industry Faces Spiraling Prices
    • Global Market Prospects & Outlook
    • COVID-19 Has Created an Environment Where Digital Transformation Equals Survival: Global Digital Transformation Spending (In US$ Billion) for Years 2017 Through 2023
    • Focus Shed on Harnessing Digital Transformation Bodes Well for All Things Electronic & Digital. Semiconductors Storm into the Spotlight
    • US-China Trade War: Impact on Semiconductor Suppliers
    • Semiconductor ICs & Packaging Materials, Definition, Scope, Importance & Types
    • Competitive Scenario
    • Evolution of the Packaging Arena
    • Packaging Players Focus on Capacity Expansion
    • Advanced Packaging Market Witnesses Entry of New Players
    • Recent Market Activity
    • Select Innovations and Advancements
    • Select Global Brands
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Emergence of Quantum Computing Drives the Importance of Semiconductors From Design to Materials
    • As Quantum Hardware Emerges Into an Active Area of Research, New Opportunities to Open for All in the Semiconductor Value Chain: Global Market for Quantum Computing (In US$ Million) for Years 2020 2024 & 2027
    • Growing Demand for New Generation Smart ICs for Emerging Technologies like AI Bodes Well for Growth
    • AI Unleashes a New Wave of Growth for Next Gen Semiconductors: Global Market for Artificial Intelligence (In US$ Billion) for Years 2021, 2025, 2027
    • AI Hardware: A New & Robust Area of Opportunity for Semiconductor Companies
    • Rapidly Evolving AI Hardware Market to Boost Semiconductor Sales & Revenues, a Postive Growth Indicator for Semiconductor & IC Packaging Materials: Global AI Semiconductor Market (In US$ Billion) for Years 2020, 2023 & 2025
    • Automation Comes with Own Challenges
    • Renewed Focus on Industrial Automation as Technology Steps Forward to Help with Social Distancing: Industrial Semiconductors to Emerge Into a Key Growth Pocket
    • As a Lesson Learnt in Social Distancing from the COVID-19 Pandemic, Use of Industrial Robots to Spike in the Post COVID-19 Period: Industrial Robot Density (Units Per 10,000 Workers)
    • Global Market for Industrial Semiconductors (In US$ Billion) for Years 2020, 2022 & 2024
    • Looking Beyond Current Challenges, the Coming of Age of Autonomous Driving to Spur Growth across the Semiconductor Value Chain
    • 2020, A Bad Year for Automobile Sales
    • COVID-19 Triggers Massive, Unexpected & Unprecedented Erosion in Vehicle Sales: Decline in Global Auto Sales (In Million Units) in the Year 2020
    • Although Bad, 2020 is Not the Worst Year: The Pandemic Accelerates Autonomous Driving Technologies
    • COVID-19 Hits the Gas Pedal, Accelerating the Journey Towards Autonomous Driving. Joining This Exciting Journey Littered with Opportunities is Automotive Semiconductors: Global Autonomous Vehicle Sales (In Million)
    • Global Autonomous Vehicle Sales (In US$ Billion)
    • The Future of Modern Cars is Digital. Software & Electronics Gain Precedence
    • Measuring the Growing Importance of Electronics in Cars: Automotive Electronics as a Percentage of Vehicle Production Cost for the Years 2010, 2020 & 2030
    • Rapid Proliferation of Electronic & Electrical Subsystems and Sub-Assembles Powered by Electronification and Electrification Trends Drives the Commercial Value of Electronic Adhesives
    • Average Value of In-Vehicle Electronics Per Vehicle (In US$) for the Years 2018, 2025 & 2030
    • Chip Shortages to Continue, But Situation Set to Improve
    • A Review of the Aerospace Industry: Pandemic Impact & Recovery
    • Darkening Outlook for the Aerospace Industry Overshadows Semiconductor Demand in this Sector
    • Declines in Air Cargo Worsens an Already Punishing Business Climate
    • With the Aviation Industry on the Brink of Annihilation, Sluggish Aircraft Assembly Lines Means Aerospace Semiconductor Will Take Longer to Recover: Expected Revenue Losses in Global Aviation (In US$ Billion) for the Year 2020
    • Post COVID Recovery Will be Led by the New Era of Connected Aircraft
    • Robust Outlook for the Future of Connected Aviation to Open Up Opportunities to New Gen Semiconductor Solutions: Global Number of Connected Aircraft (In Units) for the Years 2016, 2018, 2021, 2025 & 2029
    • 3D Packaging Emerges As a Key Driver of Growth & Innovation in the Market
    • Emerging Applications for 3D ICs
    • New Packaging Technologies Crucial to Semiconductor Innovation
    • Fan-Out Packaging: A Buzzing Solution with Opportunities & Challenges
    • Panel-Level Fan-Out: A Buzzing Trend
    • Issues and Challenges
    • Pressing Challenges Daring the Semiconductor & Packaging Materials Industry
    • Old-Fashioned Supply Chain for Semiconductors & ICs Meets New Challenges
    • Recycling: Economically Unviable Endeavor
    • Material Availability Remains Key Concern
    • Collaboration Holds the Key
    • Robotics: A Solution to Deal with Several Challenges
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 2: World Historic Review for Semiconductor and IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 3: World 15-Year Perspective for Semiconductor and IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2021 & 2027
    • TABLE 4: World Recent Past, Current & Future Analysis for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 5: World Historic Review for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 6: World 15-Year Perspective for Organic Substrates by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 7: World Recent Past, Current & Future Analysis for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 8: World Historic Review for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 9: World 15-Year Perspective for Bonding Wires by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 10: World Recent Past, Current & Future Analysis for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 11: World Historic Review for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 12: World 15-Year Perspective for Lead frames by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 13: World Recent Past, Current & Future Analysis for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 14: World Historic Review for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 15: World 15-Year Perspective for Ceramic Packages by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 16: World Recent Past, Current & Future Analysis for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 17: World Historic Review for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 18: World 15-Year Perspective for Encapsulation Resins by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 19: World Recent Past, Current & Future Analysis for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 20: World Historic Review for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 21: World 15-Year Perspective for Other Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 22: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 23: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 24: World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 25: World Recent Past, Current & Future Analysis for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 26: World Historic Review for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 27: World 15-Year Perspective for Communications & Telecom by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 28: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 29: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 30: World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 31: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 32: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 33: World 15-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 34: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 35: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 36: World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027

III. MARKET ANALYSIS

  • UNITED STATES
    • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2022 (E)
    • TABLE 37: USA Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 38: USA Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 39: USA 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 40: USA Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 41: USA Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 42: USA 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • CANADA
    • TABLE 43: Canada Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 44: Canada Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 45: Canada 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 46: Canada Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 47: Canada Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 48: Canada 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • JAPAN
    • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2022 (E)
    • TABLE 49: Japan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 50: Japan Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 51: Japan 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 52: Japan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 53: Japan Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 54: Japan 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • CHINA
    • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2022 (E)
    • TABLE 55: China Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 56: China Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 57: China 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 58: China Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 59: China Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 60: China 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • EUROPE
    • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2022 (E)
    • TABLE 61: Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 62: Europe Historic Review for Semiconductor and IC Packaging Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 63: Europe 15-Year Perspective for Semiconductor and IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2021 & 2027
    • TABLE 64: Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 65: Europe Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 66: Europe 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 67: Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 68: Europe Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 69: Europe 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • FRANCE
    • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2022 (E)
    • TABLE 70: France Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 71: France Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 72: France 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 73: France Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 74: France Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 75: France 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • GERMANY
    • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2022 (E)
    • TABLE 76: Germany Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 77: Germany Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 78: Germany 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 79: Germany Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 80: Germany Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 81: Germany 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • ITALY
    • TABLE 82: Italy Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 83: Italy Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 84: Italy 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 85: Italy Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 86: Italy Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 87: Italy 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • UNITED KINGDOM
    • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2022 (E)
    • TABLE 88: UK Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 89: UK Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 90: UK 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 91: UK Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 92: UK Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 93: UK 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • REST OF EUROPE
    • TABLE 94: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 95: Rest of Europe Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 96: Rest of Europe 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 97: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 98: Rest of Europe Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 99: Rest of Europe 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • ASIA-PACIFIC
    • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2022 (E)
    • TABLE 100: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 101: Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 102: Asia-Pacific 15-Year Perspective for Semiconductor and IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2012, 2021 & 2027
    • TABLE 103: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 104: Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 105: Asia-Pacific 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 106: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 107: Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 108: Asia-Pacific 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • SOUTH KOREA
    • TABLE 109: South Korea Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 110: South Korea Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 111: South Korea 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 112: South Korea Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 113: South Korea Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 114: South Korea 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • TAIWAN
    • TABLE 115: Taiwan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 116: Taiwan Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 117: Taiwan 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 118: Taiwan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 119: Taiwan Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 120: Taiwan 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • REST OF ASIA-PACIFIC
    • TABLE 121: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 122: Rest of Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 123: Rest of Asia-Pacific 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 124: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 125: Rest of Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 126: Rest of Asia-Pacific 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • REST OF WORLD
    • TABLE 127: Rest of World Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 128: Rest of World Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 129: Rest of World 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
    • TABLE 130: Rest of World Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 131: Rest of World Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 132: Rest of World 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027

IV. COMPETITION

  • Total Companies Profiled: 106