表紙:フリップチップ技術の世界市場
市場調査レポート
商品コード
1199131

フリップチップ技術の世界市場

Flip Chip Technology

出版日: | 発行: Global Industry Analysts, Inc. | ページ情報: 英文 179 Pages | 納期: 即日から翌営業日

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フリップチップ技術の世界市場
出版日: 2023年01月01日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 179 Pages
納期: 即日から翌営業日
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  • 概要
  • 目次
概要

世界のフリップチップ技術の市場規模は、2022年に267億米ドルとなり、2022年~2030年の分析期間にかけて5%のCAGRで成長し、2030年までに396億米ドルとなると予想されています。

当レポートでは、世界のフリップチップ技術市場を調査し、市場の概要、市場の促進要因の分析、市場機会、地域別の市場分析、競合情勢、主要企業のプロファイルなど、体系的な情報を提供しています。

目次

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向と促進要因
  • 世界市場の見通し

第3章 市場分析

  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • その他の欧州
  • アジア太平洋地域
  • 世界のその他の地域

第4章 競合

目次
Product Code: MCP11997

What`s New for 2023?

»Special coverage on Russia-Ukraine war; global inflation; easing of "zero-Covid" policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.

»Global competitiveness and key competitor percentage market shares

» Market presence across multiple geographies - Strong/Active/Niche/Trivial

»Online interactive peer-to-peer collaborative bespoke updates

»Access to our digital archives and MarketGlass Research Platform

»Complimentary updates for one year

Looking Ahead to 2023

The global economy is at a critical crossroads with a number of interlocking challenges and crises running in parallel. The uncertainty around how Russia`s war on Ukraine will play out this year and the war`s role in creating global instability means that the trouble on the inflation front is not over yet. Food and fuel inflation will remain a persistent economic problem. Higher retail inflation will impact consumer confidence and spending. As governments combat inflation by raising interest rates, new job creation will slowdown and impact economic activity and growth. Lower capital expenditure is in the offing as companies go slow on investments, held back by inflation worries and weaker demand. With slower growth and high inflation, developed markets seem primed to enter into a recession. Fears of new COVID outbreaks and China's already uncertain post-pandemic path poses a real risk of the world experiencing more acute supply chain pain and manufacturing disruptions this year. Volatile financial markets, growing trade tensions, stricter regulatory environment and pressure to mainstream climate change into economic decisions will compound the complexity of challenges faced. Year 2023 is expected to be tough year for most markets, investors and consumers. Nevertheless, there is always opportunity for businesses and their leaders who can chart a path forward with resilience and adaptability.

Global Flip Chip Technology Market to Reach $39.6 Billion by 2030

In the changed post COVID-19 business landscape, the global market for Flip Chip Technology estimated at US$26.7 Billion in the year 2022, is projected to reach a revised size of US$39.6 Billion by 2030, growing at a CAGR of 5% over the analysis period 2022-2030. Copper Pillar, one of the segments analyzed in the report, is projected to record a 5.1% CAGR and reach US$20.5 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the Gold Bumping segment is readjusted to a revised 5.7% CAGR for the next 8-year period.

The U.S. Market is Estimated at $7.8 Billion, While China is Forecast to Grow at 4.7% CAGR

The Flip Chip Technology market in the U.S. is estimated at US$7.8 Billion in the year 2022. China, the world`s second largest economy, is forecast to reach a projected market size of US$7 Billion by the year 2030 trailing a CAGR of 4.7% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.5% and 4.1% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 3.8% CAGR.

Select Competitors (Total 12 Featured):

  • Amkor Technology, Inc.
  • ASE Group
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Powertech Technology, Inc.
  • Samsung Electronics Co., Ltd.
  • Siliconware Precision Industries Co., Ltd. (SPIL)
  • STATS ChipPAC Pte., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd.
  • United Microelectronics Corporation

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Flip Chip Technology - Global Key Competitors Percentage Market Share in 2022 (E)
    • Impact of Covid-19 and a Looming Global Recession
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Flip Chip Technology Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Flip Chip Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Flip Chip Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 4: World 16-Year Perspective for Flip Chip Technology by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2023 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Copper Pillar by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Copper Pillar by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 7: World 16-Year Perspective for Copper Pillar by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Gold Bumping by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 9: World Historic Review for Gold Bumping by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 10: World 16-Year Perspective for Gold Bumping by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Solder Bumping by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Solder Bumping by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 13: World 16-Year Perspective for Solder Bumping by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Other Bumping Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Other Bumping Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 16: World 16-Year Perspective for Other Bumping Technologies by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 19: World 16-Year Perspective for Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for IT & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 21: World Historic Review for IT & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 22: World 16-Year Perspective for IT & Telecom by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 24: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 25: World 16-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for Healthcare by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 27: World Historic Review for Healthcare by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 28: World 16-Year Perspective for Healthcare by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 29: World Recent Past, Current & Future Analysis for Automotive & Transport by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 30: World Historic Review for Automotive & Transport by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 31: World 16-Year Perspective for Automotive & Transport by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 33: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 34: World 16-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 35: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 36: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 37: World 16-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2023 (E)
    • TABLE 38: USA Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 39: USA Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 40: USA 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
    • TABLE 41: USA Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 42: USA Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 43: USA 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
  • CANADA
    • TABLE 44: Canada Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 45: Canada Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 46: Canada 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
    • TABLE 47: Canada Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 48: Canada Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 49: Canada 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
  • JAPAN
    • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2023 (E)
    • TABLE 50: Japan Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 51: Japan Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 52: Japan 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
    • TABLE 53: Japan Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 54: Japan Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 55: Japan 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
  • CHINA
    • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2023 (E)
    • TABLE 56: China Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 57: China Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 58: China 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
    • TABLE 59: China Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 60: China Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 61: China 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
  • EUROPE
    • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)
    • TABLE 62: Europe Recent Past, Current & Future Analysis for Flip Chip Technology by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 63: Europe Historic Review for Flip Chip Technology by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 64: Europe 16-Year Perspective for Flip Chip Technology by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2023 & 2030
    • TABLE 65: Europe Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 66: Europe Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 67: Europe 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
    • TABLE 68: Europe Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 69: Europe Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 70: Europe 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
  • FRANCE
    • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2023 (E)
    • TABLE 71: France Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 72: France Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 73: France 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
    • TABLE 74: France Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 75: France Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 76: France 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
  • GERMANY
    • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2023 (E)
    • TABLE 77: Germany Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 78: Germany Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 79: Germany 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
    • TABLE 80: Germany Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 81: Germany Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 82: Germany 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
  • ITALY
    • TABLE 83: Italy Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 84: Italy Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 85: Italy 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
    • TABLE 86: Italy Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 87: Italy Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 88: Italy 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
  • UNITED KINGDOM
    • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2023 (E)
    • TABLE 89: UK Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 90: UK Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 91: UK 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
    • TABLE 92: UK Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 93: UK Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 94: UK 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
  • REST OF EUROPE
    • TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 96: Rest of Europe Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 97: Rest of Europe 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
    • TABLE 98: Rest of Europe Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 99: Rest of Europe Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 100: Rest of Europe 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
  • ASIA-PACIFIC
    • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2023 (E)
    • TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 102: Asia-Pacific Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 103: Asia-Pacific 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
    • TABLE 104: Asia-Pacific Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 105: Asia-Pacific Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 106: Asia-Pacific 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
  • REST OF WORLD
    • TABLE 107: Rest of World Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 108: Rest of World Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 109: Rest of World 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
    • TABLE 110: Rest of World Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 111: Rest of World Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 112: Rest of World 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030

IV. COMPETITION