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市場調査レポート

半導体実装の世界市場

3D Semiconductor Packaging

発行 Global Industry Analysts, Inc. 商品コード 892588
出版日 ページ情報 英文 156 Pages
納期: 即日から翌営業日
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半導体実装の世界市場 3D Semiconductor Packaging
出版日: 2020年05月01日 ページ情報: 英文 156 Pages
概要

当レポートでは、半導体実装の世界市場に注目し、今後の期間を対象に取引規模の推移を地域および製品分野別に展望するほか、参入企業による競合状況、将来発展への動向と推進要因を分析しながら、各国市場状況についての調査データを示します。

第1章 調査方法

第2章 エグゼクティブサマリー

  • 市場概要
    • 参入企業の世界市場シェア
    • 半導体実装参入企業の世界市場シェア状況
    • 参入企業のセグメント別世界市場シェア
    • 3D PoP(パッケージオンパッケージ)参入企業の市場シェアランキング
    • 3Dワイヤボンド主要参入企業の市場シェア
    • 3Dファンアウト参入企業の収益シェア
    • 3D TSV(Si貫通電極)企業別市場シェア変化
  • 主要参入企業
  • 市場の動向と推進要因
  • 世界市場展望

第3章 市場分析

  • 地域別市場分析
  • 米国
  • カナダ
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • その他欧州
  • アジア太平洋州
  • その他の地域

第4章 競合企業

  • AMKOR TECHNOLOGY
  • EV GROUP
  • RUDOLPH TECHNOLOGIES, INC.
  • SEMES
  • SUSS MICROTEC AG
  • ULVAC

第5章 精選の調査手法

目次
Product Code: MCP10022

Amid the COVID-19 crisis and the looming economic recession, the 3D Semiconductor Packaging market worldwide will grow by a projected US$9.8 Billion, during the analysis period, driven by a revised compounded annual growth rate (CAGR) of 17.1%. 3D package-on-package, one of the segments analyzed and sized in this study, is forecast to grow at over 16.8% and reach a market size of US$2.7 Billion by the end of the analysis period. An unusual period in history, the coronavirus pandemic has unleashed a series of unprecedented events affecting every industry. The 3D package-on-package market will be reset to a new normal which going forwards in a post COVID-19 era will be continuously redefined and redesigned. Staying on top of trends and accurate analysis is paramount now more than ever to manage uncertainty, change and continuously adapt to new and evolving market conditions.

As part of the new emerging geographic scenario, the United States is forecast to readjust to a 16.1% CAGR. Within Europe, the region worst hit by the pandemic, Germany will add over US$333.5 Million to the region's size over the next 7 to 8 years. In addition, over US$409.5 Million worth of projected demand in the region will come from Rest of European markets. In Japan, the 3D package-on-package segment will reach a market size of US$232.3 Million by the close of the analysis period. Blamed for the pandemic, significant political and economic challenges confront China. Amid the growing push for decoupling and economic distancing, the changing relationship between China and the rest of the world will influence competition and opportunities in the 3D Semiconductor Packaging market. Against this backdrop and the changing geopolitical, business and consumer sentiments, the world's second largest economy will grow at 14.9% over the next couple of years and add approximately US$1.2 Billion in terms of addressable market opportunity. Continuous monitoring for emerging signs of a possible new world order post-COVID-19 crisis is a must for aspiring businesses and their astute leaders seeking to find success in the now changing 3D Semiconductor Packaging market landscape. All research viewpoints presented are based on validated engagements from influencers in the market, whose opinions supersede all other research methodologies.

Competitors identified in this market include, among others, Amkor Technology, Inc.; EV Group; Rudolph Technologies, Inc.; Semes Co., Ltd.; Suss MicroTec AG; Ulvac, Inc.

TABLE OF CONTENTS

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

  • Global Competitor Market Shares
  • 3D Semiconductor Packaging Competitor Market Share Scenario Worldwide (in %): 2019 & 2025
  • Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

  • TABLE 1: 3D Semiconductor Packaging Global Market Estimates and Forecasts in US$ Million by Region/Country: 2020-2027
  • TABLE 2: 3D Semiconductor Packaging Market Share Shift across Key Geographies Worldwide: 2020 VS 2027
  • TABLE 3: 3D package-on-package (Segment) World Market by Region/Country in US$ Million: 2020 to 2027
  • TABLE 4: 3D package-on-package (Segment) Market Share Breakdown of Worldwide Sales by Region/Country: 2020 VS 2027
  • TABLE 5: 3D wire-bonded (Segment) Potential Growth Markets Worldwide in US$ Million: 2020 to 2027
  • TABLE 6: 3D wire-bonded (Segment) Market Sales Breakdown by Region/Country in Percentage: 2020 VS 2027
  • TABLE 7: 3D Fan-out based (Segment) Geographic Market Spread Worldwide in US$ Million: 2020 to 2027
  • TABLE 8: 3D Fan-out based (Segment) Market Share Distribution in Percentage by Region/Country: 2020 VS 2027
  • TABLE 9: 3D through-silicon-via (Segment) World Market Estimates and Forecasts by Region/Country in US$ Million: 2020 to 2027
  • TABLE 10: 3D through-silicon-via (Segment) Market Share Breakdown by Region/Country: 2020 VS 2027
  • TABLE 11: Other Segments (Segment) World Market by Region/Country in US$ Million: 2020 to 2027
  • TABLE 12: Other Segments (Segment) Market Share Distribution in Percentage by Region/Country: 2020 VS 2027
  • TABLE 13: Industrial (End-Use) Sales Estimates and Forecasts in US$ Million by Region/Country for the Years 2020 through 2027
  • TABLE 14: Industrial (End-Use) Global Market Share Distribution by Region/Country for 2020 and 2027
  • TABLE 15: Electronics (End-Use) Global Opportunity Assessment in US$ Million by Region/Country: 2020-2027
  • TABLE 16: Electronics (End-Use) Percentage Share Breakdown of Global Sales by Region/Country: 2020 VS 2027
  • TABLE 17: Healthcare (End-Use) Worldwide Sales in US$ Million by Region/Country: 2020-2027
  • TABLE 18: Healthcare (End-Use) Market Share Shift across Key Geographies: 2020 VS 2027
  • TABLE 19: IT & telecommunication (End-Use) Global Market Estimates & Forecasts in US$ Million by Region/Country: 2020-2027
  • TABLE 20: IT & telecommunication (End-Use) Market Share Breakdown by Region/Country: 2020 VS 2027
  • TABLE 21: Automotive & transport (End-Use) Demand Potential Worldwide in US$ Million by Region/Country: 2020-2027
  • TABLE 22: Automotive & transport (End-Use) Share Breakdown Review by Region/Country: 2020 VS 2027
  • TABLE 23: Aerospace & Defense (End-Use) Worldwide Latent Demand Forecasts in US$ Million by Region/Country: 2020-2027
  • TABLE 24: Aerospace & Defense (End-Use) Distribution of Global Sales by Region/Country: 2020 VS 2027
  • TABLE 25: Other End-Uses (End-Use) Sales Estimates and Forecasts in US$ Million by Region/Country for the Years 2020 through 2027
  • TABLE 26: Other End-Uses (End-Use) Global Market Share Distribution by Region/Country for 2020 and 2027

III. MARKET ANALYSIS

  • GEOGRAPHIC MARKET ANALYSIS
  • UNITED STATES
    • Market Facts & Figures
    • US 3D Semiconductor Packaging Market Share (in %) by Company: 2019 & 2025
    • Market Analytics
    • TABLE 27: United States 3D Semiconductor Packaging Market Estimates and Projections in US$ Million by Segment: 2020 to 2027
    • TABLE 28: United States 3D Semiconductor Packaging Market Share Breakdown by Segment: 2020 VS 2027
    • TABLE 29: United States 3D Semiconductor Packaging Latent Demand Forecasts in US$ Million by End-Use: 2020 to 2027
    • TABLE 30: 3D Semiconductor Packaging Market Share Breakdown in the United States by End-Use: 2020 VS 2027
  • CANADA
    • TABLE 31: Canadian 3D Semiconductor Packaging Market Estimates and Forecasts in US$ Million by Segment: 2020 to 2027
    • TABLE 32: 3D Semiconductor Packaging Market in Canada: Percentage Share Breakdown of Sales by Segment for 2020 and 2027
    • TABLE 33: Canadian 3D Semiconductor Packaging Market Quantitative Demand Analysis in US$ Million by End-Use: 2020 to 2027
    • TABLE 34: Canadian 3D Semiconductor Packaging Market Share Analysis by End-Use: 2020 VS 2027
  • JAPAN
    • TABLE 35: Japanese Market for 3D Semiconductor Packaging: Annual Sales Estimates and Projections in US$ Million by Segment for the Period 2020-2027
    • TABLE 36: Japanese 3D Semiconductor Packaging Market Share Analysis by Segment: 2020 VS 2027
    • TABLE 37: Japanese Demand Estimates and Forecasts for 3D Semiconductor Packaging in US$ Million by End-Use: 2020 to 2027
    • TABLE 38: 3D Semiconductor Packaging Market Share Shift in Japan by End-Use: 2020 VS 2027
  • CHINA
    • TABLE 39: Chinese 3D Semiconductor Packaging Market Growth Prospects in US$ Million by Segment for the Period 2020-2027
    • TABLE 40: Chinese 3D Semiconductor Packaging Market by Segment: Percentage Breakdown of Sales for 2020 and 2027
    • TABLE 41: Chinese Demand for 3D Semiconductor Packaging in US$ Million by End-Use: 2020 to 2027
    • TABLE 42: Chinese 3D Semiconductor Packaging Market Share Breakdown by End-Use: 2020 VS 2027
  • EUROPE
    • Market Facts & Figures
    • European 3D Semiconductor Packaging Market: Competitor Market Share Scenario (in %) for 2019 & 2025
    • Market Analytics
    • TABLE 43: European 3D Semiconductor Packaging Market Demand Scenario in US$ Million by Region/Country: 2018-2025
    • TABLE 44: European 3D Semiconductor Packaging Market Share Shift by Region/Country: 2020 VS 2027
    • TABLE 45: European 3D Semiconductor Packaging Market Estimates and Forecasts in US$ Million by Segment: 2020-2027
    • TABLE 46: European 3D Semiconductor Packaging Market Share Breakdown by Segment: 2020 VS 2027
    • TABLE 47: European 3D Semiconductor Packaging Addressable Market Opportunity in US$ Million by End-Use: 2020-2027
    • TABLE 48: European 3D Semiconductor Packaging Market Share Analysis by End-Use: 2020 VS 2027
  • FRANCE
    • TABLE 49: 3D Semiconductor Packaging Market in France by Segment: Estimates and Projections in US$ Million for the Period 2020-2027
    • TABLE 50: French 3D Semiconductor Packaging Market Share Analysis by Segment: 2020 VS 2027
    • TABLE 51: 3D Semiconductor Packaging Quantitative Demand Analysis in France in US$ Million by End-Use: 2020-2027
    • TABLE 52: French 3D Semiconductor Packaging Market Share Analysis: A 7-Year Perspective by End-Use for 2020 and 2027
  • GERMANY
    • TABLE 53: 3D Semiconductor Packaging Market in Germany: Recent Past, Current and Future Analysis in US$ Million by Segment for the Period 2020-2027
    • TABLE 54: German 3D Semiconductor Packaging Market Share Breakdown by Segment: 2020 VS 2027
    • TABLE 55: 3D Semiconductor Packaging Market in Germany: Annual Sales Estimates and Forecasts in US$ Million by End-Use for the Period 2020-2027
    • TABLE 56: 3D Semiconductor Packaging Market Share Distribution in Germany by End-Use: 2020 VS 2027
  • ITALY
    • TABLE 57: Italian 3D Semiconductor Packaging Market Growth Prospects in US$ Million by Segment for the Period 2020-2027
    • TABLE 58: Italian 3D Semiconductor Packaging Market by Segment: Percentage Breakdown of Sales for 2020 and 2027
    • TABLE 59: Italian Demand for 3D Semiconductor Packaging in US$ Million by End-Use: 2020 to 2027
    • TABLE 60: Italian 3D Semiconductor Packaging Market Share Breakdown by End-Use: 2020 VS 2027
  • UNITED KINGDOM
    • TABLE 61: United Kingdom Market for 3D Semiconductor Packaging: Annual Sales Estimates and Projections in US$ Million by Segment for the Period 2020-2027
    • TABLE 62: United Kingdom 3D Semiconductor Packaging Market Share Analysis by Segment: 2020 VS 2027
    • TABLE 63: United Kingdom Demand Estimates and Forecasts for 3D Semiconductor Packaging in US$ Million by End-Use: 2020 to 2027
    • TABLE 64: 3D Semiconductor Packaging Market Share Shift in the United Kingdom by End-Use: 2020 VS 2027
  • REST OF EUROPE
    • TABLE 65: Rest of Europe 3D Semiconductor Packaging Market Estimates and Forecasts in US$ Million by Segment: 2020-2027
    • TABLE 66: Rest of Europe 3D Semiconductor Packaging Market Share Breakdown by Segment: 2020 VS 2027
    • TABLE 67: Rest of Europe 3D Semiconductor Packaging Addressable Market Opportunity in US$ Million by End-Use: 2020-2027
    • TABLE 68: Rest of Europe 3D Semiconductor Packaging Market Share Analysis by End-Use: 2020 VS 2027
  • ASIA-PACIFIC
    • TABLE 69: 3D Semiconductor Packaging Market in Asia-Pacific by Segment: Estimates and Projections in US$ Million for the Period 2020-2027
    • TABLE 70: Asia-Pacific 3D Semiconductor Packaging Market Share Analysis by Segment: 2020 VS 2027
    • TABLE 71: 3D Semiconductor Packaging Quantitative Demand Analysis in Asia-Pacific in US$ Million by End-Use: 2020-2027
    • TABLE 72: Asia-Pacific 3D Semiconductor Packaging Market Share Analysis: A 7-Year Perspective by End-Use for 2020 and 2027
  • REST OF WORLD
    • TABLE 73: Rest of World 3D Semiconductor Packaging Market Estimates and Forecasts in US$ Million by Segment: 2020 to 2027
    • TABLE 74: 3D Semiconductor Packaging Market in Rest of World: Percentage Share Breakdown of Sales by Segment for 2020 and 2027
    • TABLE 75: Rest of World 3D Semiconductor Packaging Market Quantitative Demand Analysis in US$ Million by End-Use: 2020 to 2027
    • TABLE 76: Rest of World 3D Semiconductor Packaging Market Share Analysis by End-Use: 2020 VS 2027

IV. COMPETITION

  • Total Companies Profiled: 44