表紙:フォトニック集積回路の世界市場
市場調査レポート
商品コード
352656

フォトニック集積回路の世界市場

Photonic Integrated Circuit (PIC)

出版日: | 発行: Global Industry Analysts, Inc. | ページ情報: 英文 290 Pages | 納期: 即日から翌営業日

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フォトニック集積回路の世界市場
出版日: 2022年01月01日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 290 Pages
納期: 即日から翌営業日
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  • 全表示
  • 概要
  • 目次
概要

フォトニック集積回路(PIC:光集積回路)市場は、今後22.3%の複合成長率で加速しながら、世界全体で24億ドルの伸びを見せる見通し。当調査分析・評価対象のひとつとしたハイブリッド集積回路も、21.9%を上回る成長性を秘めています。この成長を支える変動環境から、刻々と変化する市場への即応が業界内の事業者には必須です。2025年には取引額16億ドル規模への到達を見込むこのハイブリッド集積回路分野は、全体市場に対して健全に貢献し、好機運をもたらすことが期待されます。

当レポートでは、フォトニック集積回路の世界市場に注目し、今後2025年までの期間における取引規模の推移を展望するほか、参入企業による競合状況、将来発展への動向や推進要因を考察しながら、各国の市場状況に関する調査データを提供します。

第1章 イントロダクション、調査方法、対象範囲

第2章 エグゼクティブサマリー

  • 市場概要
    • イントロダクション - フォトニック集積回路(PIC)について
    • 製造に使用される材料
    • 集積モデル
    • 用途
    • フォトニック集積回路 - 市場の現況と将来展望
    • リン化インジウム
    • 優勢を保つシリコン基板
    • ハイブリッド集積 - 広く使用されるPIC製造法
    • 最速成長の製造法として台頭するモノリシック集積
    • 競合環境
    • フォトニック集積回路 - 専門化市場
    • 最新市場動向
  • 主要参入企業
  • 市場の動向と推進要因
    • 光通信 - PICの最大用途市場
    • 光通信領域でのPIC普及に影響する重要動向
    • ウルトラ100Gおよび100G OTN(Optical Transport Network:光伝達網)
    • FTTxネットワークの普及拡大
    • 光ファイバー網の前進とPICの需要拡大を促すブロードバンド需要の増大
    • IPトラフック増およびブロードバンド需要への影響ファクター覚書
    • インターネット契約者数の急増
    • 高水準にあるIP対応デバイス普及度
    • 速度を増すブロードバンド
    • プロードバンド特化アプリケーションの浸透
    • 遠隔通信への投資維持で好況が続くインフラ産業
    • 長距離ネットワーク
    • 大都市圏ネットワーク(MANs)
    • アクセスネットワーク
    • 最速成長利用分野として台頭する光信号処理
    • バイオフォトニクス - PICのニッチ市場
    • バイオフォトニクスの用途基盤拡大に並行して創出されるPICの商機
    • 体外診断医薬に対する注目度の高まりが吉兆に
    • 市場拡大に弾みを付ける光ファイバーセンサー産業のノースバウンド(上位レイヤー)志向
    • データセンターにおけるDCI(Display Control Interface)の役割拡大から生まれる有望商機
    • DCI実装に影響するデータセンターの主要動向
    • データセンタートラフィックの急増
    • クラウドデータセンター事業の急拡大
    • データセンタートラフィックの機器タイプ別内訳
    • データセンター統合への移行
    • 広がる仮想化の役割
    • 吉兆を示すWI-Fi機器設置ブーム
    • 今後数年の販売増を下支えするスマートシティコンセプト
    • スマートホームで加速するPIC需要
    • まもなく登場するカンタムコンピューティングモデルが新たな成長機会の発火点に
    • OEO(光・電・光)変換向け電子集積回路への収益性不安視から注目されるフォトニック集積回路
    • フォトニック集積回路 vs. 電子集積回路 - 簡単比較分析
    • フォトニック集積回路のイメージを高める部品点数の減少とファイバー結合の必要性緩和
    • 技術革新 - 高成長と安定需要のカギ
    • 速度、帯域幅、拡張性を強化する次世代シリコンフォトニクス/ポリマー系フォトニック集積回路
    • 斬新な製品の開発を育むコラボ事業
  • 世界市場展望

第3章 市場分析

  • 地域別市場分析
  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • スペイン
  • ロシア
  • その他欧州
  • アジア太平洋州
  • インド
  • 韓国
  • 台湾
  • その他アジア太平洋州
    • オーストラリア/ニュージーランド
    • シンガポール
    • 香港
  • 中南米
  • ブラジル
  • メキシコ

第4章 競合状況

  • 分析対象とした企業:36社(事業部門・子会社を含め 37社)
目次
Product Code: MCP-7068

Abstract:

Global Photonic Integrated Circuit (PIC) Market to Reach US$2.9 Billion by the Year 2026

Photonic Integrated Circuit (PIC), also referred to as integrated optical circuit or simply optical chip, is a semiconductor device that is designed to combine or integrate multiple optical elements on one single chip. The market is projected to register significant growth driven by the growing interest in the ability to exploit the properties of light to transmit information at speeds millions of times faster than either copper or laser, especially against the backdrop of the insatiable need for bandwidth and communication speeds. The growing opportunity in optical communications and improving investments post COVID-19, bodes well for the growth of PICs. While sustained high growth in the deployment and expansion of communication networks with fiber optic infrastructure is building strong momentum for PICs, increased use of fiber optics in signal transmission, sensing, and biophotonics is creating a highly conducive environment for growth and proliferation of PICs, on a wider scale. The dramatic growth in telecom and datacom verticals over the past 5-6 years driven by steep increase in the number of Internet users and ownership rates of IP-enabled devices, and subsequently growing investments on roll out of advanced communication networks such as 100G, 200G and 400G networks is infusing robust growth opportunities for PICs.

Amid the COVID-19 crisis, the global market for Photonic Integrated Circuit (PIC) estimated at US$870.2 Million in the year 2020, is projected to reach a revised size of US$2.9 Billion by 2026, growing at a CAGR of 21.7% over the analysis period. Hybrid Integration, one of the segments analyzed in the report, is projected to grow at a 20.2% CAGR to reach US$1.7 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the Monolithic Integration segment is readjusted to a revised 25.5% CAGR for the next 7-year period. This segment currently accounts for a 29.7% share of the global Photonic Integrated Circuit (PIC) market. Monolithic integration is steadily gathering steam as a major integration model for PIC assembly. Hybrid integration represents the most widely used integration model for PICs. The hybrid integration of PIC facilitates assembly of multiple mono-function optical devices into one common package. Monolithic integration typically allows consolidation of multiple devices as well as functions into one common Photonic material in a more convenient manner than packaging or hybrid integration.

The U.S. Market is Estimated at $386.7 Million in 2021, While China is Forecast to Reach $385.3 Million by 2026

The Photonic Integrated Circuit (PIC) market in the U.S. is estimated at US$386.7 Million in the year 2021. The country currently accounts for a 38% share in the global market. China, the world`s second largest economy, is forecast to reach an estimated market size of US$385.3 Million in the year 2026 trailing a CAGR of 34.5% through the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 16.2% and 18.7% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 18.4% CAGR while Rest of European market (as defined in the study) will reach US$522.7 Million by the end of the analysis period. Increased demand for integration in smart gadgets and favorable regulatory environment for expansion of medium and small size companies is expected to encourage growth in both Asia-Pacific and the US.

Module Integration Segment to Reach $415.7 Million by 2026

Module integration refers to integration of discrete devices and package into one common module. Module integration for PIC allows integration of different optical functions and materials, and also combining the PIC and electronic IC functions in a seamless manner. In the global Module Integration segment, USA, Canada, Japan, China and Europe will drive the 18.5% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$128.2 Million in the year 2020 will reach a projected size of US$397.4 Million by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$33.7 Million by the year 2026, while Latin America will expand at a 21.7% CAGR through the analysis period.

Select Competitors (Total 98 Featured) -

  • Broadcom Inc.
  • Ciena Corporation
  • Enablence Technologies, Inc.
  • Infinera Corporation
  • Intel Corporation
  • Lumentum Operations LLC
  • NeoPhotonics Corporation
  • Nokia Networks

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Impact of COVID-19 Pandemic and Looming Global Recession: 2020 Marked as a Year of Disruption & Transformation
    • As the Race between the Virus & Vaccines Intensifies, Where is the World Economy Headed in 2021?
    • EXHIBIT 1: World Economic Growth Projections (Real GDP, Annual % Change) for 2020 through 2022
    • Pandemic Impact on the Integrated Photonics Market
    • Biosensors Built around Photonic Integrated Circuits Present New Realms for Point-Of-Care Diagnostics
    • The Age of Optical Communication & Networking Throws the Focus on High Speed Photons as Data Carriers
    • EXHIBIT 2: Global Optical Communication & Networking Equipment Market (In US$ Billion) for Years 2020 to 2026E
    • An Introduction to Photonic Integrated Circuit (PIC)
    • Materials Used in Making PIC
    • Integration Models for PIC
    • Applications
    • Photonic Integrated Circuit (PIC): Current Market Scenario and Outlook
    • Substrate Materials and Fabrication Methods for PICs
    • Indium Phosphide: Largest & Fastest Growing Material Type
    • EXHIBIT 3: World Photonic Integrated Circuit (PIC) Market by Raw Material (2021 & 2027): Percentage Breakdown of Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si), and Other Raw Materials
    • Silicon Substrates Remain in Contention
    • Hybrid Integration: The Widely Used PIC Fabrication Method
    • EXHIBIT 4: World Photonic Integrated Circuit (PIC) Market by Technique (2021 & 2027): Percentage Breakdown of Revenues for Hybrid Integration, Monolithic Integration, and Module Integration
    • Monolithic Integration Emerges as Fastest Growing Fabrication Approach
    • Analysis by Application
    • EXHIBIT 5: World Photonic Integrated Circuit (PIC) Market by Application (2021 & 2027): Percentage Breakdown of Revenues for Optical Communications, Optical Signal Processing, and Other Applications
    • Competitive Scenario
    • EXHIBIT 6: Photonic Integrated Circuit (PIC) Competitor Market Share Scenario Worldwide (in %): 2020
    • Recent Market Activity
    • Select Global Brands
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Expanding Role of DCI in Data Centers Creates Potential Market Opportunities
    • Data Center Interconnect (DCI) Related Needs of Enterprises by Sector: A Snapshot
    • Major Data Center Trends Influencing DCI Implementations
    • Rapid Growth in Data Center Traffic
    • EXHIBIT 7: Global Data Center Traffic Scenario (2018, 2020 & 2022E): Percentage Breakdown of Data Center Traffic by Equipment Type
    • EXHIBIT 8: Global Cloud Data Center Market (2018 & 2022E): Percentage Breakdown of Data Center Traffic by Cloud Type
    • Big Data and Cloud Computing Proliferate Demand for Hyperscale Data Centers
    • EXHIBIT 9: Number of Hyperscale Data Centers Worldwide (in Units) for the Period 2015-2021E
    • PIC to Gain from Introduction of 5G
    • EXHIBIT 10: Breakdown of Network Latency (in Milliseconds) by Network Type
    • Programmable PICs Exude Tremendous Potential to Transform Photonics
    • Optical Communications: Largest Application Market for PIC
    • Key Trends Influencing the Uptake of PICs in Optical Communication Space
    • Soaring Deployments of 100G & Ultra-100G OTNs
    • Growing Uptake of FTTx Networks
    • Growing Bandwidth Needs Bring Fiber Optic Networks to the Fore, Steering PIC Demand
    • EXHIBIT 11: Global IP Traffic Volume in Exabytes for the Years 2019 and 2022E
    • EXHIBIT 12: Global IP Traffic Scenario (2020E): Percentage Breakdown of Data Usage by Consumer Segment
    • Optical Signal Processing Emerges as Fastest Growing Application Segment
    • Biophotonics: A Niche Market Segment for PIC
    • EXHIBIT 13: Global Biophotonics Market (2021E): Percentage Breakdown of Revenues by Geographic Region
    • Expanding Application Base for Biophotonics Generates Parallel Opportunities for PIC
    • Increased Focus on Optical In-Vitro Diagnostics Augurs Well
    • Biosensors Build on SiN Photonic Integrated Circuits
    • Northbound Trajectory in Fiber Optic Sensors Vertical Gives Impetus to Market Expansion
    • EXHIBIT 14: Global Fiber Optic Sensors Market (2019 & 2024E): Breakdown of Sales in US$ Million by Geographic Region
    • Smart Cities Concept to Underpin Sales Growth in the Coming Years
    • EXHIBIT 15: World Smart City Investments (in US$ Billion) for the Years 2018 through 2025E
    • EXHIBIT 16: Breakdown of World Smart City Investments (in %) by Country/Region for the Year 2021E
    • Smart Homes to Drive Demand for PICs
    • EXHIBIT 17: Global Smart Homes Market (In US$ Billion) for the Years 2019, 2021, 2023 & 2025E
    • Advanced Simulation Software for Designing PICs for Automotive Applications
    • Upcoming Quantum Computing Model to Infuse New Growth Opportunities
    • EXHIBIT 18: World Quantum Computing Market by End-Use (2021 & 2027E)
    • Economic Unviability of Electronic IC in OEO Conversion Puts Focus on Photonic IC
    • Photonic IC vs. Electronic IC: A Brief Comparative Analysis
    • Reduced Number of Optical Packages & Decreased Need for Fiber Coupling Enhance the Image of PIC
    • Technology Innovations: Key to High Growth and Consistent Demand
    • A Monolithic InP-on-Si-on-Insulator Developed by a HKUST Team of Engineers.
    • Optoscribe Begins Sampling its New PIC Coupling Solution, OptoCplrLT
    • A University of Rochester Team Creates Miniature Modulators for High Potential PICs
    • Purdue University Research Team Develops an Electrically Driven, Magnetic-Free Linear Optical Isolator for PIC Production
    • Horizon 2020 Project INSPIRE, Aims to Combine Beneficial Properties of Two Mature Photonic Integration Platforms
    • Next Generation Silicon Photonics & Polymer Based Photonic ICs Enhance Speed, Bandwidth and Scalability
    • Collaborative Initiatives Foster Development of Innovative Products
    • Challenges with PIC Production
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Current & Future Analysis for Photonic Integrated Circuit (PIC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 2: World 7-Year Perspective for Photonic Integrated Circuit (PIC) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets for Years 2021 & 2027
    • TABLE 3: World Current & Future Analysis for Hybrid Integration by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 4: World 7-Year Perspective for Hybrid Integration by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2021 & 2027
    • TABLE 5: World Current & Future Analysis for Monolithic Integration by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 6: World 7-Year Perspective for Monolithic Integration by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2021 & 2027
    • TABLE 7: World Current & Future Analysis for Module Integration by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 8: World 7-Year Perspective for Module Integration by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2021 & 2027
    • TABLE 9: World Current & Future Analysis for Indium Phosphide (InP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 10: World 7-Year Perspective for Indium Phosphide (InP) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2021 & 2027
    • TABLE 11: World Current & Future Analysis for Silicon-on-Insulator (SOI) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 12: World 7-Year Perspective for Silicon-on-Insulator (SOI) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2021 & 2027
    • TABLE 13: World Current & Future Analysis for Gallium Arsenide (GaAs) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 14: World 7-Year Perspective for Gallium Arsenide (GaAs) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2021 & 2027
    • TABLE 15: World Current & Future Analysis for Silicon (Si) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 16: World 7-Year Perspective for Silicon (Si) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2021 & 2027
    • TABLE 17: World Current & Future Analysis for Other Raw Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 18: World 7-Year Perspective for Other Raw Materials by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2021 & 2027
    • TABLE 19: World Current & Future Analysis for Optical Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 20: World 7-Year Perspective for Optical Communications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2021 & 2027
    • TABLE 21: World Current & Future Analysis for Optical Signal Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 22: World 7-Year Perspective for Optical Signal Processing by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2021 & 2027
    • TABLE 23: World Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 24: World 7-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2021 & 2027

III. MARKET ANALYSIS

  • UNITED STATES
    • The United States: Largest Market for PIC Solutions
    • Fiber Optic Deployments Register Steady Growth
    • EXHIBIT 19: Percentage Population (%) Covered by Fiber Networks in Select States
    • Novel Use Case of Biophotonics in Medical Devices Augurs Well
    • Mainstream Image of Fiber Optic Sensors to Underpin Market Expansion
    • Market Analytics
    • TABLE 25: USA Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 26: USA 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 27: USA Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 28: USA 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 29: USA Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 30: USA 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • CANADA
    • Market Overview
    • Growing Use of Fiber Optic Sensors Revs Up PIC Demand
    • Market Analytics
    • TABLE 31: Canada Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 32: Canada 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 33: Canada Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 34: Canada 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 35: Canada Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 36: Canada 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • JAPAN
    • Market Overview
    • Market Analytics
    • TABLE 37: Japan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 38: Japan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 39: Japan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 40: Japan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 41: Japan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 42: Japan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • CHINA
    • Market Overview
    • Increased Adoption of Fiber Optic Sensors Infuses Market Momentum
    • Sensors Manufacturing Scenario in China
    • Market Analytics
    • TABLE 43: China Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 44: China 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 45: China Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 46: China 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 47: China Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 48: China 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • EUROPE
    • Market Overview
    • Healthy Home Entertainment Sector Spurs Demand for Fiber Optic Networks
    • EXHIBIT 20: Household Penetration of FTTH & FTTB (in %) in Select European Countries: 2020
    • Market Analytics
    • TABLE 49: Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 50: Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2021 & 2027
    • TABLE 51: Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 52: Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 53: Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 54: Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 55: Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 56: Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • FRANCE
    • TABLE 57: France Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 58: France 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 59: France Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 60: France 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 61: France Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 62: France 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • GERMANY
    • TABLE 63: Germany Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 64: Germany 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 65: Germany Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 66: Germany 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 67: Germany Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 68: Germany 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • ITALY
    • TABLE 69: Italy Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 70: Italy 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 71: Italy Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 72: Italy 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 73: Italy Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 74: Italy 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • UNITED KINGDOM
    • TABLE 75: UK Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 76: UK 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 77: UK Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 78: UK 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 79: UK Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 80: UK 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • SPAIN
    • TABLE 81: Spain Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 82: Spain 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 83: Spain Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 84: Spain 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 85: Spain Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 86: Spain 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • RUSSIA
    • TABLE 87: Russia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 88: Russia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 89: Russia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 90: Russia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 91: Russia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 92: Russia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • REST OF EUROPE
    • TABLE 93: Rest of Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 94: Rest of Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 95: Rest of Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 96: Rest of Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 97: Rest of Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 98: Rest of Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • ASIA-PACIFIC
    • TABLE 99: Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Geographic Region - India, South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 100: Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Geographic Region - Percentage Breakdown of Value Revenues for India, South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2021 & 2027
    • TABLE 101: Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 102: Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 103: Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 104: Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 105: Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 106: Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • INDIA
    • TABLE 107: India Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 108: India 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 109: India Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 110: India 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 111: India Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 112: India 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • SOUTH KOREA
    • TABLE 113: South Korea Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 114: South Korea 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 115: South Korea Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 116: South Korea 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 117: South Korea Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 118: South Korea 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • TAIWAN
    • TABLE 119: Taiwan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 120: Taiwan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 121: Taiwan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 122: Taiwan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 123: Taiwan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 124: Taiwan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • REST OF ASIA-PACIFIC
    • TABLE 125: Rest of Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 126: Rest of Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 127: Rest of Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 128: Rest of Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 129: Rest of Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 130: Rest of Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • LATIN AMERICA
    • TABLE 131: Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Geographic Region - Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 132: Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Geographic Region - Percentage Breakdown of Value Revenues for Brazil, Mexico and Rest of Latin America Markets for Years 2021 & 2027
    • TABLE 133: Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 134: Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 135: Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 136: Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 137: Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 138: Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • BRAZIL
    • Market Overview
    • Market Analytics
    • TABLE 139: Brazil Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 140: Brazil 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 141: Brazil Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 142: Brazil 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 143: Brazil Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 144: Brazil 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • MEXICO
    • Market Overview
    • Market Analytics
    • TABLE 145: Mexico Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 146: Mexico 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 147: Mexico Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 148: Mexico 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 149: Mexico Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 150: Mexico 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • REST OF LATIN AMERICA
    • TABLE 151: Rest of Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 152: Rest of Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 153: Rest of Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 154: Rest of Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 155: Rest of Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 156: Rest of Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027
  • REST OF WORLD
    • TABLE 157: Rest of World Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 158: Rest of World 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Revenues for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2021 & 2027
    • TABLE 159: Rest of World Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 160: Rest of World 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Revenues for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2021 & 2027
    • TABLE 161: Rest of World Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 162: Rest of World 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Revenues for Optical Communications, Optical Signal Processing and Other Applications for the Years 2021 & 2027

IV. COMPETITION

  • Total Companies Profiled: 84