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市場調査レポート

3Dチップ(3D IC)の世界市場

3D Chips (3D IC)

発行 Global Industry Analysts, Inc. 商品コード 138797
出版日 ページ情報 英文 300 Pages
納期: 即日から翌営業日
価格
こちらの商品の販売は終了いたしました。
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3Dチップ(3D IC)の世界市場 3D Chips (3D IC)
出版日: 2010年10月01日 ページ情報: 英文 300 Pages

当商品の販売は、2016年07月01日を持ちまして終了しました。

概要

当レポートでは、世界のる3Dチップ(3D IC)市場の現況と将来の動向を調査・分析しており、競合企業のプロファイルとともに、概略以下の構成でお届けします。

第1章 イントロダクション、調査手法、製品の定義

第2章 エグゼクティブサマリー

  • 市場見通し
    • 半導体産業の概要
    • 3Dチップ:市場および技術の動向
  • 製品概要
    • 半導体
    • 3D IC:イントロダクション
    • 3Dパッケージングと3D IC
    • 3D ICの利点
    • 3D ICの製造技術
    • 技術課題
  • 製品導入・発売
  • 近年の業界動向
  • 主要企業
    • Amkor Technology
    • GlobalFoundries, Inc.
    • Hynix Semiconductor, Inc.
    • International Business Machines Corporation
    • Intel Corporation
    • Micron Technology, Inc.
    • ルネサス エレクトロニクス
    • Samsung Electronics Co., Ltd.
    • ソニー
    • Tezzaron Semiconductor Corporation
    • 東芝 セミコンダクター社
    • Ziptronix, Inc.
  • 世界市場の見通し

第3章 競合情勢

  • 企業プロファイル
目次
Product Code: MCP-6575

Abstract

This report analyzes the Global market for 3D Chips (3D IC) in US$ Million. Annual estimates and forecasts are provided for the period 2006 through 2015. The report profiles 38 companies including many key and niche players such as Amkor Technology, GlobalFoundries, Inc., Hynix Semiconductor, Inc., International Business Machines Corporation, Intel Corporation, Micron Technology, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., Sony Corporation, Tezzaron Semiconductor Corporation, Toshiba Semiconductors, and Ziptronix, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

Table of Contents

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

  • Study Reliability and Reporting Limitations
  • Disclaimers
  • Data Interpretation & Reporting Level
    • Quantitative Techniques & Analytics
  • Product Definitions and Scope of Study

II. EXECUTIVE SUMMARY

1. MARKET OUTLOOK

  • Semiconductor Industry: An Overview
    • Chip-Making Industry Reels Under the Economic Pressure
  • 3D Chips: Market & Technology Overview
    • A Quick Primer
      • Transition from 2D Configuration to 3D IC
      • Appeal of 3D Chip Soars Among End-Use Sectors
      • Rationale Behind the Growing Popularity of 3D IC
      • TSV Technology - Ensuring Success of 3D-IC Integration
      • 3D TSV: Technological Trends and Issues
    • Market Adoption of 3D IC Technology: Challenges

2. PRODUCT OVERVIEW

  • Semiconductor
    • Discrete Devices
    • Integrated Circuits (ICs)
      • Analog ICs
      • Digital ICs
  • 3D IC (Three-Dimensional Integrated Circuit) - An Introduction
  • 3D Packaging Vs 3D Ics
  • Benefits of 3D IC
  • Manufacturing Technologies for 3D IC
  • Technological Challenges
    • Manufacturing Costs
    • Yield
    • Heat
    • Complexity of Design
    • Lack of Clearly Defined Standards
    • Lack of Relevance Post Insertion
    • Supply Delay

3. PRODUCT INTRODUCTIONS/LAUNCHES

  • TierLogic Announces the Launch of 3D FPGA
  • Movidius Rolls Out 3D Chip for Smartphones
  • STMicroelectronics Unveils 3D IC Chip for Digital TV Applications
  • Applied Materials Launches Avila™ Technology
  • STMicroelectronics Launches 3D IC for Enhanced Audio in Portable Media Players
  • BeSang Unleashes 3D IC Technology to Enable Low Cost Solutions
  • Sound Design Technologies Rolls Out New 3D Chip Stacking Technology
  • Toshiba to Develop 3D NAND Flash Chip
  • NEC Develops New 3D Chip Stacked Flexible Memory for SoC
  • IMEC Introduces 3D SIC Technology
  • Aviza Technology Launches Versalis fxP

4. RECENT INDUSTRY ACTIVITY

  • CEA-Leti, SPTS Ally Over Next-Gen TSV Development
  • EVG, IME Collaborate for 3D-IC Integration Technologies
  • CMC, CMP, MOSIS Ally for 3D-IC Process
  • Elpida Collaborate with PTI, UMC for 3D-IC Integration Development
  • Leti, R3Logic Partner for 3D-IC Methodologies and Designs
  • NEC Electronics Merges with Renesas Technology
  • Advanced Technology Investment Company Acquires Chartered Semiconductor Manufacturing
  • ON Semiconductor Acquires Sound Design Technologies
  • SPP Acquires Key Assets of Aviza Technology
  • IBM Partners with ETH and EPFL to Co-Develop Eco-Friendly 3D Microchips
  • S.E.T and IMEC Collaborate to Develop Processes for 3D Integration
  • Industrial Technology Research Institute Collaborates with Applied Materials
  • EV Group and Applied Materials Collaborate to Develop Wafer Bonding Process for 3D IC
  • Soitec Collaborates with CEA-Leti for 3D Integration
  • Apple Acquires Stake in Imagination Technologies
  • Applied Materials Acquires Semitool
  • KLA- Tencor Acquires Stake in ICOS Vision Systems
  • Zoran Corporation Takes Over Let It Wave
  • SanDisk Enters into Collaboration with Toshiba for Rewriteable 3D Chip Development
  • BeSang Collaborates with National NanoFab Centre and Stanford NanoFab to Develop 3D IC
  • Singapore forms Novel Consortium to Boost 3D Adoption
  • DDD and Samsung Collaborate for Development of 3D Chips

5. FOCUS ON SELECT PLAYERS

  • Amkor Technology (US)
  • GlobalFoundries, Inc. (US)
  • Hynix Semiconductor, Inc. (South Korea)
  • International Business Machines Corporation (US)
  • Intel Corporation (US)
  • Micron Technology, Inc. (US)
  • Renesas Electronics Corporation (Japan)
  • Samsung Electronics Co., Ltd. (South Korea)
  • Sony Corporation (Japan)
  • Tezzaron Semiconductor Corporation (US)
  • Toshiba Semiconductors (Japan)
  • Ziptronix, Inc. (US)

6. GLOBAL MARKET PERSPECTIVE

  • Table 1: World Recent Past, Current & Future Analysis for 3D Chips (3D IC) Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)

III. COMPETITIVE LANDSCAPE

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