市場調査レポート

ICソケットの世界市場

IC Sockets

発行 Global Industry Analysts, Inc. 商品コード 134321
出版日 ページ情報 英文 191 Pages
納期: 即日から翌営業日
価格
こちらの商品の販売は終了いたしました。
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ICソケットの世界市場 IC Sockets
出版日: 2010年08月01日 ページ情報: 英文 191 Pages

当商品の販売は、2016年07月01日を持ちまして終了しました。

概要

当レポートでは、ICソケットを対象に、その技術開発や用途、製品分類などを整理しながら、世界市場の現況と将来動向を分析・予測する最新調査データを、概略以下の構成でお届けします。

第1章 イントロダクション、方法論、製品の定義

第2章 エグゼクティブサマリー

  • 産業概要
    • 序論
    • 世界展望
      • 地域別分析
      • 製品セグメント別分析
    • 不況が与えたICソケット市場への影響
    • 変化する市場動態
    • 進化するICソケット市場
      • 進化する生産用ICソケットセグメント
      • 新たな開発に向き合う試験・通電確認用ICソケット
      • 電子機器製造受託サービス(EMS)の発展を見るICソケット業界
      • コネクター製造業
  • 製品概要
    • イントロダクション
    • ICソケット
      • 性能スペック
      • ICソケットの構成部品
      • ICソケットで使用される接点設計
      • ICソケットの種類
      • ICソケットの利点
      • ICソケットの欠点
      • ICソケットの末端用途
      • ICソケットに関連するサービスおよび製品
  • 製品発売・技術革新
  • 近年の業界動向
  • 世界の主要参入企業
  • 世界市場見通し

第3章 市場

  • 北米
  • 日本
  • 欧州
  • アジア太平洋州
  • その他の地域

第4章 競合環境

目次
Product Code: MCP-6376

Abstract

This report analyzes the Global market for IC Sockets in US$ Million by the following product segments: Dual In-Line Memory Module Sockets, Production Sockets, Test/Burn-in Sockets, and Others. Regional IC Sockets markets are analyzed as a consolidated whole with no granular level breakup offered by product group/segment. Annual estimates and forecasts are provided for the period 2006 through 2015. The report profiles 44 companies including many key and niche players such as 3M Company, Aries Electronics, Inc., Chupond Precision Co., Ltd., Enplas Corporation, FCI, Foxconn Technology Group, Johnstech International Corporation, Loranger International Corporation, Mill-Max Mfg. Corporation, Molex, Inc., Plastronics Socket Company, Inc., Sensata Technologies B.V., Tyco Electronics Ltd., Win Way Technology Co., Ltd., and Yamaichi Electronics Co., Ltd. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

Table of Contents

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

  • Study Reliability and Reporting Limitations
  • Disclaimers
  • Data Interpretation & Reporting Level
  • Quantitative Techniques & Analytics
  • Product Definitions and Scope of Study
  • IC Sockets
    • 1. Dual In-Line Memory Module (DIMM) Sockets
    • 2. Production Sockets
    • 3. Test/Burn-in Sockets
    • 4. Other Sockets

II. EXECUTIVE SUMMARY

1. INDUSTRY OVERVIEW

  • Preface
  • Global Outlook
  • Analysis by Region
  • Analysis by Product Segment
  • Impact of Recession on IC Sockets Market
  • Changing Market Dynamics
  • Evolving IC Sockets Market
  • Evolving Production IC Sockets Segment
  • Test and Burn-In Sockets Segment to Witness New Developments
  • IC Socket Industry Witnesses Growth of EMS Companies
  • Connector Industry

2. PRODUCT OVERVIEW

  • Introduction
  • IC Sockets
  • Performance Specifications
  • Components of IC Socket
  • Contact Designs Used in IC Sockets
  • Types of IC Sockets
  • Dual In-Line Memory Module (DIMM) Sockets
  • Production Sockets
  • Plastic Leaded Chip Carrier (PLCC) Socket
  • Pin Grid Array (PGA) Socket
  • Land Grid Array (LGA) Socket
  • Test/Burn-in Sockets
  • Other Sockets
  • Dual In-Line Package (DIP) Socket
  • Ball Grid Array (BGA) Socket
  • Specialty Socket
  • Interposer
  • Advantages of IC Sockets
  • Cost Savings
  • Component Repair and Replacement
  • Avoidance of Direct Soldering
  • Flexibility in Assembly, IC Design, and Supply-Chain Management
  • Component Exchange and Upgrade
  • Component Burn-in and Test
  • Disadvantages of IC Sockets
  • End-Use Applications of IC Sockets
  • Services and Products Associated with IC Sockets
  • IC Sockets and Interconnect Components
  • IC Package Converters and Adapters
  • PCB Pins and Receptacles
  • IC Pin Probes

3. PRODUCT INTRODUCTIONS/INNOVATIONS

  • Ironwood Electronics Launches a Range of New BGA Sockets
  • Ironwood Electronics Introduces New QFN Socket
  • Ironwood Electronics Launches High Performance BGA Socket
  • Aries Electronics Expands CSP/µBGA Test/Burn- in Sockets Range
  • Plastronics Launches ES Socket System
  • Thermaltake Unveils New CPU Cooler with Multiple Sockets
  • Fujitsu Launches SMT DDR2 DIMM Socket
  • Emulation Unveils Novel Socket System
  • MIPS Technologies Unveils Novel Instruction Set and Cores
  • Aries Electronics Launches CSP/BallNest Hybrid Socket
  • MiniATE Systems Introduces ET 2300 Socket System
  • Sullins Connector Solutions Extends Insulation Displacement Connector Portfolio
  • Fujitsu Asia Introduces PRIMERGY Dual Socket S5 Series
  • Intel Launches Nehalem Based Processors and LGA Sockets
  • Quadrant Rolls Out Semitron® MDS 100
  • Atmel Introduces New Expansion, Routing and Socket Cards
  • Tyco Electronics Introduces New Range of RFI Filter Connectors

4. RECENT INDUSTRY ACTIVITY

  • Molex Sockets Earn Intel® Validation
  • Semiconductor Test Group Merges with Multitest elektronische Systeme and Harbor Electronics
  • KLA Tencor Acquires ICOS Vision Systems

5. FOCUS ON SELECT GLOBAL PLAYERS

  • 3M Company (US)
  • Aries Electronics, Inc. (US)
  • Chupond Precision Co., Ltd. (Taiwan)
  • Enplas Corporation (Japan)
  • FCI (France)
  • Foxconn Technology Group (Taiwan)
  • Johnstech International Corporation (US)
  • Loranger International Corporation (US)
  • Mill-Max Mfg. Corporation (US)
  • Molex, Inc. (US)
  • Plastronics Socket Company, Inc. (US)
  • Sensata Technologies B.V. (The Netherlands)
  • Tyco Electronics Ltd. (Switzerland)
  • Win Way Technology Co., Ltd. (Taiwan)
  • Yamaichi Electronics Co., Ltd. (Japan)

6. GLOBAL MARKET PERSPECTIVE

  • Table 1: World Recent Past, Current and Future Analysis for IC Sockets by Geographic Region - North America, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
  • Table 2: World 10-Year Perspective for IC Sockets by Geographic Region - Percentage Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World Markets for Years 2006, 2009 and 2015 (includes corresponding Graph/Chart)
  • Table 3: World Recent Past, Current & Future Analysis for IC Sockets by Product Segment - Dual In-Line Memory Module Sockets, Production Sockets, Test/Burn-in Sockets, and Other IC Socket Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
  • Table 4: World 10-Year Perspective for IC Sockets by Product Segment - Percentage Breakdown of Dollar Sales for Dual In-Line Memory Module Sockets, Production Sockets, Test/Burn-in Sockets, and Other IC Socket Markets for Years 2006, 2009 & 2015 (includes corresponding Graph/Chart)

III. MARKET

1. NORTH AMERICA

  • A. Market Analysis
    • Current and Future Analysis
    • Impact of Recession on IC Sockets Market
    • Product Launches/Developments
    • Strategic Corporate Developments
    • Select US Players
  • B. Market Analytics
    • Table 5: North American Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)

2. JAPAN

  • A. Market Analysis
    • Current and Future Analysis
    • Select Players
  • B. Market Analytics
    • Table 6: Japanese Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)

3. EUROPE

  • A. Market Analysis
    • Current and Future Analysis
    • Product Launch
    • Strategic Corporate Development
    • Select Players
  • B. Market Analytics
    • Table 7: European Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)

4. ASIA-PACIFIC

  • A. Market Analysis
    • Current and Future Analysis
    • Product Launches/Developments
    • Select Players
  • B. Market Analytics
    • Table 8: Asia-Pacific Recent Past, Current and Future Analysis for IC Sockets by Geographic Region - China and Rest of Asia-Pacific Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)
    • Table 9: Asia-Pacific 10-Year Perspective for IC Sockets by Geographic Region - Percentage Breakdown of Dollar Sales for China and Rest of Asia-Pacific Markets for Years 2006, 2009 and 2015

5. REST OF WORLD

  • Market Analysis
  • Table 10: Rest of World Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)

IV. COMPETITIVE LANDSCAPE

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