表紙:熱伝導性接着剤:技術影響分析
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921037

熱伝導性接着剤:技術影響分析

Thermoconductive Adhesives--Technology Impact Analysis

出版日: | 発行: Frost & Sullivan | ページ情報: 英文 42 Pages | 納期: 即日から翌営業日

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熱伝導性接着剤:技術影響分析
出版日: 2019年12月26日
発行: Frost & Sullivan
ページ情報: 英文 42 Pages
納期: 即日から翌営業日
  • 全表示
  • 概要
  • 目次
概要

電子部品の接合は、はんだ付けやワイヤーボンディングなどの手法が従来より用いられていますが、現在は熱伝導性接着剤が費用対効果が高く環境に優しい代替手段として有望視されています。

当レポートでは、熱伝導性接着剤の技術動向と各種産業への影響を調査し、技術・製品の種類と概要、技術開発の焦点、主要産業における需要、需要への影響因子の分析、導入拡大の見通しなどをまとめています。

第1章 エグゼクティブサマリー

  • 調査範囲
  • 調査手法
  • 主要調査結果

第2章 技術概要・動向

  • 熱伝導性接着剤:機能性向上による受容度の拡大
  • 高い熱抵抗性能を持つ材料へのニーズ:熱伝導性接着剤の導入を推進
  • 熱伝導性接着剤の製造プロセス
  • ポリマー接着剤:硬質・軟質用途とも理想的
  • 銀フィラー:ヒートシンクのフィラー材料として理想的
  • グラフェンフィラー:重要性を増す
  • セラミックフィラー:航空宇宙用途に
  • アジア太平洋:広範な用途に向けた製品開発に携わる

第3章 イノベーションエコシステム

  • R&Dの中心:伝熱性能の向上
  • 世界のIP申請動向:特にアジア太平洋地域で件数拡大
  • 電子回路:主要用途
  • ポリマー複合材料の金属フィラー:もっとも広く導入されている製造法
  • 学術部門:基礎研究・応用研究に積極的
  • 熱伝導性接着剤の開発への資金投入:エンド製品開発に焦点

第4章 各種用途

  • エレクトロニクス部門からの需要がもっとも高い
  • エレクトロニクス部門での導入拡大の要因:コンポーネントの小型化に貢献
  • 航空宇宙・防衛部門:熱伝導性接着剤をもっとも早い時期に導入
  • 自動車部門:EV・HEV向け需要の増大により、導入率拡大の見通し
  • エネルギー貯蔵部門における導入:高性能電池への焦点拡大から増加の見通し
  • 照明部門:熱伝導性接着剤の効率向上から成長の見通し
  • ヘルスケア部門:生体不活性性から導入が進む見通し

第5章 技術の影響

  • ベンチマーキングルーブリック
  • エレクトロニクス部門:幅広い導入の可能性を示す
  • IPポートフォリオ・ニーズ充足能力:導入拡大の重要な鍵

第6章 コンタクト情報

第7章 付録

目次
Product Code: D8E8

Thermally Conductive Adhesives Expected to Have a High Impact in the Electronics Industry

With the increasing importance of integrated circuits, the need to self-contained units in the electrical and electronic systems are observed to be significant. The electronic components were conventionally connected by soldering or by wire bonding techniques. Thermally conductive adhesives proves to be a promising alternative for these conventional methods as a cost effective and environment-friendly alternative (as most conventional soldering techniques contain lead).

This research service titled, “Thermoconductive Adhesives- Technology Impact Analysis,” provides an understanding of various types of thermally conductive adhesives/ thermoconductive Adhesives, including epoxy, polyurethane, polyimide, and silicon-based adhesive resins along with metal, carbon, and ceramic-based fillers.

This research service describes the technology capabilities, manufacturing processes, and future prospects of thermally conductive adhesives. Additionally, it also captures the various factors that influence adoption and the application prospects in various industries. This research service also highlights the emerging innovations that will enable the use of these adhesives to meet the requirements of various applications.

Table of Contents

1.0. Executive Summary

  • 1.1. Research Scope
  • 1.2. Research Methodology
  • 1.3. Key Findings

2.0. Technology Snapshot and Trends

  • 2.1. Thermally Conductive Adhesives Gaining Acceptance Due to Enhanced Functionality
  • 2.2. Need for Materials with Higher Thermal Resistance Propels the Adoption of Thermoconductive Adhesives
  • 2.3. Manufacturing Processes of Thermally Conductive Adhesives
  • 2.4. Polymer-based Adhesives are Highly Desirable due to its Ability to Cater to Both Rigid and Flexible Applications
  • 2.5. Silver Metal-based Fillers are the most Desirable Filler Material for Heat Sinks
  • 2.6. Graphene-based Fillers are Gaining Importance
  • 2.7. Ceramic Fillers Targeted for Use in Aerospace Applications
  • 2.8. APAC Region is Involved in Development of Thermally Conductive Adhesives that can Cater to a Broad Spectrum of Applications

3.0. Innovation Ecosystem

  • 3.1. R&D Activity is Predominantly Focused on Enhancing the Heat Transfer Properties
  • 3.2. Global IP filling Trend is Experiencing an Upward Trend due to Significant Number of Patent Filling from Asia-Pacific
  • 3.3. Electronic Circuits Observed to be a Key Application Area for Thermally Conductive Adhesives
  • 3.4. Metal Fillers in Polymer Composites is the Most Widely adopted Method for Manufacturing Thermally Conductive Adhesives
  • 3.5. Academia Active in Basic and Applied Research
  • 3.6. Funding for Thermally Conductive Adhesive Development is Directed Towards End Product Development

4.0. Application Landscape

  • 4.1. Demand from Electronics Sector is the Highest for Thermally Conductive Adhesives
  • 4.2. Electronics Sector Expected to have High Adoption due to the Adhesives' Ability to Help in Miniaturization of Components
  • 4.3. Aerospace and Defense Sector is one of the Earliest Sectors to Adopt Thermally Conductive Adhesives
  • 4.4. Automotive Sector will Experience a High Adoption Rate due to the Surge in the Demand for Hybrid and Electric Vehicles
  • 4.5. Adoption in the Energy Storage Sector to Rise with Growing Focus on High Performance Batteries
  • 4.6. Lighting Sector is Gaining Traction due to Enhanced Efficiency of Thermally Conductive Adhesives
  • 4.7. Healthcare will Experience a Significant Adoption of Thermally Conductive Adhesives due to its Bio-inert Characteristics

5.0. Technology Impact

  • 5.1. Benchmarking Rubrics
  • 5.2. Electronics Sector is Observed to have the Highest Application Potential
  • 5.3. IP Portfolio and Ability to Meet Application Needs Play an Important Role in Adoption

6. Key Contacts

  • 6.1. Key Contacts

7. Appendix

  • Benchmarking Matrix Data- Justification of Ratings
  • Benchmarking Matrix Data- Justification of Ratings (contd.)
  • Legal Disclaimer