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世界の苛酷環境における光ファイバーコンポーネント・関連装置/パーツの技術および市場予測

Harsh Environment Fiber Optic Components & Related Device/Parts Global Technology and Market Forecast 2017-2027

発行 ElectroniCast 商品コード 348277
出版日 ページ情報 英文 471 pages
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世界の苛酷環境における光ファイバーコンポーネント・関連装置/パーツの技術および市場予測 Harsh Environment Fiber Optic Components & Related Device/Parts Global Technology and Market Forecast 2017-2027
出版日: 2017年02月26日 ページ情報: 英文 471 pages
担当者のコメント
エレクトロニキャストは、エレクトロニクス、光ファイバー、発光ダイオード(LED)、先進フォトニクス、集積回路(IC)、マイクロ波/無線、ネットワーク通信などの分野を専門とする市場調査会社です。当レポートでは、2020年までの市場予測に加え、図表や製品の画像を交えながら苛酷環境下における光ファイバーコンポーネントおよび関連装置をわかりやすく解説しています。エクセルのデータベース、ならびにプレゼン用に最適なパワーポイントのスライドも付いたお得なレポートパックです。
概要

当レポートでは、苛酷環境で動作するよう設計された光ファイバーコンポーネントおよびそれらをサポートするデバイス・パーツの世界における消費・技術動向について予測しており、各光ファイバーコンポーネント分類およびサポート装置・パーツ分類の世界市場における予測・分析、地域市場の予測と分析、エンドアプリケーションの議論、および競合分析などをまとめています。

第1章 エグゼクティブサマリー

第2章 苛酷環境における光ファイバーコンポーネント市場分析・予測

  • 概要
  • アクティブコンポーネント市場分析:機能別
  • パッシブコンポーネント
  • HEFOコンポーネント分析:地域別

第3章 装置・部品市場の分析・予測

  • 概要
  • 装置・部品の分析・予測

第4章 アプリケーション動向

  • 軍事/航空宇宙
  • 産業/商業の概要

第5章 技術動向

  • パッケージング
  • 統合
  • 放射線硬化
  • チャネルあたりの高データレート
  • マルチチャネル/マルチファイバーリンクの拡張
  • バックプレーン
  • 光スイッチ
  • プラスチック光ファイバー
  • 光波長多重通信
  • 光ファイバーセンサー

第6章 顧客レビュー

第7章 競合分析

第8章 定義・頭字語

第9章 研究・分析手法

第10章 市場予測データベース概要・チュートリアル

付録

目次

This market forecast report, which is available immediately, is part of a consultant service from ElectroniCast Consultants to our clients. This report presents ElectroniCast's estimates and forecast of global consumption and technology of fiber optic components, and their supporting devices and parts, which are designed to operate in harsh environments, beyond the environment of commercial telecom and datacom (premise) installations.

This extensive and detailed worldwide market estimates and forecast is presented for each significant fiber optic component category and the supporting devices and parts category. Regional market segmentation is provided. End applications are discussed, a competitive analysis is provided.

The environments encountered by the components included in this analysis and forecast often require custom designed packaging, with much smaller quantities required, compared to packaging of components for conventional/commercial applications. The environmental extremes that must be accommodated are greater, there often is a need for minimizing size and weight, shock and vibration environments are more extreme.

Harsh Environment Defined Harsh Environment (HE) is defined, for this report, as environment beyond the limits normally encountered by commercial telecom, datacom and commercial intra-equipment fiber data links; extremes of

  • Temperature; above or below (-40 to +75) degrees C
  • Shock and vibration
  • Tensile strength (e.g., for fiber-guided missiles, tethered sensors/decoys, etc.)
  • High electromagnetic or radio-frequency (EMI/RFI/EMP) interference
  • Corrosive and/or solvent surroundings
  • Atomic and other Radiation
  • External pressure extremes
  • Rough handling during installation/deployment
  • Others

Necessary rough handling during installation or deployment also qualifies as a "harsh environment".

The specifications of these environments also vary widely, beyond commercial specifications, depending on applications. A high temperature requirement of 85 degrees C for military/aerospace, instead of 75 degrees C commercial is most common, but there are 1000 degree C environments; 100G shock, 1500 rem/hr radiation, etc. that can be required of some fiber optic components. [Rem (roentgen equivalent man), the rem is a unit used to derive a quantity called equivalent dose.]

Although military applications, plus non-military aerospace, dominate the market value of harsh environment fiber optic communication links, commercial telecom and datacom links sometimes must withstand, and operate during, stress beyond typical specifications. Telecom cable installed in sewers and steam tunnels are examples, and also are RF signal (on optical carrier) links installed on antenna towers.

A significant concern of copper signal cables is the vulnerability of the signals to interference caused by radio signals, sparks of arc welders and motor brushes, hostile high-energy pulses, and engine cylinder ignition. As fiber signal link costs continue downward, and as transmitted data rates continue to increase, fiber increasingly will displace copper in automotive, factory and numerous other applications.

While conventional glass fiber cable and optoelectronics are immune to EMI and RFI, plastic optical fiber (POF) is equally immune, is more resistant to other harsh environments such as shock/vibration and rough handling during installation, and permits lower cost fiber links in high volume automated production.

To a large extent, harsh environment fiber optic components are designed to meet specific project specifications, rather than being semi-standard; suitable for a number of different applications. Fiber cable and connectors are exceptions; most harsh environment fiber cable assemblies use rugged connectors and cable that are standardized and commercially available from several vendors. Transmitter/receiver modules, optical backplanes, WDM modules and most other components, however, are designed, or modified to meet unique system applications. They are produced in quantities from a few dozen to a few hundred, per year, resulting in much higher unit prices (including amortization of R&D and tooling costs) compared to similar optoelectronic performance COTS (Commercial Off-The-Shelf) components.

Through the 1990s, harsh environment fiber optic interconnect link applications typically installed the optoelectronics in a protected, benign environment such as the staffed communication compartments of ships; transportable shelters and missile launch sites. Thus, connectors and fiber cable led component value.

Now in 2018, however, numerous aircraft, missile systems and other applications that are totally in harsh environments, using fiber optic interconnect links, which are advancing into volume production.

According to the ElectroniCast study, the worldwide value of Harsh Environment Fiber Optic (HEFO) components reached an estimated $2.74 billion last year. In this new market study, for the first-time - ElectroniCast added the consumption totals of fiber point sensors used in harsh environments to the total value data.

The value of HEFO components are forecasted to increase at an average annual growth rate of 11.8% (2017-2022) and 8.6% during the 2nd-half of the forecast period (2022-2027), reaching $7.26 billion in 2027. Market forecast data in this study report refers to consumption (use) for a particular calendar year; therefore, this data is not cumulative data.

The Military/Aerospace category is set to maintain the leadership position, in terms of value, throughout the forecast period; however in terms of volume (quantity of units), the Commercial/Industrial is set to maintain the dominant leadership position; HEFO components are priced relatively much lower in Commercial/Industrial applications versus Military/Aerospace applications.

Market Forecast by Region

  • Global Summary
  • America
  • Asia Pacific (APAC)
  • Europe, Middle East, Africa (EMEA)

Market Forecast by Function

  • Consumption Value (US$, million)
  • Quantity (number/by 1,000 units)
  • Average Selling Prices (ASP $, each)

This market forecast and analysis, which covers the years 2017-2027, is presented for each significant fiber optic component category and the supporting devices and parts category. The Microsoft Excel-based database is structured in a hierarchical format, with data groups at the lowest structural level, summing to a higher-level category for each significant fiber optic component and the supporting devices and parts, and by applications, as detailed in Tables 1 and 2.

Table 1 Harsh Environment Applications, Components & Devices/Parts Category List

image1

Table 2 - Product Categories

FIBER OPTIC COMPONENTS

  • Active Components
    • Transmitter/Receiver (Transceiver)
      • Transmitter/Receiver for Glass Fiber
      • Transmitter/Receiver for Plastic Fiber
    • Optical Fiber Amplifier
    • Semiconductor Optical Amplifier
    • Other Functions
  • Passive Components
    • Fiber Cable Assemblies/Harnesses
      • Glass Fiber Based
      • Plastic Optical Fiber Based
    • Optical Backplanes
    • Photonic Switches
    • Optical Filter Modules
    • Fiber Optic Point Sensors
    • Other Functions

FIBER OPTIC DEVICES & PARTS

  • Active Devices and Parts
    • Emitters
      • Edge Emitter Laser Diode
      • VCSEL (Multichannel)
      • Light Emitting Diode (LED)
    • Detectors
    • Photonic Integrated Circuits (PICs)
    • Other Active Devices/Parts
  • Passive Devices and Parts
    • Fiber Cable
      • Glass Fiber Cable
      • Plastic Fiber Cable (POF)
    • Composite Cable
    • Cable Connectors
      • Glass Fiber Connectors
      • Plastic Fiber Connectors
    • Optical Filter Elements
    • Fiber Optic Point Sensor Elements
    • Splitters/Combiners
    • Packages
    • Component/Module Packages
    • Other Devices/Parts

Table of Contents

1. EXECUTIVE SUMMARY

  • 1.1 Overview
  • 1.2 Fiber Optic Components and Devices/Parts Overview
    • 1.2.1 Applications
    • 1.2.2 Components
    • 1.2.3 Devices & Parts
  • 1.3 Customers
  • 1.4 Selected Component Trends
    • 1.4.1 Transmitters and Receivers
    • 1.4.2 Optical Fiber Amplifiers
    • 1.4.2 Fiber Optic Cable
  • 1.5 Selected Devices and Parts Trends

2 HARSH ENVIRONMENT FIBER OPTIC COMPONENT MARKET ANALYSIS & FORECAST

  • 2.1 Overview
    • 2.1.1 Optical Fiber
  • 2.2 Active Component Market Analysis, by Function
    • 2.2.1 Transmitter Receiver
    • 2.2.2 Optical Fiber Amplifiers
    • 2.2.3 Semiconductor Optical Amplifiers (SOAs)
    • 2.2.4 Other Active Function Harsh Environment Components
  • 2.3 Passive Components
    • 2.3.1 Cable Assemblies
    • 2.3.2 Optical and Hybrid Backplanes
    • 2.3.3 Photonic Switches
    • 2.3.4 Filter Modules
    • 2.3.5 Fiber Optic Point Sensors
    • 2.3.6 Other Optical Components
  • 2.4 HEFO Component Analysis, by Region

3 DEVICES AND PARTS MARKET ANALYSIS & FORECAST

  • 3.1 Overview
  • 3.2 Devices and Parts Analysis and Forecast
    • 3.2.1 Active Devices/Parts
      • 3.2.1.1 Emitters
      • 3.2.1.2 Detectors
      • 3.2.1.3 Photonic Integrated Circuits (PICs)
      • 3.2.1.4 Other Active Devices/Parts
    • 3.2.2 Passive Devices/Parts
      • 3.2.2.1 Fiber Cable
      • 3.2.2.2 Composite Cable
      • 3.2.2.3 Cable Connectors
      • 3.2.2.4 Packages
      • 3.2.2.5 Other Devices and Parts

4. APPLICATION TRENDS

  • 4.1 Military/Aerospace
    • 4.1.1 Military (non-commercial) Aircraft
    • 4.1.2 Shipboard/Submarine
    • 4.1.3 Missile and Laser Weapon Systems
    • 4.1.4 Base Communication Facilities
    • 4.1.5 Sensor Facilities
    • 4.1.6 Other Military/Aerospace
  • 4.2 Industrial/Commercial -Overview
    • 4.2.1 Factory Applications
    • 4.2.2 Heavy Duty/Mobile Machinery Applications
    • 4.2.3 Transportation
    • 4.2.4 Medical and Laboratory
    • 4.2.5 Exploration/Resource Recovery
    • 4.2.6 Other Harsh Environment Fiber Optic Applications

5. TECHNOLOGY TRENDS

  • 5.1 Packaging
  • 5.2 Integration
  • 5.3 Radiation Hardening
  • 5.4 Higher Data Rates Per Channel
  • 5.5 Expanded Multichannel/Multifiber Links
  • 5.6 Backplanes
  • 5.7 Photonic Switches
  • 5.8 Plastic Optical Fiber
  • 5.9 Wavelength Division Multiplexing
  • 5.10 Fiber Optic Sensors

6. CUSTOMER REVIEW

7. COMPETITIVE ANALYSIS

8. DEFINITIONS AND ACRONYMS

  • 8.1 Acronyms, Abbreviations and General Terms

9. RESEARCH AND ANALYSIS METHODOLOGY

10. Market Forecast Data Base

  • 10.1 Overview
  • 10.2 Tutorial

ADDENDUM

  • HEFO Market Forecast Data Base (Excel spreadsheets: Value, Quantity, Price/Unit: 2017-2027)
    • Global Summary, America, EMEA and APAC
  • PowerPoint Slides (Market Forecast Charts/Figures)
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