市場調査レポート

世界の過酷環境向け光ファイバーコンポーネントおよび関連デバイス/パーツ市場:技術分析・市場予測(2009-2019年)

HARSH ENVIRONMENT FIBER OPTIC COMPONENTS & RELATED DEVICES/PARTS GLOBAL TECHNOLOGY AND MARKET FORECAST 2009 - 2019

発行 ElectroniCast 商品コード 115837
出版日 ページ情報 英文 219 pages
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世界の過酷環境向け光ファイバーコンポーネントおよび関連デバイス/パーツ市場:技術分析・市場予測(2009-2019年) HARSH ENVIRONMENT FIBER OPTIC COMPONENTS & RELATED DEVICES/PARTS GLOBAL TECHNOLOGY AND MARKET FORECAST 2009 - 2019
出版日: 2010年03月15日 ページ情報: 英文 219 pages

当商品の販売は、2016年01月16日を持ちまして終了しました。

概要

当レポートでは、苛酷環境向けの光ファイバーコンポーネントおよび関連デバイス/パーツの市場についてデバイスタイプ・アプリケーション・地域別に調査分析し、2019年までの市場成長予測、技術動向、エンドユーザー産業別の市場動向、顧客動向、競合状況などをまとめ、概略下記の構成でお届けいたします。

第1章 エグゼクティブサマリー

  • 概要
  • 光ファイバーコンポーネンツ・デバイス・パーツの概要
  • 顧客
  • 光通信の動向

第2章 過酷環境向け光ファイバー(HEFO)コンポーネント市場:市場分析・予測

  • 概要
    • プラスチック光ファイバー
  • アクティブコンポーネント市場:機能別市場分析
    • 送受信機
    • 光ファイバー増幅器
    • 半導体光増幅器
    • その他
  • パッシブコンポーネント
    • ケーブルアセンブリ
    • 光・ハイブリッドバックプレーン
    • 光スイッチ
    • フィルターモジュール
    • その他
  • HEFOコンポーネント分析:地域別

第3章 デバイス・パーツ市場:市場分析・予測

  • 概要
  • デバイス・パーツ分析・予測
    • アクティブデバイス/パーツ
    • パッシブデバイス/パーツ

第4章 アプリケーション動向

  • 軍事・航空宇宙
  • 産業・商業

第5章 技術動向

  • パッケージング
  • 集積・統合
  • 耐放射線強化
  • チャネル別のデータレートの向上
  • マルチチャネル/マルチファイバーリンクの拡張
  • バックプレーン
  • フォトニックスイッチ
  • プラスチック光ファイバー
  • 波長分割多重

第6章 顧客レビュー

第7章 競合分析

第8章 定義・略語

第9章 調査・分析手法

第10章 市場予測データベース

  • 概要
  • チュートリアル

市場予測データベース(Excelスプレッドシート)

  • 市場規模・出荷数・価格:地域別:2009-2019年
    • 世界市場サマリー
    • 南北アメリカ
    • 欧州
    • アジア太平洋
目次

Fee Includes March 2010 report, plus two Executive Briefing Service Updates in July and November 2010

The environments encountered by the components included in this analysis and forecast often require custom designed packaging, with much smaller quantities required, compared to packaging of components for conventional/commercial applications. The environmental extremes that must be accommodated are greater, there often is a need for minimizing size and weight, shock and vibration environments are more extreme.

According to ElectroniCast, the American region in 2009, led in global consumption of harsh environment fiber optic components with 53 percent relative market share ($328 million). The European region held second-place and the Asia Pacific occupied third-place. Over the 2009-2019 period, however, consumption of these components will expand faster in the European and the Asia Pacific regions.

Harsh Environment Defined Harsh Environment (HE) is defined, by ElectroniCast, as environment beyond the limits normally encountered by commercial telecom, datacom and commercial intra-equipment fiber data links; extremes of

  • Temperature; above or below (-40 to +75) degrees C
  • Shock and vibration
  • Tensile strength (e.g., for fiber-guided missiles, tethered sensors, etc.)
  • High electromagnetic or radio-frequency (EMI/RFI/EMP) interference
  • Corrosive and/or solvent surroundings
  • Atomic and other Radiation
  • External pressure extremes
  • Rough handling during installation/deployment
  • Others

Necessary rough handling during installation or deployment also qualifies as a “harsh environment”.

The 2009-2019 market forecast database is structured in a hierarchical format, with data groups at the lowest structural level, summing to a higher-level category for each significant fiber optic component and the supporting devices and parts, and by applications, as illustrated below. This market forecast data are segmented by region: Global Summary, America, Japan / China/Pacific Rim, and Europe.

Table of Contents

1. EXECUTIVE SUMMARY

  • 1.1 Overview
  • 1.2 Fiber Optic Components and Devices/Parts Overview
    • 1.2.1 Applications
    • 1.2.2 Components
    • 1.2.3 Devices & Parts
  • 1.3 Customers
  • 1.4 Optical Communication Trends
    • 1.4.1 Overview Fiber Optic Networks
    • 1.4.2 Components
      • 1.4.2.1 Overview
      • 1.4.2.2 Transmitters and Receivers
      • 1.4.2.3 Optical Fiber Amplifiers
      • 1.4.2.4 Dispersion Compensators
      • 1.4.2.5 Fiber Cable
    • 1.4.3 Devices and Parts
      • 1.4.3.1 Overview
      • 1.4.3.2 Emitters and Detectors
      • 1.4.3.3 VCSEL & Transceiver Technology Review
      • 1.4.3.4 Optoelectronic Application-Specific Integrated Circuits
      • 1.4.3.5 Modulators
      • 1.4.3.6 Packages
      • 1.4.3.7 Optoelectronic Integrated Circuits

2. HARSH ENVIRONMENT FIBER OPTIC COMPONENT MARKET ANALYSIS & FORECAST

  • 2.1 Overview
    • 2.1.1 Plastic Optical Fiber
  • 2.2 Active Component Market Analysis, by Function
    • 2.2.1 Transmitter Receiver
    • 2.2.2 Optical Fiber Amplifiers
    • 2.2.3 Semiconductor Optical Amplifiers (SOAs)
    • 2.2.4 Other Active Function Harsh Environment Components
  • 2.3 Passive Components
    • 2.3.1 Cable Assemblies
    • 2.3.2 Optical and Hybrid Backplanes
    • 2.3.3 Photonic Switches
    • 2.3.4 Filter Modules
    • 2.3.5 Other Optical Components
  • 2.4 HEFO Component Analysis, by Region

3. DEVICES AND PARTS MARKET ANALYSIS & FORECAST

  • 3.1 Overview
  • 3.2 Devices and Parts Analysis and Forecast
    • 3.2.1 Active Devices/Parts
      • 3.2.1.1 Emitters
      • 3.2.1.2 Detectors
      • 3.2.1.3 Optoelectronic ASICs
      • 3.2.1.4 Optoelectronic ICs
      • 3.2.1.5 Other Active Devices/Parts
    • 3.2.2 Passive Devices/Parts
      • 3.2.2.1 Fiber Cable
      • 3.2.2.2 Composite Cable
      • 3.2.2.3 Cable Connectors
      • 3.2.2.4 Packages
      • 3.2.2.5 Other Devices and Parts

4. APPLICATION TRENDS

  • 4.1 Military/Aerospace
    • 4.1.1 Military(non-commercial) Aircraft
    • 4.1.2 Missile Systems and Rockets
    • 4.1.3 Spacecraft and Orbital Vehicles
    • 4.1.4 Shipboard/Submarine
    • 4.1.5 Base Communication Facilities
    • 4.1.6 Sensor Facilities
    • 4.1.7 Other Military/Aerospace
  • 4.2 Industrial/Commercial -Overview
    • 4.2.1 Factory Applications
    • 4.2.2 Transportation
    • 4.2.3 Medical and Laboratory
    • 4.2.4 Exploration/Resource Recovery
    • 4.2.5 Other Harsh Environment Fiber Optic Applications

5. TECHNOLOGY TRENDS

  • 5.1 Packaging
  • 5.2 Integration
  • 5.3 Radiation Hardening
  • 5.4 Higher Data Rates Per Channel
  • 5.5 Expanded Multichannel/Multifiber Links
  • 5.6 Backplanes
  • 5.7 Photonic Switches
  • 5.8 Plastic Optical Fiber
  • 5.9 Wavelength Division Multiplexing

6. CUSTOMER REVIEW

7. COMPETITIVE ANALYSIS

8. DEFINITIONS AND ACRONYMS

  • 8.1 Acronyms, Abbreviations and General Terms

9. RESEARCH AND ANALYSIS METHODOLOGY

10. Market Forecast Data Base

  • 10.1 Overview
  • 10.2 Tutorial

ADDENDUM

  • HEFO Market Forecast Data Base (Excel spreadsheets: Value, Quantity, Price/Unit: 2009-2019)
    • Global Summary, America, Europe and Asia Pacific
    • PowerPoint Slides (Market Forecast Charts/Figures)

LIST OF TABLES

  • 1.1.1 HEFO Components Global Consumption Value, by Function
  • 1.1.2 HEFO Devices and Parts Global Consumption Value, by Function
  • 1.1.3 HEFO Components Global Consumption Value, by Region
  • 1.1.4 HEFO Components Global Military/Aerospace Consumption Value, by Region
  • 1.1.5 Harsh Environment Plastic Optical Fiber (POF) Components Global Value, by Region
  • 1.2.1.1 HEFO Components Global Consumption Value, by Application
  • 1.2.1.2 HEFO Components American Consumption Value, by Application
  • 1.2.1.3 HEFO Components European Consumption Value, by Application
  • 1.2.1.4 HEFO Components Asia Pacific Consumption Value, by Application
  • 1.2.2.1 Plastic Fiber Optic Components Global Industrial/Commercial Value, by Function
  • 1.2.2.2 Harsh Environment Key Component Consumption Global Value Trend, by Fiber Type
  • 1.2.3.1 HEFO Devices and Parts Global Consumption Value, by Function
  • 1.2.3.2 Emitters for Harsh Environment Transmitters Global Consumption Value, by Type
  • 1.2.3.3 HEFO Connectors Global Consumption Value, by Type
  • 1.2.3.4 Packages for Harsh Environment Components & Devices Global Value, by Function
  • 2.1.1 HEFO Components Global Consumption Value, by Region
  • 2.1.2 Harsh Environment Fiber Optic Components (HEFO) Regional Trends (Consumption Value)
  • 2.1.1.1 Harsh Environment Key Component Consumption Value Trend, by Fiber Type
  • 2.2.1 HEFO Components Global Consumption Value, by Function
  • 2.2.1.1 HEFO Transmitter/Receiver Global Trends: Military/Aerospace plus Commercial/Industrial Applications
  • 2.4.1 HEFO Global Consumption Value, by Region/Marketplace
  • 3.1.1 Harsh Environment Fiber Optic (HEFO) Devices and Parts Global Consumption, by Function
  • 3.2.1.1.1 Emitters for Harsh Environment Transmitters Global Consumption Value, by Type
  • 3.2.1.2.1 Photodetectors for Harsh Environment Receivers, Global Consumption Value, by Data Rate
  • 3.2.1.3.1 Optoelectronic ASIC Consumption in Harsh Environment Components
  • 3.2.2.1.1 Harsh Environment Fiber Optic (HEFO) Cable Global Consumption Value, by Type
  • 3.2.2.3.1 Harsh Environment Fiber Optic (HEFO) Connectors Global Consumption Value, by Type
  • 3.2.2.3.2 HEFO Connectors Global Trends: Military/Aerospace plus Commercial/Industrial Applications
  • 3.2.2.4.1 Harsh Environment Packages Value Trend, by Function`
  • 3.2.2.5.1 Other (Miscellaneous) HEFO Devices and Parts Global Consumption Value, by Application
  • 4.1.1 HEFO Components Global Consumption Value, by Application
  • 4.1.1.1 HEFO Components Global Consumption Value, by Spacecraft & Military Aircraft Systems
  • 4.1.2.1 HEFO Components Global Consumption Value, by Missile Systems
  • 4.1.3.1 HEFO Components Global Consumption Value, Spacecraft and Orbital Vehicles
  • 4.1.4.1 HEFO Components Global Consumption Value, by Shipboard Systems
  • 4.1.5.1 HEFO Components Global Consumption Value, by Base Communication Facilities
  • 4.1.7.1 HEFO Components Global Consumption Value, by Other Military/Aerospace
  • 4.2.1 HE - Plastic Optical Fiber (POF) Components Global Value, by Industrial/Commercial Application
  • 4.2.2 HEFO Components Global Consumption Value, by Industrial & Commercial Applications
  • 4.2.1.1 HEFO Components Global Consumption Value, by Factory Applications
  • 4.2.2.1 HEFO Components Global Value, by Commercial Aircraft, Train, Ship & Other Applications
  • 4.2.2.2 HEFO Components Global Consumption Value, by Automotive/Truck Applications
  • 4.2.3.1 HEFO Components Global Consumption Value, by Medical/Laboratory Applications
  • 4.2.5.1 HEFO Components Global Consumption Value, by Other/Miscellaneous Applications
  • 10.1.1 Harsh Environment Applications, Components & Devices/Parts Category List
  • 10.2.1 Product Categories 1

LIST OF FIGURES

  • 1.1.1 Military/Aerospace Dominance of HEFO Components Global Market ($Million and %)
  • 1.1.2 HEFO Components End Applications (Market Forecast Category List)
  • 1.1.3 Harsh Environment Fiber Optic Components - HEFO (Market Forecast Category List)
  • 1.1.4 HEFO Devices & Parts (Market Forecast Category List)
  • 1.1.5 HEFO Component Global Consumption, by Region (2009-2019: $Million and %)
  • 1.2.1 HEFO Component Available Market vs. Captive (Global Market Share Forecast, %)
  • 1.3.1 Evolution of Research Emphasis During Technology Life Cycle
  • 1.4.1.1 Network Bandwidth Expansion Alternatives
  • 1.4.1.2 Multiple-fiber (Multifiber) Transmitters
  • 1.4.1.3 Flexible Optical Backplane
  • 1.4.3.3.1 Genealogy of VCSELs
  • 1.4.3.3.2 Optical Subassembly (OSA)
  • 1.4.3.3.3 10 Gbps VCSEL Optical Subassembly
  • 1.4.3.3.4 4 x 3.125 Gbps WWDM SFF Transceiver Concept
  • 1.4.3.3.5 Assembled Non-Functional 4 x 3.125 Gbps WWDM SFF Concept Module
  • 1.4.3.3.6 WWDM Transceiver, Transmit Side Optical Combiner
  • 1.4.3.3.7 WWDM Demultiplexing Subassembly
  • 1.4.3.3.8 CWDM VCSEL Transceiver (8-wavelength diagram)
  • 1.4.3.3.9 4-Channel VCSEL Transceiver
  • 1.4.3.3.10 OptoCube 40
  • 1.4.3.3.11 Array VCSEL Interconnects between Cabinets or Racks
  • 1.4.3.3.12 12 x 2.5 Gbps VCSEL Transceiver Package
  • 1.4.3.3.13 Pre-terminated Ribbon Cable Assembly
  • 1.4.3.3.14 Optical Backplane Implementation
  • 1.4.3.3.15 Typical Intra-Office Interconnections
  • 1.4.3.3.16 12 Fiber VSR Architecture
  • 1.4.3.3.17 Converter ASIC Function
  • 1.4.3.3.18 12-Fiber VSR Module vs. OC-192 SONET Line Card
  • 1.4.3.3.19 4 Fiber VSR Architecture
  • 1.4.3.7.1 Trend of Transceiver Packaging Density, Gigabits/Cubic Inch
  • 1.4.3.7.2 Xanoptix 32x32 Datacom Transceiver
  • 1.4.3.7.3 Integrated Transceiver/Silicon Waveguides
  • 2.2.1.1 Transceiver Data Rate Trends In Harsh Environment Applications
  • 2.2.1.2 Transmission Mode Trends of Harsh Environment Transmitter/Receivers (Global Market Share, %)
  • 2.3.1 1 Cable Assemblies/Harnesses
  • 2.3.1.2 Stainless Steel Ribbon Cable Assembly
  • 2.3.2.1 Flexible MT Terminated Optical Backplane
  • 2.3.2.2 Flexible Unterminated Optical Backplane
  • 2.3.2.3 VITA 66 Fiber Optic Backplane Connector Module
  • 2.3.2.4 Refractive Plate Switch
  • 2.3.2.5 4x4 Photonic Crossconnect Switch
  • 3.2.2.1.1 Armored fiber-optic cables for harsh-environment applications
  • 3.2.2.1.2 Corrugated Copper Outer Sheath/Armor Cable Construction
  • 3.2.2.3.1 TFOCA (Tactical Fiber Optic Connector)
  • 3.2.2.3.2 Cylindrical Connectors - ARINC 801 Standard
  • 3.2.2.3.3 All Metallic 38999 Fiber Optic Socket
  • 4.1 Military/Aerospace Dominance of HEFO Components Global Market ($Million and %)
  • 4.1.1 Copper Cabling in Earlier Aircraft
  • 4.1.2 Evolution of Weapon Systems
  • 4.1.3 Avionics Architecture Evolution
  • 4.1.4 Avionic Interface Capacity
  • 4.1.5 Singlemode Backplane Concept
  • 4.1.6 Multichannel Low Profile Fiber Optic Transceiver
  • 4.1.7 Statos International Miniaturized High Performance Transceiver
  • 4.1.3.1 Mission Data Network High Speed Fiber Optic LAN For Space
  • 4.1.5.1 Fixed Base vs. Transportable Base Component Consumption Trends ($Million and Market Share, %)
  • 4.2.2.1 HEFO Component Transportation Global Trends, by Transportation Segments ($Million and%
  • 5.3.1 Radiation Hardened Integrated Circuits
  • 5.6.1 Flexible Optical Backplane, Courtesy of Stratos International
  • 10.2.1 Component Application Categories
  • 10.2.2 Database Use Example, Components

SUBJECT HIGHLIGHTS

  • Passive Components Lead Value
  • Devices and parts are Major Value Added
  • Harsh Environment Defined
  • Specialty Devices and Parts for Harsh Environment
  • Numerous Application Categories
  • Wide Variation in Applications
  • United States Department of Defense 2011 Budget
  • America Leads Consumption
  • Dynamic Growth in Asian Consumption
  • America Leads Weapons Sophistication
  • Plastic Optical Fiber a Major Factor
  • American Contractors Lead Global Consumption
  • Available Market Trend
  • Military/Aerospace Dominance Challenged by Automotive
  • Strong Growth in European and Asia Pacific Consumption
  • Dynamic Growth of Asia Pacific Applications
  • List of Asia Pacific Countries
  • Glass Fiber Based Components will Continue Dominance
  • Dynamic Growth of POF Components
  • LEDs Continue Strong
  • Specialty Connectors Will Gain Market Value Lead
  • Packages Expensive
  • Numerous Contractors of Harsh Environment Fiber Optic Component-using Systems
  • ASICs a Major Challenge
  • Private Data Networks Ethernet Oriented
  • Intra-Equipment/Intra-Enclosure Links Dominated by Multifiber
  • Chasing the All-Optical Network
  • Defense Advanced Research Projects Agency (DARPA)
  • Microsystems Technology Office (DARPA - MTO)
  • DARPA: Data in Optical Domain-Network (DOD-N)
  • DARPA: Optical Data Router (ODR)
  • DARPA: Architectures for DOD-N Networks
  • DARPA: Dynamic Multi-Terabit Core Optical Networks: (CORONET)
  • 100-Gbps and 40-Gbps Ethernet communications standard
  • Monolithic Integration Long Term
  • VCSEL Historical Overview
  • 10 Gbps Serial VCSEL Packaging
  • Advanced Transceiver Packaging: WWDM/CWDM Approaches
  • Physical Implementations of Optical Interconnects
  • Optical Backplanes
  • SONET OC-192 Very Short Reach (VSR) Links
  • The need is for a very short reach (VSR) 9.952 Gbps solution
  • Twelve Channel Parallel VCSEL Option
  • Four Channel Parallel VCSEL Option
  • 10 Gbps Serial VSR Options
  • OC-768 Very Short Reach (VSR)
  • Expected Usage by Module Type
  • Optoelectronic Integrated Circuits- Materials
  • Silicon-Germanium
  • Compound Semiconductors
  • Vendor Background of RF/Microwave
  • Integration
  • Hybrid versus Monolithic Integration
  • Typical example is the digital crossconnect switch (DCS)
  • Hybrid Opto ASIC Packaging
  • Monolithic Integration
  • Data Speeds
  • Why Higher Data Rates are Tough to Achieve
  • Integrated Circuits More Difficult
  • Optical Fiber the Biggest Challenge
  • Forward Error Correction (FEC) a Partial Solution
  • Packaging
  • America Leads Consumption
  • Plastic Fiber
  • Active Components Will Expand Consumption Value Share
  • Transmitter/Receiver Modules
  • Plastic Optical Fiber Transceivers to Gain Market Share
  • Data Rate Trend Strongly Upward
  • Singlemode Moving Up
  • SBIR programs Awards-Ruggedized Transceivers
  • Optical Fiber Amplifiers
  • Semiconductor Optical Amplifiers
  • Other Active Function Harsh environment components
  • Cable Assemblies Provide Maximum Survivability
  • Optical Backplanes for harsh environments
  • VITA 66 Fiber Optic Interconnect
  • Photonic Switches
  • Optical Fiber Filter Modules
  • DWDM Modules
  • Other Passive FunctionHarsh Environment Fiber Optic Devices and Parts
  • Active Devices/Parts
  • Passive Devices/Parts
  • Emitters used in harsh environment transmitters
  • LEDs, VCSEL and EELDs
  • Detector die, reducing cost and space and simplifying packaging
  • Reduction of size and weight of components
  • Military/aerospace fiber optic cables
  • Armored fiber-optic cables for harsh-environment applications
  • ARINC 801 Terminus
  • The ARINC 801 standard
  • ARINC 801 and EN4531
  • Circular fiber optic connector for military applications
  • From Vacuum Tubes to Supercomputers
  • Trend to Miniaturization
  • Multichannel Fiber Optic Package Interface for Avionics
  • The United States - Navy SBIR 2009.1 - Topic N091-039 (PROGRAM: Joint Strike Fighter)
  • Vendors selected for further consideration under DoD Program Solicitation
  • Spacecraft/Military Aircraft Component Consumption
  • Transmitters/Receivers Lead Spacecraft Fiber Optic Components
  • DARPA Tactical Technology Office: DARPA-SN-10-31 (February 2010)
  • MOIRE - Membrane Optic Imager Real-Time Exploitation (Optics for satellite surveillance)
  • Weapon, communication and sensor systems on ships and submarines
  • Unmanned Ground Vehicle (UGV) Using Fiber Optic Gyros
  • Remote Stabilized Weapon Stations (RWS) Using FOGs
  • U.S. Navy Cooperative Engagement Capability (CEC)
  • Fiber Optic Towed Decoy (FOTD)
  • POF - Major penetration into industrial and commercial applications
  • Fiber-coupled diode laser module: medical applications
  • Technology Collaboration
  • Packaging has three cost elements
  • Radiation Hardened Integrated Circuits
  • Flexible optical backplanes
  • Boeing and Raytheon
  • Harris
  • Lockheed Martin
  • BAE Systems
  • Mitsubishi
  • Exploration includes sound detection sensors
  • Mobile Machinery
  • Factory
  • Transportation
  • Medical
  • Other/Miscellaneous Applications
  • Harsh Environment Fiber Optic Connectors (Selected Vendors)
  • Fiber Optic Cable
  • Plastic optical fiber (POF)
  • Fiber optic transceivers
  • Optical Backplanes
  • Photonic Switches
  • Other Fiber Optic Components
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