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設計分析:EricssonのGSM/LTEマルチモード・ベースバンドユニットKDU 137 624/3 R2AモデルDUS 31 01

Ericsson GSM/LTE Multi-mode Baseband Unit KDU 137 624/3 R2A Model DUS 31 01

発行 EJL Wireless Research 商品コード 311518
出版日 ページ情報 英文 46 Pages
納期: 即日から翌営業日
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本日の銀行送金レート: 1USD=106.71円で換算しております。
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設計分析:EricssonのGSM/LTEマルチモード・ベースバンドユニットKDU 137 624/3 R2AモデルDUS 31 01 Ericsson GSM/LTE Multi-mode Baseband Unit KDU 137 624/3 R2A Model DUS 31 01
出版日: 2014年08月29日 ページ情報: 英文 46 Pages
概要

当レポートでは、Ericsson製のRBS6000システムの構成要素であるDUS31 01 FDD/TDD LTE + GSMの設計情報について分析し、全体的なサイズ・インタフェース・機能に関する情報や、内部部品の詳細情報(大容量LTEユーザー支援用高度ASIC、電力制御用装置ほか)などを盛り込んでお届けいたします。

エグゼクティブ・サマリー

  • 能動素子/受動素子の概要
  • 重要な注記

第1章 ERICSSONのRBS6000 BTSシステム

  • RBS6101/6102/6201/6202/6301/6601の製品概要

第2章 DUSの機械分析

  • 機械分析

第3章 ベースバンドプロセッシング/CPRI/インタフェースボード・サブシステム

付録A:受動素子のケースサイズの分析

付録B:能動素子の市場シェアの分析

図表一覧

目次

This report covers the design analysis of a Ericsson DUS31 01 FDD/TDD LTE + GSM. This unit is part of the RBS6000 system. The unit was manufactured between Q1 of 2013.

Key Findings:

  • Advanced ASICs for high capacity LTE user support and throughput
  • Advanced power management for ASICs and FPGAs

Component and semiconductor suppliers mentioned in this report include:

Analog Devices, Broadcom, Fairchild Semiconductor, Integrated Device Technology, Maxim Integrated Products, NXP Semiconductors, ON Semiconductor, Samsung Semiconductor, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.

  • Features
  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description
  • Package Type

Important Note: There is NO component pricing contained within the report.

Table of Contents

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM

  • Overview of RBS6101/6102/6201/6202/6301/6601 Product Offering

CHAPTER 2: DUS MECHANICAL ANALYSIS

  • Mechanical Analysis

CHAPTER 3: BASEBAND PROCESSING/CPRI/INTERFACE BOARD SUBSYSTEM

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

  • Table 1: Area C Bill of Materials
  • Table 2: DUS PCB Top Area A Bill of Materials
  • Table 3: DUS PCB Top Area A1 Bill of Materials
  • Table 4: DUS PCB Top Area A2 Bill of Materials
  • Table 5: DUS PCB Bottom Area B Bill of Materials
  • Table 6: Passive Component Case Size Distribution by System Subsection
  • Table 7: Identified Passive Component Supplier Distribution by System Subsection
  • Table 8: Active/Passive Component Distribution by System Subsection
  • Table 9: Active Semiconductor/Component Vendor Distribution by System Subsection

EXHIBITS

  • Exhibit 1: Ericsson RBS620x Macro Cell Indoor BTS System.
  • Exhibit 2: Ericsson RBS6601 Macro Cell Main/Remote BTS System
  • Exhibit 3: Ericsson DUS System Block Diagram
  • Exhibit 4: DUS Unit, Front
  • Exhibit 5: DUS Unit, Back
  • Exhibit 6: DUS Unit, Left Side
  • Exhibit 7: DUS Unit, Top
  • Exhibit 8: DUS Unit, Bottom.
  • Exhibit 9: DUS Faceplate, Top View
  • Exhibit 10: DUS Faceplate, Bottom View
  • Exhibit 11: DUS Faceplate, Internal View
  • Exhibit 12: DUS Top Shield, External View
  • Exhibit 13: DUS Top Shield, Internal View
  • Exhibit 14: DUS Bottom Shield, External View
  • Exhibit 15: DUS Bottom Shield, Internal View
  • Exhibit 16: DUS Bottom Shield, Front View
  • Exhibit 17: DUS 31 01 System, Exploded Side View
  • Exhibit 18: DUS with Top Shield Removed
  • Exhibit 19: DUS Semiconductor IC Heat Sink Types, Top View
  • Exhibit 20: DUS Semiconductor IC Heat Sink Types, Bottom View
  • Exhibit 21: DUS PCB, Top View w/Heat Sinks
  • Exhibit 22: DUS PCB Top, Area A
  • Exhibit 23: DUS PCB Top, Area A1 and A2
  • Exhibit 24: DUS PCB Bottom, Area B
  • Exhibit 25: DUS PCB Top Area A Component Diagram
  • Exhibit 26: Area C SSD Daughter Card Component Diagram, Top (L) and Bottom (R)
  • Exhibit 27: DUS PCB Top Area A1 Component Diagram
  • Exhibit 28: DUS PCB Top Area A2 Component Diagram
  • Exhibit 29: DUS Baseband Processing/CPRI/Interface Block Diagram.
  • Exhibit 30: DUS PCB Bottom Area B Component Diagram
  • Exhibit 31: Passive Component Case Size Distribution
  • Exhibit 32: Identified Passive Component Market Share by Vendor
  • Exhibit 33: Active Semiconductor Component Share
  • Exhibit 34: High Pin Count IC vs. Discretes
  • Exhibit 35: Active Semiconductor Market Share by Vendor.
  • Exhibit 36: High Pin Count (64+) Active Semiconductor Market Share by Vendor
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