株式会社グローバルインフォメーション
TEL: 044-952-0102
表紙
市場調査レポート

Huawei:LTE-FDDベースバンドユニット WD2BBBUC-HERT(BBU3900)

Huawei LTE-FDD Baseband Unit WD2BBBUC-HERT BBU Model BBU3900

発行 EJL Wireless Research 商品コード 311352
出版日 ページ情報 英文 68 Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=114.71円で換算しております。
Back to Top
Huawei:LTE-FDDベースバンドユニット WD2BBBUC-HERT(BBU3900) Huawei LTE-FDD Baseband Unit WD2BBBUC-HERT BBU Model BBU3900
出版日: 2014年07月31日 ページ情報: 英文 68 Pages
概要

Huawei Technologiesによる、LTE-FDDのBBU(ベースバンドユニット)WD2BBBUC-HERT(商品名:BBU3900)は、DBS3900システムの一部で、2011年第3〜第4四半期に製造されました。

当レポートでは、Huawei TechnologiesのFDD LTEの設計について分析し、体系的な情報を提供しています。

エグゼクティブサマリー

  • 能動/受動部品サマリー
  • 重要事項

第1章 Huawei TechnologiesのDBS3900 BTSシステム

  • DBS3900製品提供の概要

第2章 BSBCの機械分析

  • 機械分析
  • BSBCバックプレーンPCB

第3章 ファンユニット(UBFA)

第4章 UPEUC

第5章 LTE構成

第6章 LMPTユニット

第7章 LBBPユニット

付録

図表

目次

This report covers the design analysis of a Huawei Technologies FDD LTE. This unit is part of the DBS3900 system. The unit was manufactured between Q3-Q4 of 2011.

Key Findings:

  • Modular chassis allows for single mode and multi-mode operation
  • LBBPc card allows for capacity up to 2T2R 3 x 20MHz or 4T4R 3 x 10MHz

Component and semiconductor suppliers mentioned in this report include:

Analog Devices, Fairchild Semiconductor, HiSilicon Technologies, Integrated Device Technology, Maxim Integrated Products, Micrel, NXP Semiconductors, ON Semiconductor, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.

  • Features
  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description
  • Package Type

Important Note: There is NO component pricing contained within the report.

Table of Contents

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: HUAWEI TECHNOLOGIES DBS3900 BTS SYSTEM

  • Overview of DBS3900 Product Offering

CHAPTER 2: BSBC MECHANICAL ANALYSIS

  • Mechanical Analysis
  • BSBC Backplane PCB

CHAPTER 3: FAN UNIT (UBFA)

CHAPTER 4: UPEUC

CHAPTER 5: LTE CONFIGURATION

CHAPTER 6: LMPT

CHAPTER 7: LBBP

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

  • Table 1: BSBC PCB Bill of Materials, Top
  • Table 2: BSBC PCB Bill of Materials, Bottom
  • Table 3: Fan Unit Bill of Materials
  • Table 4: Fan Unit PCB, Top Bill of Materials
  • Table 5: Fan Unit PCB, Bottom Bill of Materials
  • Table 6: UPEU Ethernet PCB Bill of Materials
  • Table 7: UPEU Main PCB Area A Bill of Materials
  • Table 8: UPEU Main PCB Area B Bill of Materials
  • Table 9: LMPT Top View Bill of Materials
  • Table 10: LMPT Top View Area A Bill of Materials
  • Table 11: LMPT Top View Area B Bill of Materials
  • Table 12: LMPT Bottom View Area B Bill of Materials
  • Table 13: LMPT Top View Area C Bill of Materials
  • Table 14: LMPT Bottom View Area C Bill of Materials
  • Table 15: LMPT Bottom View Bill of Materials
  • Table 16: LBBP Variant Specifications
  • Table 17: LBBP Variant Maximum Data Rate Support
  • Table 18: LBBP Top View Bill of Materials
  • Table 19: LBBP Bottom View Bill of Materials
  • Table 20: Passive Component Case Size Distribution by System Subsection
  • Table 21: Identified Passive Component Supplier Distribution by System Subsection
  • Table 22: Active/Passive Component Distribution by System Subsection
  • Table 23: Active Semiconductor/Component Vendor Distribution by System Subsection

EXHIBITS

  • Exhibit 1: BTS3900 DBS3900
  • Exhibit 2: BBU3900 BSBC Unit
  • Exhibit 3: BBU3900 Logical Structure for LTE Configuration
  • Exhibit 4: DBS3900 Configurations (Star/Cascade)
  • Exhibit 5: BSBC Configuration for LTE
  • Exhibit 6: BBU3900 Basic Configuration for LTE with cards
  • Exhibit 7: BBU3900 Typical 3x20MHz 2T2R Configuration for LTE with cards
  • Exhibit 8: BSBC Chassis, Front View
  • Exhibit 9: BSBC Chassis, Top View
  • Exhibit 10: BSBC Chassis, Bottom View
  • Exhibit 11: BSBC Chassis, Left View
  • Exhibit 12: BSBC Chassis, Right View
  • Exhibit 13 : BSBC Chassis, Back View
  • Exhibit 14: BSBC Chassis, Back View with Back plate Cover Removed
  • Exhibit 15: Backplane Connector PCB, Top View
  • Exhibit 16: Backplane Connector PCB, Bottom View
  • Exhibit 17: Backplane Connector Component Diagram, Top View
  • Exhibit 18: Fan Unit Panel Identification
  • Exhibit 19: Fan Unit, Top View
  • Exhibit 20: Fan Unit, Bottom View
  • Exhibit 21: Fan Unit, Right Side View
  • Exhibit 22: Fan Unit, Left Side View
  • Exhibit 23: Fan Unit Component Diagram
  • Exhibit 24: Fan Unit Cable Diagram
  • Exhibit 25: Fan Unit PCB, Top View, Component Diagram
  • Exhibit 26: Fan Unit PCB, Bottom View. Component Diagram
  • Exhibit 27: UPEU Panel Identification
  • Exhibit 28: UPEUc, Top View
  • Exhibit 29: UPEUc, Bottom View
  • Exhibit 30: UPEUc, Side View
  • Exhibit 31: UPEU Ethernet PCB, Top View
  • Exhibit 32: UPEU Ethernet PCB, Bottom View, Component Diagram
  • Exhibit 33: UPEU Main PCB with Heatsink (Top) and without (Bottom)
  • Exhibit 34: UPEU Main PCB, Top View
  • Exhibit 35: UPEU Main PCB, Bottom View
  • Exhibit 36: UPEU Main PCB Area A Component Diagram
  • Exhibit 37: UPEU Main PCB Area B Component Diagram
  • Exhibit 38: BBU3900 Basic Configuration (3x20MHz 2T2R) for LTE with LBBPc card
  • Exhibit 39: BBU3900 Basic Configuration (3x20MHz 2T2R) for LTE with LBBPb cards
  • Exhibit 40: LMPT Panel Identification
  • Exhibit 41: Working Principle of the LMPT Unit
  • Exhibit 42: LMPT Board, Top View
  • Exhibit 43: LMPTb System Block Diagram
  • Exhibit 44: LMPT Board Top View Analysis Map
  • Exhibit 45: LMPT Board Top View Component Diagram
  • Exhibit 46: LMPT Board Top View Area A Component Diagram
  • Exhibit 47: Area B GPS Processing Daughter Card, Top View Component Diagram
  • Exhibit 48: Area B GPS Processing Daughter Card, Bottom View Component Diagram
  • Exhibit 49: External GPS Cable
  • Exhibit 50: Internal GPS Cable
  • Exhibit 51: LMPT Area C Daughter Card Top View Component Diagram
  • Exhibit 52: LMPT Area C Daughter Card Bottom View Component Diagram
  • Exhibit 53: LMPT Board Bottom View Component Diagram
  • Exhibit 54: LMPT Faceplate
  • Exhibit 55: LBBPb Panel Identification
  • Exhibit 56: LBBPc Panel Identification
  • Exhibit 57: LBBPd Panel Identification
  • Exhibit 58: LBBPc System Block Diagram
  • Exhibit 59: LBBP Board, Top View
  • Exhibit 60: LBBP Top View Component Diagram
  • Exhibit 61: LBBP Bottom View Component Diagram
  • Exhibit 62: LBBP Faceplate
  • Exhibit 63: Passive Component Case Size Distribution
  • Exhibit 64: Identified Passive Component Market Share by Vendor
  • Exhibit 65: Active Semiconductor Component Share
  • Exhibit 66: High Pin Count IC vs. Discretes
  • Exhibit 67: Active Semiconductor Market Share by Vendor
  • Exhibit 68: High Pin Count (64+) Active Semiconductor Market Share by Vendor
Back to Top