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Huawei:W-CDMA/HSPAベースバンドユニット WD2BBBUC-HERT(BBU3900)

Huawei W-CDMA/HSPA Baseband Unit WD2BBBUC-HERT BBU Model BBU3900

発行 EJL Wireless Research 商品コード 311351
出版日 ページ情報 英文 64 Pages
納期: 即日から翌営業日
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Huawei:W-CDMA/HSPAベースバンドユニット WD2BBBUC-HERT(BBU3900) Huawei W-CDMA/HSPA Baseband Unit WD2BBBUC-HERT BBU Model BBU3900
出版日: 2014年07月31日 ページ情報: 英文 64 Pages
概要

Huawei Technologiesによる、W-CDMA/HSPAのBBU(ベースバンドユニット)WD2BBBUC-HERT(商品名:BBU3900)は、DBS3900システムの一部で、2011年第3〜第4四半期に製造されました。

当レポートでは、Huawei TechnologiesのW-CDMAの設計について分析し、体系的な情報を提供しています。

エグゼクティブサマリー

  • 能動/受動部品サマリー
  • 重要事項

第1章 Huawei TechnologiesのDBS3900 BTSシステム

  • DBS3900製品提供の概要

第2章 BSBCの機械分析

  • 機械分析
  • BSBCバックプレーンPCB

第3章 ファンユニット(UBFA)

第4章 UPEUC

第5章 W-CDMA/HSPA構成

第6章 WMPTユニット

第7章 WBBPユニット

付録

図表

目次

This report covers the design analysis of a Huawei Technologies W-CDMA. This unit is part of the DBS3900 system. The unit was manufactured between Q3-Q4 of 2011.

Key Findings:

  • Modular chassis allows for single mode and multi-mode operation
  • WBBPd1 card allows for capacity of 192 DL UEs and 128 HSDPA UEs

Component and semiconductor suppliers mentioned in this report include:

Analog Devices, Fairchild Semiconductor, HiSilicon Technologies, Integrated Device Technology, Linear Technology, Maxim Integrated Products, Micrel, NXP Semiconductors, ON Semiconductor, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.

  • Features
  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description
  • Package Type

Important Note: There is NO component pricing contained within the report.

Table of Contents

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: HUAWEI TECHNOLOGIES DBS3900 BTS SYSTEM

  • Overview of DBS3900 Product Offering
  • CHAPTER 2: BSBC MECHANICAL ANALYSIS
  • Mechanical Analysis
  • BSBC Backplane PCB.

CHAPTER 3: FAN UNIT (UBFA)

CHAPTER 4: UPEUC

CHAPTER 5: W-CDMA/HSPA CONFIGURATION

CHAPTER 6: WMPT UNIT

CHAPTER 7: WBBP UNIT

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

  • Table 1: BSBC PCB Bill of Materials, Top
  • Table 2: BSBC PCB Bill of Materials, Bottom
  • Table 3: Fan Unit Bill of Materials
  • Table 4: Fan Unit PCB, Top Bill of Materials
  • Table 5: Fan Unit PCB, Bottom Bill of Materials
  • Table 6: UPEU Ethernet PCB Bill of Materials
  • Table 7: UPEU Main PCB Area A Bill of Materials
  • Table 8: UPEU Main PCB Area B Bill of Materials
  • Table 9: WMPT Board Top View Bill of Materials
  • Table 10: WMPT Board Top View Area A Bill of Materials
  • Table 11: WMPT Board Bottom View Bill of Materials
  • Table 12: WBBP Variant Specifications
  • Table 13: WBBPd1 Top View Bill of Materials
  • Table 14: WBBPd1 Bottom View Bill of Materials
  • Table 15: Passive Component Case Size Distribution by System Subsection
  • Table 16: Identified Passive Component Supplier Distribution by System Subsection
  • Table 17: Active/Passive Component Distribution by System Subsection.
  • Table 18: Active Semiconductor/Component Vendor Distribution by System Subsection

EXHIBITS

  • Exhibit 1: BTS3900 DBS3900
  • Exhibit 2: BBU3900 BSBC Unit
  • Exhibit 3: DBS3900 Configurations (Star/Cascade)
  • Exhibit 4: BSBC Configuration for W-CDMA
  • Exhibit 5: BBU3900 Basic Configuration for WCDMA with cards
  • Exhibit 6: BBU3900 Full Configuration for WCDMA with cards
  • Exhibit 7: BSBC Chassis, Front View
  • Exhibit 8: BSBC Chassis, Top View
  • Exhibit 9: BSBC Chassis, Bottom View
  • Exhibit 10: BSBC Chassis, Left View
  • Exhibit 11: BSBC Chassis, Right View
  • Exhibit 12 : BSBC Chassis, Back View
  • Exhibit 13: BSBC Chassis, Back View with Back plate Cover Removed
  • Exhibit 14: Backplane Connector PCB, Top View
  • Exhibit 15: Backplane Connector PCB, Bottom View
  • Exhibit 16: Backplane Connector Component Diagram, Top View
  • Exhibit 17: Fan Unit Panel Identification
  • Exhibit 18: Fan Unit, Top View.
  • Exhibit 19: Fan Unit, Bottom View
  • Exhibit 20: Fan Unit, Right Side View
  • Exhibit 21: Fan Unit, Left Side View
  • Exhibit 22: Fan Unit Component Diagram
  • Exhibit 23: Fan Unit Cable Diagram
  • Exhibit 24: Fan Unit PCB, Top View, Component Diagram
  • Exhibit 25: Fan Unit PCB, Bottom View. Component Diagram
  • Exhibit 26: UPEU Panel Identification
  • Exhibit 27: UPEUc, Top View
  • Exhibit 28: UPEUc, Bottom View
  • Exhibit 29: UPEUc, Side View
  • Exhibit 30: UPEU Ethernet PCB, Top View
  • Exhibit 31: UPEU Ethernet PCB, Bottom View, Component Diagram
  • Exhibit 32: UPEU Main PCB with Heatsink (Top) and without (Bottom)
  • Exhibit 33: UPEU Main PCB, Top View
  • Exhibit 34: UPEU Main PCB, Bottom View
  • Exhibit 35: UPEU Main PCB Area A Component Diagram
  • Exhibit 36: UPEU Main PCB Area B Component Diagram
  • Exhibit 37: BBU3900 Basic Configuration for WCDMA with cards
  • Exhibit 38: WMPT Panel Identification
  • Exhibit 39: WMPT System Block Diagram
  • Exhibit 40: WMPT Board, Top View.
  • Exhibit 41: WMPT Board, Bottom View
  • Exhibit 42: WMPT Board, Top View without Heat Sinks and Front Panel
  • Exhibit 43: WMPT Board Top View Component Diagram
  • Exhibit 44: External GPS Cable
  • Exhibit 45: WBBPd1 Faceplate
  • Exhibit 46: WMPT Board Top View Area A Component Diagram
  • Exhibit 47: WMPT Board Bottom View Component Diagram
  • Exhibit 48: WBBPa Panel Identification
  • Exhibit 49: WBBPb Panel Identification
  • Exhibit 50: WBBPd Panel Identification
  • Exhibit 51: WBBPf Panel Identification
  • Exhibit 52: WBBPd1 System Block Diagram.
  • Exhibit 53: WBBP Board, Top View
  • Exhibit 54: WBBP Board Top View Component Diagram without Heat sinks
  • Exhibit 55: WBBP Board Bottom View Component Diagram
  • Exhibit 56: WBBPd1 Faceplate
  • Exhibit 57: Passive Component Case Size Distribution
  • Exhibit 58: Identified Passive Component Market Share by Vendor
  • Exhibit 59: Active Semiconductor Component Share.
  • Exhibit 60: High Pin Count IC vs. Discretes
  • Exhibit 61: Active Semiconductor Market Share by Vendor
  • Exhibit 62: High Pin Count (64+) Active Semiconductor Market Share by Vendor
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