株式会社グローバルインフォメーション
TEL: 044-952-0102
表紙
市場調査レポート

設計分析:Alcatel-Lucent の LTE 700MHz C Block TRDU 2x40W モデル KS24817L1

Alcatel-Lucent LTE 700MHz C Block TRDU 2x40W Model KS24817L1

発行 EJL Wireless Research 商品コード 292941
出版日 ページ情報 英文 94 Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=115.27円で換算しております。
Back to Top
設計分析:Alcatel-Lucent の LTE 700MHz C Block TRDU 2x40W モデル KS24817L1 Alcatel-Lucent LTE 700MHz C Block TRDU 2x40W Model KS24817L1
出版日: 2013年12月31日 ページ情報: 英文 94 Pages
概要

当レポートでは、Alcatel-Lucent社製のLTE基地局(eNodeB)プラットフォームの一部を構成している、LTE 700MHz C Block TRDU 2x40W モデル KS24817L1の設計について分析し、概略以下の構成でお届けします。

目次

エグゼクティブサマリー

  • 受動/能動素子のサマリー
  • 重要なメモ

第1章 ALCATEL-LUCENT の LTE BBU/RRU システム

  • BBU/RRU 製品サービスの概要

第2章 TRDUの機械分析

  • 機械分析
  • TRDU DC・RFケーブル

第3章 TRDU TRX ハウジング

第4章 デジタルプロセッサー・TRX PCB

  • エリアA:プロセッサー/CPRIインターフェース/DUC-DDC/CFR/DPD
  • エリアB:無線トランスミッター
  • エリアC:レシーバーA/Dコンバージョン
  • エリアD:レシーバー
  • エリアE:システムタイミング
  • エリアF:Txサンプリングサーキット
  • エリアG:トランシーバーサポート回路

第5章 LNA サブシステム

第6章 TDRU RF デュプレクサ-フィルターサブシステム

第7章 TDRU パワーアンプハウジング

  • パワーアンプRFシールド

第8章 TDRUパワーアンプサブシステム

第9章 TDRUパワーサプライサブシステム

  • パワーサプライエリアA
  • パワーサプライエリアB
  • パワーサプライエリアC
  • パワーサプライエリアD

付録A:受動素子の市場シェア/ケースサイズの分析

付録B:能動素子の市場シェアの分析

図表一覧

目次

This report covers the design analysis of an Alcatel-Lucent LTE 700MHz TRDU 2x40W unit. This unit is part of the LTE eNodeB platform for Alcatel-Lucent. The unit was manufactured in Q2 2009.

Key Findings:

  • The RF duplexer filters are integrated into the TRDU housing.
  • The unit is designed and manufactured by CommScope for Alcatel-Lucent.
  • TRDU is a comprised of two sub-systems (power amplifier & radio transceiver) that are mechanically and electrically connected

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Anaren Microwave, AVX, Coilcraft, Cypress Semiconductor, , Fairchild Semiconductor, Freescale Semiconductor, Hittite Microwave, International Rectifier, Integrated Device Technology, Linear Technology, Maxim Integrated Products, Micron, National Semiconductor, NXP Semiconductors, ON Semiconductor, s, STMicroelectronics, TDK-Epcos AG Texas Instruments, TriQuint Semiconductors and Vishay.

Features

  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description
  • Package Type
  • Total Pages: 94
  • Total Tables: 20
  • Total Exhibits: 93

Important Note: There is NO component pricing contained within the report.

Table of Contents

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: ALCATEL-LUCENT LTE BBU/RRU SYSTEM

  • Overview of BBU/RRU Product Offering

CHAPTER 2: TRDU MECHANICAL ANALYSIS

  • Mechanical Analysis
  • TRDU DC and RF Cables

CHAPTER 3: TRDU TRX HOUSING

CHAPTER 4: DIGITAL PROCESSOR AND TRX PCB

  • Area A: Processor/CPRI Interface/DUC-DDC/CFR/DPD
  • Area B: Radio Transmitter
  • Area C: Receiver A/D Conversion
  • Area D: Receiver
  • Area E: System Timing
  • Area F: Tx Sampling Circuit
  • Area G: Transceiver Support Circuitry

CHAPTER 5: LNA SUBSYSTEM

CHAPTER 6: TRDU RF DUPLEXER FILTER SUBSYSTEM

CHAPTER 7: TRDU POWER AMPLIFIER HOUSING

  • Power Amplifier RF Shield

CHAPTER 8: TRDU POWER AMPLIFIER SUBSYSTEM

CHAPTER 9: TRDU POWER SUPPLY SUBSYSTEM

  • Power Supply Area A
  • Power Supply Area B
  • Power Supply Area C
  • Power Supply Area D

APPENDIX A - PASSIVE COMPONENT MARKET SHARE/CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

  • Table 1: TRDU Cables/Connectors Bill of Materials
  • Table 2: Area A Bill of Materials
  • Table 3: Area B Bill of Materials
  • Table 4: Area E Bill of Materials
  • Table 5: Area F1 Bill of Materials
  • Table 6: Area F2 Bill of Materials
  • Table 7: Area G Bill of Materials
  • Table 8: LNA Area A Bill of Materials
  • Table 9: LNA Area B Bill of Materials
  • Table 10: Power Amplifier Bill of Materials
  • Table 11: Power Amplifier Output Stage Bill of Materials
  • Table 12: Power Amplifier Drive Stage Bill of Materials
  • Table 13: Power Supply Area A Bill of Materials
  • Table 14: Power Supply Area B Bill of Materials
  • Table 15: Power Supply Area C Bill of Materials
  • Table 16: Power Supply Area D Bill of Materials
  • Table 17: Passive Component Case Size Distribution by System Subsection
  • Table 18: Identified Passive Component Supplier Distribution by System Subsection
  • Table 19: Active/Passive Component Distribution by System Subsection
  • Table 20: Active Semiconductor/Component Vendor Distribution by System Subsection

EXHIBITS

  • Exhibit 1: Alcatel-Lucent 9914 LTE eNodeB System
  • Exhibit 2: Alcatel-Lucent TRDU System Block Diagram
  • Exhibit 3: Alcatel-Lucent 9926 V2 d2U
  • Exhibit 4: TRDU Connection Interfaces
  • Exhibit 5: TRDU Front View
  • Exhibit 6: TRDU Back View
  • Exhibit 7: TRDU, Side View
  • Exhibit 8: TRDU, Top View
  • Exhibit 9: TRDU, Bottom View
  • Exhibit 10: Faceplate, External View
  • Exhibit 11: Faceplate, Internal View
  • Exhibit 12: Backplate, External View
  • Exhibit 13: Backplate, Internal View
  • Exhibit 14: TRDU Housing, TRx (L) and Power Amplifier (R)
  • Exhibit 15: RF Coaxial Cable, RF Power Amplifier/RF Receiver to Transceiver
  • Exhibit 16: RF Coaxial Cable, RF Power Amplifier to Duplexer Filter
  • Exhibit 17: Ribbon Cables
  • Exhibit 18: DC Power Cables
  • Exhibit 19: TRDU Cables/Connectors Location Diagram, Transceiver
  • Exhibit 20: TRDU Cables/Connectors Location Diagram, Power Amplifier
  • Exhibit 21: TRDU Cables/Connectors System Block Diagram
  • Exhibit 22: TRDU TRx Housing, Top
  • Exhibit 23: TRDU TRx Housing, Bottom
  • Exhibit 24: TRx RF Shield, External View
  • Exhibit 25: TRx RF Shield, Internal View
  • Exhibit 26: TRDU Digital Processor/TRX PCB, Top View
  • Exhibit 27: TRDU Digital Processor/TRX PCB, Bottom View
  • Exhibit 28: Area A Component Diagram
  • Exhibit 29: Area B Component Diagram
  • Exhibit 30: Area B Block Diagram
  • Exhibit 31: Area C Component Diagram
  • Exhibit 32: Area D1 & Area D2
  • Exhibit 33: Area D Component Diagram
  • Exhibit 34: Area D2 Block Diagram
  • Exhibit 35: Area E Component Diagram
  • Exhibit 36: Area F1 Component Diagram
  • Exhibit 37: Area F2 Component Diagram
  • Exhibit 38: Area F1 & F2 Block Diagram
  • Exhibit 39: Area G Component Diagram
  • Exhibit 40: LNA Subsystem Location
  • Exhibit 41: LNA Subsystem Location with TRx PCB Removed
  • Exhibit 42: LNA RF Shield, External View
  • Exhibit 43: RF Shield, External View
  • Exhibit 44: LNA PCB Location
  • Exhibit 45: LNA PCB/RF Shield Location with LNA PCB Removed
  • Exhibit 46: LNA PCB Dimensions
  • Exhibit 47: LNA Port RF Paths
  • Exhibit 48: LNA Areas A & B
  • Exhibit 49: LNA Area A Component Diagram
  • Exhibit 50: LNA Area A Block Diagram
  • Exhibit 51: LNA Area B Component Diagram
  • Exhibit 52: LNA Area B Block Diagram
  • Exhibit 53: TRDU RF Duplexer Filters
  • Exhibit 54: RF Duplexer Shield Dimensions
  • Exhibit 55: RF Duplexer Shield, Top View
  • Exhibit 56: RF Duplexer Shield, Bottom View
  • Exhibit 57: RF Duplexer Filters, Tx and Rx Filters
  • Exhibit 58: RF Duplexer Filter Tx and Rx Paths
  • Exhibit 59: RF Duplexer Filter Resonator Types
  • Exhibit 60: Rx Filter Resonator Coupler Locations
  • Exhibit 61: Rx Filter Coupler Location, Close Up View
  • Exhibit 62: Resonator Type A & B, Top and Bottom Views
  • Exhibit 63: Resonator Type A & B, Side View
  • Exhibit 64: Power Amplifier Housing, Top View
  • Exhibit 65: Power Amplifier Housing, Bottom View
  • Exhibit 66: Power Amplifier Housing without PCBs, Top View
  • Exhibit 67: Power Amplifier RF Shield, External View
  • Exhibit 68: Power Amplifier RF Shield, Internal View
  • Exhibit 69: RF Power Amplifier Block Diagram
  • Exhibit 70: RF Power Amplifier Exploded, Side View
  • Exhibit 71: TRDU Power Amplifiers
  • Exhibit 72: TRDU RF Power Amplifier Component Diagram
  • Exhibit 73: TRDU RF Power Amplifier Component Diagram 2
  • Exhibit 74: TRDU RF Power Amplifier PCB, Top View
  • Exhibit 75: TRDU RF Power Amplifier PCB, Bottom View
  • Exhibit 76: TRDU Driver Stage Amplifier Pallet, Top View
  • Exhibit 77: TRDU Driver Stage Amplifier Pallet, Bottom View
  • Exhibit 78: TRDU Output Stage Amplifier Pallet, Top View
  • Exhibit 79: TRDU Output Stage Amplifier Pallet, Bottom View
  • Exhibit 80: TRDU Power Supply Location
  • Exhibit 81: TRDU Power Supply Dimensions
  • Exhibit 82: Power Supply PCB, Top View
  • Exhibit 83: Power Supply PCB, Bottom View
  • Exhibit 84: Power Supply Area A Component Diagram
  • Exhibit 85: Power Supply Area B Component Diagram
  • Exhibit 86: Power Supply Area C Component Diagram
  • Exhibit 87: Power Supply Area D Component Diagram
  • Exhibit 88: Passive Component Case Size Distribution
  • Exhibit 89: Identified Passive Component Market Share by Vendor
  • Exhibit 90: Active Semiconductor Component Share
  • Exhibit 91: High Pin Count IC vs. Discretes
  • Exhibit 92: Active Semiconductor Market Share by Vendor
  • Exhibit 93: High Pin Count (64+) Active Semiconductor Market Share by Vendor
Back to Top