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設計分析:EricssonのベースバンドユニットKDU 137 533/4 R1・モデルDUG20 01

Ericsson LTE Baseband Unit KDU 137 533/4 R1F Model DUL 20 01

発行 EJL Wireless Research 商品コード 269582
出版日 ページ情報 英文 38 Pages
納期: 即日から翌営業日
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設計分析:EricssonのベースバンドユニットKDU 137 533/4 R1・モデルDUG20 01 Ericsson LTE Baseband Unit KDU 137 533/4 R1F Model DUL 20 01
出版日: 2013年04月26日 ページ情報: 英文 38 Pages
概要

当レポートでは、Ericsson社のLTE向け基地局プラットフォームRBS610x/6201/6301/6601を構成するLTEベースバンドデジタルユニットについて設計分析を提供しており、概略下記の構成でお届けいたします。

エグゼクティブサマリー

  • アクティブ/パッシブコンポーネントのサマリー
  • 重要な注記:

第1章 ERICSSONのRBS6000 BTSシステム

  • RBS6101/6102/6201/6202/6301/6601製品の概要

第2章 DULの機械分析

  • 機械分析

第3章 ベースバンドプロセッシング/CPRI/インターフェースボードサブシステム

  • 半導体用ヒートシンク

付録A:パッシブケースサイズ分析

付録B:アクティブコンポーネントの市場シェア分析

目次

This report covers the design analysis of an Ericsson LTE baseband digital unit. This unit is part of the RBS610x/6201/6301/6601 base station platform for Ericsson LTE. The unit was manufactured in Q1 2012.

Component and semiconductor suppliers mentioned in this report include:
Analog Devices, Broadcom, Ericsson, ETAL Group, Fairchild Semiconductor, Freescale Semiconductor, Infineon Technologies, Integrated Device Technology, Kemet, Lattice Semiconductor, Maxim Integrated Products, Micron Technology, Nichicon, Nihon Denpa Kogyo, NXP Semiconductors, ON Semiconductor, Panasonic, Pulse Engineering, Rakon, Sanyo Electric, STMicroelectronics, TDK-Epcos, Texas Instruments, Vishay Semiconductors.

Features:

  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description
  • Package Type
  • Total Pages: 38
  • Total Tables: 7
  • Total Exhibits: 41

Important Note: There is NO component pricing contained within the report.

Table of Contents

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM

  • Overview of RBS6101/6102/6201/6202/6301/6601 Product Offering

CHAPTER 2: DUL MECHANICAL ANALYSIS

  • Mechanical Analysis

CHAPTER 3: BASEBAND PROCESSING/CPRI/INTERFACE BOARD SUBSYSTEM

  • Semiconductor Heat Sinks

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

  • Table 1: DUL PCB Top Area A1 Bill of Materials
  • Table 2: DUL PCB Top Area A2 Bill of Materials
  • Table 3: DUL PCB Bottom Area B Bill of Materials
  • Table 4: Passive Component Case Size Distribution by System Subsection
  • Table 5: Identified Passive Component Supplier Distribution by System Subsection
  • Table 6: Active/Passive Component Distribution by System Subsection
  • Table 7: Active Semiconductor/Component Vendor Distribution by System Subsection

EXHIBITS

  • Exhibit 1: Ericsson RBS620x Macro Cell Indoor BTS System
  • Exhibit 2: Ericsson DUL System Block Diagram
  • Exhibit 3: DUL Unit, Front
  • Exhibit 4: DUL Unit, Back
  • Exhibit 5: DUL Unit, Left Side
  • Exhibit 6: DUL Unit, Top
  • Exhibit 7: DUL Unit, Bottom
  • Exhibit 8: DUL Top Shield, External View
  • Exhibit 9: DUL Top Shield, Internal View
  • Exhibit 10: DUL Bottom Shield, External View
  • Exhibit 11: DUL Bottom Shield, Internal View
  • Exhibit 12: DUL Bottom Shield, Front View
  • Exhibit 13: DUL Bottom Shield, Rear View
  • Exhibit 14: DUL 20 01 System, Exploded Side View
  • Exhibit 15: DUL PCB. Top View
  • Exhibit 16: DUL Baseband Processing/CPRI/Interface PCB Top, Area A
  • Exhibit 17: DUL Baseband Processing PCB Bottom, Area B
  • Exhibit 18: DUL PCB Top Area A1 Component Diagram
  • Exhibit 19: DUL PCB Top Area A2 Component Diagram
  • Exhibit 20: DUL Baseband Processing/CPRI/Interface Block Diagram
  • Exhibit 21: DUL PCB Bottom Area B Component Diagram
  • Exhibit 22: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Front View
  • Exhibit 23: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Side View
  • Exhibit 24: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Bottom View.
  • Exhibit 25: Semiconductor IC Heat Sink Dimensions, 27mm
  • Exhibit 26: Semiconductor IC Heat Sink Dimensions, 35mm
  • Exhibit 27: Semiconductor IC Heat Sink Dimensions, 41mm
  • Exhibit 28: Passive Component Case Size Distribution
  • Exhibit 29: Identified Passive Component Market Share by Vendor
  • Exhibit 30: Active Semiconductor Component Share.
  • Exhibit 31: High Pin Count IC vs. Discretes
  • Exhibit 32: Active Semiconductor Market Share by Vendor
  • Exhibit 33: High Pin Count (64+) Active Semiconductor Market Share by Vendor
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