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設計分析:EricssonのGSMベースバンドユニットKDU 137 569/1 R2B・モデルDUG20 01

Ericsson GSM Baseband Unit, KDU 137 569/1 R2B, Model DUG20 01

発行 EJL Wireless Research 商品コード 259992
出版日 ページ情報 英文 38 Pages
納期: 即日から翌営業日
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設計分析:EricssonのGSMベースバンドユニットKDU 137 569/1 R2B・モデルDUG20 01 Ericsson GSM Baseband Unit, KDU 137 569/1 R2B, Model DUG20 01
出版日: 2013年01月18日 ページ情報: 英文 38 Pages
概要

当レポートでは、Ericsson社のGSM/EDGE向け基地局プラットフォームRBS610x/6201/6301/6601を構成するGSM/EDGEベースバンドデジタルユニットについて設計分析を提供しており、概略下記の構成でお届けいたします。

エグゼクティブサマリー

  • サマリー:能動素子・受動素子
  • 重要注記

第1章 ERICSSONのRBS6000 BTSシステム

  • RBS6101/6102/6201/6202/6301/6601製品の概要

第2章 DUWの機械分析

  • 機械分析

第3章 ベースバンドプロセッシングボードサブシステム

  • 半導体用ヒートシンク

付録A:パッシブケースサイズ分析

付録B:能動素子の市場シェア分析

目次

This report covers the design analysis of an Ericsson GSM/EDGE baseband digital unit. This unit is part of the RBS610x/6201/6301/6601 base station platform for Ericsson GSM/EDGE. The unit was manufactured in Q1 2012.

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Bourns, Broadcom, Clare, Ericsson, Fairchild Semiconductor, Hynix, Infineon Technologies, Integrated Device Technology, Kemet, Lantiq, Lattice Semiconductor, Maxim Integrated Products, Micron Technology, Nihon Denpa Kogyo, Nichicon, NXP Semiconductors, ON Semiconductor, Pulse Electronics, Rakon, Sanyo Electric, STMicroelectronics, TDK-Epcos, Texas Instruments, Vishay Semiconductors.

Features:

  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description
  • Package Type
  • Total Pages: 38
  • Total Tables: 8
  • Total Exhibits: 31

SAMPLE

Exhibit 1: DUG PCB. Top View

Source: EJL Wireless Research LLC (January 2013)

Table of Contents

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM

  • Overview of RBS6101/6102/6201/6202/6301/6601 Product Offering

CHAPTER 2: DUG MECHANICAL ANALYSIS

  • Mechanical Analysis

CHAPTER 3: BASEBAND PROCESSING BOARD SUBSYSTEM

  • Semiconductor Heat Sinks

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

  • Table 1: DUG Baseband Processor PCB Top Area A Bill of Materials
  • Table 2: DUG Baseband Processor PCB Top Area B1 Bill of Materials
  • Table 3: DUG Baseband Processor PCB Top Area B2 Bill of Materials
  • Table 4: DUG Baseband Processor PCB Bottom Area C Bill of Materials
  • Table 5: Passive Component Case Size Distribution by System Subsection
  • Table 6: Identified Passive Component Supplier Distribution by System Subsection
  • Table 7: Active/Passive Component Distribution by System Subsection
  • Table 8: Active Semiconductor/Component Vendor Distribution by System Subsection

EXHIBITS

  • Exhibit 1: Ericsson RBS620x Macro Cell Indoor BTS System
  • Exhibit 2: Ericsson DUG System Block Diagram
  • Exhibit 3: DUG Unit, Front
  • Exhibit 4: DUG Unit, Back
  • Exhibit 5: DUG Unit, Right Side
  • Exhibit 6: DUG Unit, Left Side
  • Exhibit 7: DUG Unit, Top
  • Exhibit 8: DUG Unit, Bottom
  • Exhibit 9: DUG Top Shield, External View
  • Exhibit 10: DUG Top Shield, Internal View
  • Exhibit 11: DUG Bottom Shield, External View
  • Exhibit 12: DUG Bottom Shield, Internal View
  • Exhibit 13: DUG Bottom Shield, Front View
  • Exhibit 14: DUG Bottom Shield, Rear View
  • Exhibit 15: DUG 20 01 System, Exploded Side View
  • Exhibit 16: DUG PCB. Top View
  • Exhibit 17: DUG Baseband Processing PCB Top, Areas A and B
  • Exhibit 18: DUG Baseband Processing PCB Bottom, Area C
  • Exhibit 19: DUG Baseband Processing PCB Component Diagram, Top View
  • Exhibit 20: DUG Baseband Processing PCB Area B
  • Exhibit 21: DUG Baseband Processing PCB Area B1 Component Diagram
  • Exhibit 22: DUG Baseband Processing PCB Area B2 Component Diagram
  • Exhibit 23: DUG Baseband Processing Block Diagram
  • Exhibit 24: DUG Baseband Processing PCB Area C Component Diagram
  • Exhibit 25: Semiconductor IC Heat Sink Dimensions, 41mm
  • Exhibit 26: Passive Component Case Size Distribution
  • Exhibit 27: Identified Passive Component Market Share by Vendor
  • Exhibit 28: Active Semiconductor Component Share
  • Exhibit 29: High Pin Count IC vs. Discretes
  • Exhibit 30: Active Semiconductor Market Share by Vendor
  • Exhibit 31: High Pin Count (64+) Active Semiconductor Market Share by Vendor
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