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設計分析:Ericsson W-CDMA/HSPA ベースバンドユニット・KDU 127 161/3 R3C・DUW 30 01モデル

Ericsson W-CDMA/HSPA Baseband Unit, KDU 127 161/3 R3C, Model DUW 30 01

発行 EJL Wireless Research 商品コード 256146
出版日 ページ情報 英文 50 Pages
納期: 即日から翌営業日
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設計分析:Ericsson W-CDMA/HSPA ベースバンドユニット・KDU 127 161/3 R3C・DUW 30 01モデル Ericsson W-CDMA/HSPA Baseband Unit, KDU 127 161/3 R3C, Model DUW 30 01
出版日: 2012年11月28日 ページ情報: 英文 50 Pages
概要

当レポートでは、Ericsson社のW-CDMA向け基地局プラットフォーム部品であるW-CDMA/HSPA+ベースバンドデジタルユニットについて設計分析を提供しており、概略下記の構成でお届けいたします。

エグゼクティブサマリー

第1章 ERICSSONのRBS6000 BTSシステム

  • RBS6101/6102/6201/6202/6301/6601 製品の概要

第2章 DUW の機械分析

  • 機械分析

第3章 ベースバンドプロセッシングボードサブシステム

  • 半導体用ヒートシンク

第4章 ボードプロセッサー・RF/IFインターフェースボードシステム

  • 半導体用ヒートシンク

付録A:パッシブケースサイズ分析

付録B:アクティブコンポーネントの市場シェア・分析

目次

Abstract

This report covers the design analysis of an Ericsson W-CDMA/HSPA+ baseband digital unit. This unit is part of the RBS610x/6201/6301/6601 base station platform for Ericsson W-CDMA. The unit was manufactured in Q2 2011.

Component and semiconductor suppliers mentioned in this report include:

Analog Devices, Bourns, Broadcom, Coilcraft, Epson-Toyocom, ETAL Fairchild Semiconductor, Freescale Semiconductor, Hynix, Infineon Technologies, Integrated Device Technology, Lantiq, lattice Semiconductor, LSI Logic, Maxim Integrated Products, Micron Technology, National Semiconductor, Nihon Denpa Kogyo, Nippon Chemi-Con, NXP Semiconductors, ON Semiconductor, PMC-Sierra, Panasonic, Pulse Engineering, Rakon, Sanyo Electric, Semtech, Spansion, STMicroelectronics, TDK-Epcos, Texas Instruments, Vishay Semiconductors & Xilinx.

Features:

  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description
  • Package Type
  • Total Pages: 50
  • Total Tables: 8
  • Total Exhibits: 39

Table of Contents

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM

  • Overview of RBS6101/6102/6201/6202/6301/6601 Product Offering

CHAPTER 2: DUW MECHANICAL ANALYSIS

  • Mechanical Analysis

CHAPTER 3: BASEBAND PROCESSING BOARD SUBSYSTEM

  • Semiconductor Heat Sinks

CHAPTER 4: BOARD PROCESSOR AND RF/IF INTERFACE BOARD SUBSYSTEM

  • Semiconductor Heat Sinks

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

  • Table 1: DUW Baseband Processor PCB Top Bill of Materials
  • Table 2: DUW Baseband Processor PCB Bottom Bill of Materials
  • Table 3: DUW Board Processor and RF/IF Top Bill of Materials
  • Table 4: DUW Board Processor and RF/IF Bottom Bill of Materials
  • Table 5: Passive Component Case Size Distribution by System Subsection
  • Table 6: Identified Passive Component Supplier Distribution by System Subsection
  • Table 7: Active/Passive Component Distribution by System Subsection
  • Table 8: Active Semiconductor/Component Vendor Distribution by System Subsection

EXHIBITS

  • Exhibit 1: Ericsson RBS620x Macro Cell Indoor BTS System
  • Exhibit 2: Ericsson DUW System Block Diagram.
  • Exhibit 3: DUW Unit, Front
  • Exhibit 4: DUW Unit, Back
  • Exhibit 5: DUW Unit, Side
  • Exhibit 6: DUW Unit, Top
  • Exhibit 7: DUW Unit, Bottom
  • Exhibit 8: DUW Frame, Top View
  • Exhibit 9: DUW Frame, Bottom View
  • Exhibit 10: DUW Frame, Rear View
  • Exhibit 11: DUW Top Shield, External View
  • Exhibit 12: DUW Top Shield, Internal View
  • Exhibit 13: DUW Bottom Shield, External View
  • Exhibit 14: DUW Bottom Shield, Internal View.
  • Exhibit 15: DUW Bottom Shield, Rear View
  • Exhibit 16: DUW 30 System, Exploded Side View
  • Exhibit 17: DUW Processor PCB. Top View.
  • Exhibit 18: DUW Baseband Processing PCB Component Diagram 1, Top View
  • Exhibit 19: DUW Baseband Processing PCB Component Diagram 2, Top View
  • Exhibit 20: DUW Baseband Processing PCB Component Diagram, Bottom View
  • Exhibit 21: DUW Baseband Processing Block Diagram.
  • Exhibit 22: Semiconductor IC Heat Sink Dimensions (23mm, 27mm, 35mm)
  • Exhibit 23: Semiconductor IC Heat Sink Dimensions, 27mm
  • Exhibit 24: Semiconductor IC Heat Sink Dimensions, 35mm
  • Exhibit 25: DUW Board Processor and RF/IF PCB. Top View
  • Exhibit 26: DUW Board Processor and RF/IF PCB. Top View Component Diagram 1
  • Exhibit 27: DUW Board Processor and RF/IF PCB. Top View Component Diagram 1
  • Exhibit 28: DUW Board Processor and RF/IF Block Diagram
  • Exhibit 29: Baseband to RF/IF Connection.
  • Exhibit 30: DUW Board Processor and RF/IF PCB. Bottom View Component Diagram.
  • Exhibit 31: Semiconductor IC Heat Sink Dimensions (23mm, 27mm, 35mm)
  • Exhibit 32: Semiconductor IC Heat Sink Dimensions, 35mm
  • Exhibit 33: Semiconductor IC Heat Sink Dimensions, 41mm
  • Exhibit 34: Passive Component Case Size Distribution
  • Exhibit 35: Identified Passive Component Market Share by Vendor
  • Exhibit 36: Active Semiconductor Component Share
  • Exhibit 37: High Pin Count IC vs. Discretes
  • Exhibit 38: Active Semiconductor Market Share by Vendor
  • Exhibit 39: High Pin Count (64+) Active Semiconductor Market Share by Vendor.
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