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設計分析:Ericssonの GSM/EDGE 900MHz DRU(Double Radio Unit)

Ericsson DRU GSM/EDGE 900MHz Model KRC 161094/1 R3D

発行 EJL Wireless Research 商品コード 116925
出版日 ページ情報 英文 69 Pages
納期: 即日から翌営業日
価格
こちらの商品の販売は終了いたしました。
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設計分析:Ericssonの GSM/EDGE 900MHz DRU(Double Radio Unit) Ericsson DRU GSM/EDGE 900MHz Model KRC 161094/1 R3D
出版日: 2010年04月02日 ページ情報: 英文 69 Pages

当商品の販売は、2016年07月01日を持ちまして終了しました。

概要

当レポートでは、EricssonのRBS2x16 GSM基地局プラットフォームの一部である GSM900MHz無線トランシーバーユニットについて設計分析を提供しており、概略下記の構成でお届けします。

エグゼクティブサマリー

第1章 RBS 2X16システム

  • Ericsson RBS 2x16 および DRUの概要

第2章 機械分析

  • 機械分析

第3章 DRUトランシーバーシステム

  • Area A: Transceiver Power Management
  • Area B: Transceiver Baseband Processing
  • Area C: Connectors
  • Area D: A/D Conversion
  • Area E: Receiver
  • Area E1: Receiver Input/Output Switch Combiner Matrix
  • Area E2: Receiver 1 / 2 RF Filtering/Down Conversion
  • Area E3: Receiver VCO Section
  • Area E4: Receiver IF Section
  • Area F: Transmitter Path 1
  • Area G: Transmitter Path 2
  • Area H: RF Power Amplifier Power Management
  • Area I1: RF Power Amplifier 1
  • Area I2: RF Power Amplifier 2
  • RYT 902 6062/10 R1A
  • RYT 902 6062/3 R1B

第4章 RFデュプレクサーフィルター

付録A:パッシブケースサイズ分析

付録B:アクティブコンポーネント市場シェア分析

図表

目次

Design Analysis Ericsson GSM900MHz DRU Double Radio Unit

This report covers the design analysis of an Ericsson GSM900MHz radio transceiver unit. This unit is part of the RBS2x16 GSM base station platform. The unit was manufactured in Q3 2008.

Component and semiconductor suppliers mentioned in this report include: Aeroflex, Analog Devices, Anaren Microwave, Bourns, Epcos AG, ETAL, Fairchild Semiconductor, Freescale Semiconductor, Infineon Technologies, International Rectifier, Kemet, Maxim Integrated Products, Murata Electronics Co., Ltd., National Semiconductor, NDK, NXP Semiconductors, ON Semiconductor, Pulse Engineering, Skyworks Solutions, STMicroelectronics, Texas Instruments, TriQuint Semiconductor, and Vishay Siliconix.

Features

  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description
  • Package Type

Table of Contents

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: RBS 2X16 SYSTEM

  • 1.1 Overview of Ericsson RBS 2x16 and DRU

CHAPTER 2: MECHANICAL ANALYSIS

  • 2.1 Mechanical Analysis

CHAPTER 3: DRU TRANSCEIVER SYSTEM

  • Area A: Transceiver Power Management
  • Area B: Transceiver Baseband Processing
  • Area C: Connectors
  • Area D: A/D Conversion
  • Area E: Receiver
    • Area E1: Receiver Input/Output Switch Combiner Matrix
    • Area E2: Receiver 1 / 2 RF Filtering/Down Conversion
    • Area E3: Receiver VCO Section
    • Area E4: Receiver IF Section
  • Area F: Transmitter Path 1
  • Area G: Transmitter Path 2
  • Area H: RF Power Amplifier Power Management
  • Area I1: RF Power Amplifier 1
  • Area I2: RF Power Amplifier 2
    • RYT 902 6062/10 R1A
    • RYT 902 6062/3 R1B

CHAPTER 4: RF DUPLEXER FILTERS

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

  • Table 1: Area A Bill of Materials
  • Table 2: Area B Bill of Materials
  • Table 3: Area C Bill of Materials
  • Table 4; Area D Bill of Materials
  • Table 5: Area E1 Bill of Materials
  • Table 6: Area E2 Bill of Materials
  • Table 7: Area E3 Bill of Materials
  • Table 8: Area E4 Bill of Materials
  • Table 9: Area F Bill of Materials
  • Table 10: Area G Bill of Materials
  • Table 11: Area H Bill of Materials
  • Table 12: Area I1 Bill of Materials
  • Table 13: Area I2 Bill of Materials
  • Table 14: RYT 902 6062/10 R1A Bill of Materials
  • Table 15: RYT 902 6062/3 R1B Bill of Materials
  • Table 16: RF Duplexer Filter Protection Circuit Bill of Materials
  • Table 17: Passive Component Case Size Distribution by System Subsection
  • Table 18: Identified Passive Component Supplier Distribution by System Subsection
  • Table 19: Active/Passive Component Distribution by System Subsection
  • Table 20: Active Semiconductor Vendor Distribution by System Subsection

EXHIBITS

  • Exhibit 1: dTRU vs. DRU Integration within RBS2000 BTS Platform
  • Exhibit 2: RBS 2x16 Radio System Block Diagram
  • Exhibit 3: DRU Block Diagram
  • Exhibit 4: DRU Faceplate Layout and Dimensions
  • Exhibit 5: DRU Front and Rear View
  • Exhibit 6: DRU Top Side and Bottom Side View
  • Exhibit 7: Top View of DRU with RF Duplexer Filter
  • Exhibit 8: DRU Heat Sink Mechanical Dimensions, Side View
  • Exhibit 9: DRU Heat Sink, Top View
  • Exhibit 10: DRU Heat Sink, Bottom View
  • Exhibit 11: DRU Transceiver System Printed Circuit Board (Top View)
  • Exhibit 12: DRU Transceiver System Printed Circuit Board (Bottom View)
  • Exhibit 13: Area A Component Diagram
  • Exhibit 14: Area B Component Diagram
  • Exhibit 15: Area C Component Diagram
  • Exhibit 16: Area D Component Diagram
  • Exhibit 17: Area E Diagram
  • Exhibit 18: DRU Receiver Block Diagram
  • Exhibit 19: Area E1 Component Diagram
  • Exhibit 20: DRU Capacity Configurations
  • Exhibit 21: DRU Coverage Configurations
  • Exhibit 22: Area E2 Component Diagram
  • Exhibit 23: Area E3 Component Diagram
  • Exhibit 24: Area E4 Component Diagram
  • Exhibit 25: RF Transmit Path Block Diagram
  • Exhibit 26: Area F Component Diagram
  • Exhibit 27: Area G Component Diagram
  • Exhibit 28: Area H Component Diagram
  • Exhibit 29: RF Power Amplifier Tx Chain Block Diagram
  • Exhibit 30: RF Output Circuit, Separate Output Configuration
  • Exhibit 31: RF Output Circuit, Power Combiner Configuration
  • Exhibit 32: RF Output Module w/PCB Inserted, Top and Bottom Views
  • Exhibit 33: RF Output Module w/PCB Removed, Top and Bottom Views
  • Exhibit 34: PCB Circuit, Top and Bottom View
  • Exhibit 35: Area I1 Component Diagram
  • Exhibit 36: Area I2 Component Diagram
  • Exhibit 37: RYT 902 6062/10 R1A Component Diagram
  • Exhibit 38: RYT 902 6062/10 R1A Component Diagram
  • Exhibit 39: DRU RF Shield and Duplexer Input/Output Locations
  • Exhibit 40: RF Duplexer Filter Cover, Top View
  • Exhibit 41: RF Duplexer Filter Cover, Bottom View
  • Exhibit 42: Duplexer Filter RF Paths
  • Exhibit 43: RF Duplexer Filter Input Protection Component Diagram
  • Exhibit 44: Passive Component Case Size Distribution
  • Exhibit 45: Identified Passive Component Market Share by Vendor
  • Exhibit 46: Active Semiconductor Component Share
  • Exhibit 47: Active Semiconductor Market Share by Vendor
  • Exhibit 48: High Pin Count (64+) Active Semiconductor Market Share by Vendor
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