Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013 to 2020 Vol II: On-Chip and Chip-to-Chip
|発行||Communications Industry Researchers (CIR)||商品コード||278633|
|光インターコネクトの収益機会：市場・技術予測-オンチップおよびチップツーチップ Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013 to 2020 Vol II: On-Chip and Chip-to-Chip|
|出版日: 2013年08月31日||ページ情報: 英文||
The traditional architectural and material assumptions with regard to how integrated circuits are fabricated have been challenged in recent years and the semiconductor industry is looking for new solutions. Power and thermal issues add to this apparent crisis in the semiconductor industry.
One of the most important problems is the so-called "interconnect bottleneck," that is the tendency for data traffic jams to appear both on-chip and chip-to-chip. The interconnect bottleneck is emerging well before Moore's Law completely runs out of steam, but reappears in differing forms in some of the new architectures designed to make chip scaling easier.
The "obvious" solution is to deploy fiber optics; which is usually the way to go whenever and wherever there is a bandwidth problem. But fiber optic solutions to on-chip and chip-to-chip interconnection is something that will be hard to develop for commercial chip products. Producing photonic devices that are small enough and inexpensive enough to be used at the chip level is an immensely difficult requirement.
In this report, we analyze the latest developments in optical interconnection at the chip level and the progress in this area that is being made by important research teams throughout the world. Both R&D and commercial development are discussed.
The report looks at this issue from the perspective of classic CPU chips as well as the latest architectures, and the opportunities for optical interconnection are compared to a possible future for metal interconnects and interconnect alternatives that are even more exotic than photonics; carbon nanotubes, especially.
The report also contains a 10-year roadmap that explains where and when the commercial opportunities for optical interconnection at the chip level will emerge and how much they will be worth. We also profile the leading firms and research efforts involved in designing and implementing on-chip and chip-to-chip optical interconnection.