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表紙:高速銅および光ファイバーコネクタ
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971178

高速銅および光ファイバーコネクタ

High-Speed Copper & Fiber Optic Connectors

出版日: | 発行: Bishop & Associates, Inc. | ページ情報: 英文 234 Pages | 納期: お問合せ

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高速銅および光ファイバーコネクタ
出版日: 2020年11月16日
発行: Bishop & Associates, Inc.
ページ情報: 英文 234 Pages
納期: お問合せ
  • 全表示
  • 概要
  • 目次
概要

当レポートは世界の高速銅および光ファイバーコネクタについて調査しており、技術概要や進化、代替技術、用途、市場推計や予測などの情報を提供しています。

目次

第1章 調査範囲と調査手法

第2章 エグゼクティブサマリー

  • デバイスあたりの世界の平均IPトラフィック

第3章 イントロダクション

  • イントロダクション
  • 銅配線技術
  • 光相互接続技術
  • 光伝送の基本原理
  • 光ファイバタイプ
  • ファイバータイプと代表的な仕様
  • 光ファイバコネクタの損失特性
  • 光コネクタタイプ
  • 銅コネクタの終端処理
  • 光コネクタの終了プロセス

第4章 高速銅配線の進化

  • 銅の帯域幅の拡張
  • 先進シグナルコンディショニング
  • 高速信号の測定と検証
  • 先進信号変調技術
  • 進化する高性能コネクタの動向

第5章 光ファイバーコネクタの進化

  • 光ファイバコネクタの基本
  • シングルファイバーコネクタ
  • マルチファイバーコネクタ
  • 光ファイバアダプタ、専用インターフェース
  • 光バックプレーンコネクタ
  • 耐環境型光コネクタ

第6章 SFPトランシーバ

  • なぜプラガブル?
  • 熱管理

第7章 アクティブ光ケーブル

  • ギャップの解消
  • AOCの構築/機能
  • AOCアプリケーション
  • 代表的なAOCメーカーと製品

第8章 ボックス内光学部品ケース

  • 銅の限界
  • 銅ジャンプオーバーケーブルアセンブリ
  • 光オンボードマウントトランシーバーおよびケーブルアセンブリ
  • オンボードオプティクスのメリットとトレードオフ

第9章 光配線の業界標準

  • 進化する標準
  • FOCIS標準
  • TIA/EIA/IEC規格
  • SONET
  • Ethernet
  • OIF実装契約
  • COBO

第10章 銅線またはファイバーの決定

  • 要因と選択
  • 機能と要件のバランスを取る

第11章 先進銅線および光ファイバー技術

  • 先進銅伝送技術
  • 先進光ファイバ伝送技術
  • シリコンフォトニクス
  • 共同パッケージ光学

第12章 代替技術

  • ワイヤレス伝送
  • 低電力/短距離RFデータリンク
  • 携帯電話
  • Wi-Fi
  • ミリ波相互接続技術
  • プラスチックmm導波管

第13章 新たな銅およびファイバーの用途

  • イントロダクション
  • 5Gセルラー通信
  • モノのインターネット(IoT)/産業用モノのインターネット(インダストリー4.0)
  • ハイパースケールデータセンター/クラウドコンピューティング/ディスアグリゲーション データセンター
  • 自律輸送
  • 人工知能
  • 先進軍事エレクトロニクス

第14章 銅およびファイバー市場の推計・予測

第15章 主な調査結果と結論

目次
Product Code: P-675-20

Report Summary:

  • What technical and economic factors may be changing the copper vs. fiber selection process? What may be the practical bandwidth limit of a copper interface? What are the primary advantages of fiber optic communication links?
  • In what applications do mid-board optical transceivers make sense? What is driving interest in "jump-over" cable technology? What advantages do co-packaged optics bring to system design? Are co-packaged optics an interim step toward optical computing?
  • What are the distance limitations (reach) of high-speed copper channels? How is the performance of high-speed copper interconnects quantified? Are there any new technologies that will significantly improve the performance of copper cable assemblies?
  • What standard writing organizations are actively developing the specifications that define the performance of high-speed copper and fiber optic links?
  • What applications will continue to drive exponential demand for data center capacity and speed? Are active optical cables a long-term solution or a transitional tool between copper and fiber networks? How does thermal management issues impact I/O connector selection?
  • What is the current market for medium to short-length high-speed copper cable assemblies? What is the five-year world forecast by region for these assemblies? What is the current market and five-year world forecast for high-speed fiber optic interconnects?

Bishop & Associates research report, ‘High-Speed Copper & Fiber Optic Connectors ’ explores these issues and others. This report offers a snapshot of fiber optic and high-speed copper connector technology and markets as it exists in the fall of 2020, and defines what may be the first steps of a major evolutionary change in the market for this class of interfaces. Be prepared for this change. Order your copy of ‘High-Speed Copper & Fiber Optic Connectors ’.

Additional Details :

‘High-Speed Copper & Fiber Optic Connectors ’, reviews how high-speed copper and fiber optic connectors are continuing to evolve to support the ever-increasing demand for higher bandwidth, signal integrity, increased panel density, and reduced power. Current, state of the art copper printed circuit board interfaces continue to exceed perceived performance limitations through a combination of fine tuning of the internal signal path, optimized PCB launch, advanced signal conditioning, and adoption of PAM4 modulation. High-performance shielded differential pair cables can significantly increase the reach of high-speed signals.

Design engineers are beginning to find applications that require performance beyond the practical limits of copper. In addition to inherent bandwidth size and weight advantages, newer fiber optic connectors are becoming smaller, easier to terminate, less susceptible to contamination and capable of terminating many single mode fibers simultaneously. In the past, fiber was limited to long-reach applications that were measured in kilometers. Advanced optical signaling technology including coherent signaling can greatly increase the data capacity of a single fiber. Today, fiber links are being considered for rack-to-rack, server to top of rack, and even select inside the box applications. Attenuation and signal degradation attributed to PCB laminates is stimulating the growth of both copper and fiber optic links that lift high-speed signals out of the board entirely.

This report focuses primarily on telecom and computing applications with some additional discussion in related consumer and military/aerospace applications. The basic characteristics of high-speed copper and fiber optic connectors are reviewed, as well as advanced silicon photonic transceiver technology. Also discussed are high-speed copper cable assemblies both passive and those with active equalization features, which enable greater bandwidth and length.

Additional chapters discuss the evolution of small form factor pluggable interfaces that provide options for both copper and fiber links. The advantages and typical applications of active optical cables are also reviewed.

One chapter is focused on the role of formal and industry sponsored standards that facilitate the implementation and certification of both copper and fiber optic links.

Another chapter identifies a series of applications that are driving the development of high-speed communications and represent long-term growth for both copper and fiber optic connectors.

The report also reviews the many alternative wireless technologies that are available to address high-speed link applications. Emerging millimeter band communication including 5G are reviewed.

Mid-board optical transceivers and co-packaged optics are emerging technologies that provide packaging solutions for high-performance circuits. Both topics are discussed along with their potential long-term impact on system design.

Table of Contents

Chapter 1 - Report Scope and Methodology

  • Report Objectives
  • Report Issues Explored
  • Methodology and Approach

Chapter 2 - Executive Summary

  • Global Average IP Taffic Per Device

Chapter 3 - Introduction

  • Introduction
  • Copper Interconnect Technology
  • Optical Interconnect Technology
  • Basic Principals of Optical Transmission
  • Optical Fiber Types
  • Fiber Types and Typical Specifications
  • Fiber Optic Connector Loss Characteristics
  • Optical Connector Types
  • Copper Connector Termination Process
  • Optic Connector Termination Process

Chapter 4 - Evolution of High-Speed Copper Interconnects

  • Extending the Bandwidth of Copper
  • Advanced Signal Conditioning
  • High-Speed Signal Measurement and Verification
  • Advanced Signal Modulation Techniques
  • Evolving High Performance Connector Trends

Chapter 5 - Evolution of Fiber Optic Connectors

  • Fiber Optic Connector Basics
  • Single Fiber Connectors
  • Multi-Fiber Connectors
  • Fiber Optic Adapters, Special Purpose Interfaces
  • Optical Backplane Connectors
  • Ruggidized Optical Connectors

Chapter 6 - Small Form Factor Pluggable Transceivers

  • Why Pluggables?
  • Thermal Management

Chapter 7 - Active Optical Cables

  • Filling the Gap
  • AOC Construction/Features
  • AOC Applications
  • Representative AOC Manufacturers and Products

Chapter 8 - The Case for Optical Components Inside the Box

  • Hitting the Limits of Copper
  • Copper Jump-Over Cable Assemblies
  • Optical On-Board Mounted Transceivers and Cable Assemblies
  • Benefits and Tradeoffs of On-board Optics

Chapter 9 - Optic Interconnect Industry Standards

  • Evolving Standards
  • FOCIS Standards
  • TIA / EIA / IEC Standards
  • SONET
  • Ethernet
  • OIF Implementation Agreements
  • COBO

Chapter 10 - Making the Copper or Fiber Decision

  • Factors and Choices
  • Balancing Feature and Requirements

Chapter 11 - Advanced Copper and Optical Fiber Technology

  • Advanced Copper Transmission Technology
  • Advanced Fiber Optic Transmission Technology
  • Silicon Photonics
  • Co-Packaged Optics

Chapter 12 - Alternative Technologies

  • Wireless Transmission
  • Low-Power/Short Range RF Data Links
  • Cellular Telephony
  • Wi-Fi
  • Millimeter Wave Interconnect Technology
  • Plastic mm Waveguide

Chapter 13 - Emerging Copper and Fiber Applications

  • Introduction
  • 5G Cellular Communications
  • Internet of Things (IoT)/Industrial Internet of Things (Industry 4.0)
  • Hyperscale Data Centers/Cloud Computing/Disaggregated Data Centers
  • Autonomous Transportation
  • Artificial Intelligence
  • Advanced Military Electronics

Chapter 14 - Copper and Fiber Market Estimates and Forecast

  • Introduction
  • World Fiber Optic Cable Terminated Connector Market by Region 2019-2020
  • World Fiber Optic Cable Terminated Connector Market by Region 2020-2021
  • World High-Speed Copper Cable Terminated Connector Market by Region 2019-2020
  • World High-Speed Copper Cable Terminated Connector Market by Region 2020-2021
  • World Fiber Optic Cable Terminated Connector Market, Telecom/Datacom Applications by Region 2019-2020
  • World Fiber Optic Cable Terminated Connector Market, Telecom/Datacom Applications by Region 2020-2021
  • World High-Speed Copper Cable Terminated Connector Market, Telecom/Datacom Applications by Region 2019-2020
  • World High-Speed Copper Cable Terminated Connector Market, Telecom/Datacom Applications by Region 2020-2021
  • World Fiber Optic Cable Terminated Connector Market, Computing Applications by Region 2019-2020
  • World Fiber Optic Cable Terminated Connector Market, Computing Applications by Region 2020-2021
  • World High-Speed Copper Cable Terminated Connector Market, Computing Applications by Region 2019-2020
  • World High-Speed Copper Cable Terminated Connector Market, Computing Applications by Region 2020-2021
  • World Fiber Optic Cable Assembly Market, Telecom/Datacom Applications by Region 2019-2020F
  • World Fiber Optic Cable Assembly Market, Telecom/Datacom Applications by Region 2020F-2021F
  • World High-Speed Copper Cable Assembly Market, Telecom/Datacom Applications by Region 2019-2020F
  • World High-Speed Copper Cable Assembly Market, Telecom/Datacom Applications by Region 2020F-2021F
  • World Fiber Optic Cable Assembly Market, Computing Applications by Region 2019-2020F
  • World Fiber Optic Cable Assembly Market, Computing Applications by Region 2020F-2021F
  • World High-Speed Copper Cable Assembly Market, Computing Applications by Region 2019-2020F
  • World High-Speed Copper Cable Assembly Market, Computing Applications by Region 2020F-2021F
  • World Fiber Optic Connector Forecast, Telecom/Datacom Applications by Region 2020F-2025F
  • World High-Speed Copper Connector Forecast, Telecom/Datacom Applications by Region 2020F-2025F
  • World Fiber Optic Connector Forecast, Computing Applications by Region 2020F-2025F
  • World High-Speed Copper Connector Forecast, Computing Applications by Region 2020F-2025F
  • World Fiber Optic Cable Assembly Forecast, Telecom/Datacom Applications by Region 2020F-202F
  • World Fiber Optic Cable Assembly Forecast, Computing Applications by Region 2020F-2025F
  • World High-Speed Copper Cable Assembly Forecast, Telecom/Datacom Applications by Region 2020F-2025F
  • World High-Speed Copper Cable Assembly Forecast, Computing Applications by Region 2020F-2025F

Chapter 15 - Major Findings and Conclusions

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